Cypress CY7C1474V33 manual Switching Characteristics Over the Operating Range 16, Set-up Times

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CY7C1470V33

CY7C1472V33

CY7C1474V33

Switching Characteristics Over the Operating Range [16, 17]

 

 

 

 

 

 

 

 

 

 

–250

–200

–167

 

Parameter

 

 

 

 

 

 

 

 

Description

 

 

 

 

 

 

Unit

 

 

 

 

 

 

 

 

Min.

Max.

Min.

Max.

Min.

Max.

 

 

 

 

 

 

 

 

 

 

tPower[18]

 

VCC (typical) to the First Access Read or Write

1

 

1

 

1

 

ms

Clock

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tCYC

 

Clock Cycle Time

4.0

 

5.0

 

6.0

 

ns

FMAX

 

Maximum Operating Frequency

 

250

 

200

 

167

MHz

tCH

 

Clock HIGH

2.0

 

2.0

 

2.2

 

ns

tCL

 

Clock LOW

2.0

 

2.0

 

2.2

 

ns

Output Times

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tCO

 

Data Output Valid After CLK Rise

 

3.0

 

3.0

 

3.4

ns

tOEV

 

 

 

LOW to Output Valid

 

3.0

 

3.0

 

3.4

ns

OE

 

 

tDOH

 

Data Output Hold After CLK Rise

1.3

 

1.3

 

1.5

 

ns

tCHZ

 

Clock to High-Z[19, 20, 21]

 

3.0

 

3.0

 

3.4

ns

tCLZ

 

Clock to Low-Z[19, 20, 21]

1.3

 

1.3

 

1.5

 

ns

tEOHZ

 

 

 

HIGH to Output High-Z[19, 20, 21]

 

3.0

 

3.0

 

3.4

ns

OE

 

 

tEOLZ

 

 

 

LOW to Output Low-Z[19, 20, 21]

0

 

0

 

0

 

ns

OE

 

 

Set-up Times

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tAS

 

Address Set-up Before CLK Rise

1.4

 

1.4

 

1.5

 

ns

tDS

 

Data Input Set-up Before CLK Rise

1.4

 

1.4

 

1.5

 

ns

tCENS

 

 

 

 

 

 

Set-up Before CLK Rise

1.4

 

1.4

 

1.5

 

ns

CEN

 

 

tWES

 

 

 

 

 

 

 

x Set-up Before CLK Rise

1.4

 

1.4

 

1.5

 

ns

WE,

BW

 

 

tALS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ADV/LD

Set-up Before CLK Rise

1.4

 

1.4

 

1.5

 

ns

tCES

 

Chip Select Set-up

1.4

 

1.4

 

1.5

 

ns

Hold Times

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tAH

 

Address Hold After CLK Rise

0.4

 

0.4

 

0.5

 

ns

tDH

 

Data Input Hold After CLK Rise

0.4

 

0.4

 

0.5

 

ns

tCENH

 

 

 

 

Hold After CLK Rise

0.4

 

0.4

 

0.5

 

ns

CEN

 

 

tWEH

 

 

 

 

 

 

 

x Hold After CLK Rise

0.4

 

0.4

 

0.5

 

ns

WE,

BW

 

 

tALH

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ADV/LD

Hold after CLK Rise

0.4

 

0.4

 

0.5

 

ns

tCEH

 

Chip Select Hold After CLK Rise

0.4

 

0.4

 

0.5

 

ns

Notes:

16.Timing reference is 1.5V when VDDQ = 3.3V and is 1.25V when VDDQ = 2.5V.

17.Test conditions shown in (a) of AC Test Loads unless otherwise noted.

18.This part has a voltage regulator internally; tpower is the time power needs to be supplied above VDD minimum initially, before a Read or Write operation can be initiated.

19.tCHZ, tCLZ, tEOLZ, and tEOHZ are specified with AC test conditions shown in (b) of AC Test Loads. Transition is measured ± 200 mV from steady-state voltage.

20.At any given voltage and temperature, tEOHZ is less than tEOLZ and tCHZ is less than tCLZ to eliminate bus contention between SRAMs when sharing the same data bus. These specifications do not imply a bus contention condition, but reflect parameters guaranteed over worst case user conditions. Device is designed to achieve High-Z prior to Low-Z under the same system conditions.

21.This parameter is sampled and not 100% tested.

Document #: 38-05289 Rev. *I

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Contents Features Logic Block Diagram-CY7C1470V33 2M xFunctional Description Cypress Semiconductor CorporationLogic Block Diagram-CY7C1472V33 4M x Maximum Access Time Maximum Operating Current250 MHz 200 MHz 167 MHz Unit Maximum Cmos Standby CurrentPin Configurations Pin Tqfp Packages 4M xCY7C1472V33 4M x BWS Byte Write Select Inputs, active LOW. Qualified with Pin DefinitionsPin Name Type Pin Description Functional Overview ZZ Mode Electrical Characteristics Interleaved Burst Address Table Mode = Floating or VDDLinear Burst Address Table Mode = GND Operation Address Used Partial Write Cycle Description1, 2, 3 Function CY7C1470V33 BW d BW c BW b BW aFunction CY7C1472V33 Function CY7C1474V33TAP Controller Block Diagram TAP Controller State Diagram Ieee 1149.1 Serial Boundary Scan JtagInstruction Register TAP Instruction SetTAP AC Switching Characteristics Over the Operating Range9 TAP TimingParameter Description Min Max Unit Clock Output Times3V TAP AC Test Conditions 5V TAP AC Test ConditionsIdentification Codes Identification Register DefinitionsScan Register Sizes Bit # Ball ID Boundary Scan Exit Order 2M xBoundary Scan Exit Order 4M x Boundary Scan Exit Order 1M x A11J10 W10Electrical Characteristics Over the Operating Range13 Maximum RatingsOperating Range Ambient RangeAC Test Loads and Waveforms Capacitance15Thermal Resistance Set-up Times Switching Characteristics Over the Operating Range 16250 200 167 Parameter Description Unit Min Max Switching Waveforms Read/Write/Timing22, 23CEN Address A1 A2ZZ Mode Timing26 NOP, Stall and Deselect Cycles22, 23Ordering Information 250 Package Diagrams Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mmBall Fbga 15 x 17 x 1.4 mm Ball Fbga 14 x 22 x 1.76 mm ECN No Issue Date Orig. Description of Change Document HistoryRXU VKN