Cypress CY7C1470V33, CY7C1472V33 Capacitance15, Thermal Resistance, AC Test Loads and Waveforms

CY7C1470V33

CY7C1472V33

CY7C1474V33

Capacitance[15]

Parameter	Description	Test Conditions	100 TQFP	165 FBGA	209 FBGA	Unit
			Max.	Max.	Max.
CADDRESS	Address Input Capacitance	TA = 25°C, f = 1 MHz,	6	6	6	pF
		VDD = 3.3V
CDATA	Data Input Capacitance		5	5	5	pF
		VDDQ = 2.5V
CCTRL	Control Input Capacitance		8	8	8	pF
CCLK	Clock Input Capacitance		6	6	6	pF
CI/O	Input/Output Capacitance		5	5	5	pF
Thermal Resistance[15]

Parameters	Description	Test Conditions	100 TQFP	165 FBGA	209 FBGA	Unit
			Package	Package	Package
ΘJA	Thermal Resistance	Test conditions follow standard	24.63	16.3	15.2	°C/W
	(Junction to Ambient)	test methods and procedures for
		measuring thermal impedance,
ΘJC	Thermal Resistance		2.28	2.1	1.7	°C/W
		per EIA/JESD51.
	(Junction to Case)
AC Test Loads and Waveforms
3.3V I/O Test Load

OUTPUT			3.3V		R = 317Ω
	Z0	= 50Ω	OUTPUT
			RL = 50Ω	5 pF		R = 351Ω

VL = 1.5V

					INCLUDING
				(a)	JIG AND			(b)
						SCOPE
2.5V I/O Test Load
OUTPUT					2.5V			R = 1667Ω
	Z0 = 50Ω				OUTPUT
					RL = 50Ω
						5 pF			R = 1538Ω
			VL = 1.25V
					INCLUDING
		(a)			JIG AND		(b)
					SCOPE

Note:

15. Tested initially and after any design or process changes that may affect these parameters.

VDDQ	ALL INPUT PULSES
			90%
10%		90%		10%
GND				≤ 1 ns
≤ 1 ns

(c)

VDDQ	ALL INPUT PULSES
			90%
10%		90%		10%
GND				≤ 1 ns
≤ 1 ns

(c)

Document #: 38-05289 Rev. *I Page 19 of 29

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