Cypress manual Features, Functional Description, Logic Block Diagram-CY7C1470V33 2M x

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CY7C1470V33

CY7C1472V33

CY7C1474V33

72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL™ Architecture

Features

Pin-compatible and functionally equivalent to ZBT™

Supports 250-MHz bus operations with zero wait states

Available speed grades are 250, 200 and 167 MHz

Internally self-timed output buffer control to eliminate the need to use asynchronous OE

Fully registered (inputs and outputs) for pipelined operation

Byte Write capability

Single 3.3V power supply

3.3V/2.5V I/O power supply

Fast clock-to-output time

3.0 ns (for 250-MHz device)

Clock Enable (CEN) pin to suspend operation

Synchronous self-timed writes

CY7C1470V33, CY7C1472V33 available in JEDEC-standard lead-free 100-pin TQFP, lead-free and non-lead-free 165-ball FBGA package. CY7C1474V33 available in lead-free and non-lead-free 209 ball FBGA package

IEEE 1149.1 JTAG Boundary Scan compatible

Burst capability—linear or interleaved burst order

“ZZ” Sleep Mode option and Stop Clock option

Functional Description

The CY7C1470V33, CY7C1472V33, and CY7C1474V33 are 3.3V, 2M x 36/4M x 18/1M x 72 Synchronous pipelined burst SRAMs with No Bus Latency™ (NoBL™) logic, respectively. They are designed to support unlimited true back-to-back Read/Write operations with no wait states. The CY7C1470V33, CY7C1472V33, and CY7C1474V33 are equipped with the advanced (NoBL) logic required to enable consecutive Read/Write operations with data being trans- ferred on every clock cycle. This feature dramatically improves the throughput of data in systems that require frequent Write/Read transitions. The CY7C1470V33, CY7C1472V33, and CY7C1474V33 are pin compatible and functionally equiv- alent to ZBT devices.

All synchronous inputs pass through input registers controlled by the rising edge of the clock. All data outputs pass through output registers controlled by the rising edge of the clock. The clock input is qualified by the Clock Enable (CEN) signal, which when deasserted suspends operation and extends the previous clock cycle.

Write operations are controlled by the Byte Write Selects (BWa–BWhfor CY7C1474V33, BWa–BWdfor CY7C1470V33 and BWa–BWbfor CY7C1472V33) and a Write Enable (WE) input. All writes are conducted with on-chip synchronous self-timed write circuitry.

Three synchronous Chip Enables (CE1, CE2, CE3) and an asynchronous Output Enable (OE) provide for easy bank selection and output tri-state control. In order to avoid bus contention, the output drivers are synchronously tri-stated during the data portion of a write sequence.

Logic Block Diagram-CY7C1470V33 (2M x 36)

 

 

 

 

 

 

 

 

A0, A1, A

ADDRESS

 

 

 

 

 

 

 

 

 

 

 

REGISTER 0

A1

D1

Q1

A1'

 

 

 

 

 

 

MODE

 

A0

D0 BURST Q0 A0'

 

 

 

 

 

 

 

ADV/LD

 

LOGIC

 

 

 

 

 

 

CLK

C

 

 

 

 

 

 

 

 

 

 

C

 

 

 

 

 

 

 

 

CEN

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

WRITE ADDRESS

WRITE ADDRESS

 

 

 

 

 

 

 

 

 

REGISTER 1

REGISTER 2

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

S

O

 

O

 

 

 

 

 

 

 

 

U

D

 

 

 

 

 

 

 

 

E

T

U

 

 

 

 

 

 

 

 

P

A

T

 

 

 

 

 

 

 

 

N

 

 

 

 

 

 

 

 

U

T

P

 

ADV/LD

 

 

 

 

 

 

S

T

A

U

 

 

 

 

 

 

 

R

T

 

 

 

WRITE REGISTRY

 

 

 

MEMORY

E

S

B

 

BWa

 

AND DATA COHERENCY

 

 

WRITE

 

E

 

 

 

 

ARRAY

 

 

BWb

 

CONTROL LOGIC

 

 

DRIVERS

A

G

T

U

 

 

 

 

 

 

I

F

 

BWc

 

 

 

 

 

 

M

S

E

 

 

 

 

 

 

 

F

 

BWd

 

 

 

 

 

 

P

E

E

E

 

 

 

 

 

 

 

 

T

R

R

 

WE

 

 

 

 

 

 

S

R

 

 

 

 

 

 

 

 

 

S

I

S

 

 

 

 

 

 

 

 

 

E

N

E

 

 

 

 

 

 

 

 

 

 

G

 

 

 

 

 

 

 

 

INPUT

E

 

INPUT

E

 

 

 

 

 

 

 

REGISTER 1

 

REGISTER 0

 

OE

READ LOGIC

 

 

 

 

 

 

 

 

 

CE1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CE2

 

 

 

 

 

 

 

 

 

 

 

CE3

 

 

 

 

 

 

 

 

 

 

 

ZZ

SLEEP

 

 

 

 

 

 

 

 

 

CONTROL

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

DQs DQPa DQPb DQPc DQPd

Cypress Semiconductor Corporation

198 Champion Court • San Jose, CA 95134-1709

408-943-2600

Document #: 38-05289 Rev. *I

 

Revised June 20, 2006

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Contents Logic Block Diagram-CY7C1470V33 2M x FeaturesFunctional Description Cypress Semiconductor CorporationMaximum Access Time Maximum Operating Current Logic Block Diagram-CY7C1472V33 4M x250 MHz 200 MHz 167 MHz Unit Maximum Cmos Standby Current4M x Pin Configurations Pin Tqfp PackagesCY7C1472V33 4M x BWS Pin Name Type Pin Description Pin DefinitionsByte Write Select Inputs, active LOW. Qualified with Functional Overview Linear Burst Address Table Mode = GND Interleaved Burst Address Table Mode = Floating or VDDZZ Mode Electrical Characteristics Operation Address Used Function CY7C1470V33 BW d BW c BW b BW a Partial Write Cycle Description1, 2, 3Function CY7C1472V33 Function CY7C1474V33Ieee 1149.1 Serial Boundary Scan Jtag TAP Controller Block Diagram TAP Controller State DiagramTAP Instruction Set Instruction RegisterTAP Timing TAP AC Switching Characteristics Over the Operating Range9Parameter Description Min Max Unit Clock Output Times5V TAP AC Test Conditions 3V TAP AC Test ConditionsScan Register Sizes Identification Register DefinitionsIdentification Codes Boundary Scan Exit Order 4M x Boundary Scan Exit Order 2M xBit # Ball ID A11 Boundary Scan Exit Order 1M xJ10 W10Maximum Ratings Electrical Characteristics Over the Operating Range13Operating Range Ambient RangeThermal Resistance Capacitance15AC Test Loads and Waveforms 250 200 167 Parameter Description Unit Min Max Switching Characteristics Over the Operating Range 16Set-up Times Read/Write/Timing22, 23 Switching WaveformsCEN Address A1 A2NOP, Stall and Deselect Cycles22, 23 ZZ Mode Timing26Ordering Information 250 Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mm Package DiagramsBall Fbga 15 x 17 x 1.4 mm Ball Fbga 14 x 22 x 1.76 mm Document History ECN No Issue Date Orig. Description of ChangeVKN RXU