Cypress CY7C1474V33, CY7C1472V33 manual Interleaved Burst Address Table Mode = Floating or VDD

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CY7C1470V33

CY7C1472V33

CY7C1474V33

On the next clock rise the data presented to DQ and DQP

(DQa,b,c,d,e,f,g,h/DQPa,b,c,d,e,f,g,h for CY7C1474V33, DQa,b,c,d/DQPa,b,c,d for CY7C1470V33 & DQa,b/DQPa,b for CY7C1472V33) (or a subset for byte write operations, see Write Cycle Description table for details) inputs is latched into the device and the write is complete.

The data written during the Write operation is controlled by BW (BWa,b,c,d,e,f,g,h for CY7C1474V33, BWa,b,c,d for CY7C1470V33 and BWa,b for CY7C1472V33) signals. The CY7C1470V33, CY7C1472V33, and CY7C1474V33 provides Byte Write capability that is described in the Write Cycle Description table. Asserting the Write Enable input (WE) with the selected Byte Write Select (BW) input will selectively write to only the desired bytes. Bytes not selected during a Byte Write operation will remain unaltered. A synchronous self-timed Write mechanism has been provided to simplify the Write operations. Byte Write capability has been included in order to greatly simplify Read/Modify/Write sequences, which can be reduced to simple Byte Write operations.

Because the CY7C1470V33, CY7C1472V33, and CY7C1474V33 are common I/O devices, data should not be driven into the device while the outputs are active. The Output Enable (OE) can be deasserted HIGH before presenting data to the DQ and DQP (DQa,b,c,d,e,f,g,h/DQPa,b,c,d,e,f,g,h for CY7C1474V33, DQa,b,c,d/DQPa,b,c,d for CY7C1470V33 and DQa,b/DQPa,b for CY7C1472V33) inputs. Doing so will tri-state the output drivers. As a safety precaution, DQ and DQP

(DQa,b,c,d,e,f,g,h/DQPa,b,c,d,e,f,g,h for CY7C1474V33, DQa,b,c,d/DQPa,b,c,d for CY7C1470V33 and DQa,b/DQPa,b for CY7C1472V33) are automatically tri-stated during the data portion of a Write cycle, regardless of the state of OE.

Burst Write Accesses

The CY7C1470V33, CY7C1472V33, and CY7C1474V33 has an on-chip burst counter that allows the user the ability to supply a single address and conduct up to four Write opera- tions without reasserting the address inputs. ADV/LD must be driven LOW in order to load the initial address, as described in the Single Write Access section above. When ADV/LD is driven HIGH on the subsequent clock rise, the Chip Enables (CE1, CE2, and CE3) and WE inputs are ignored and the burst counter is incremented. The correct BW (BWa,b,c,d,e,f,g,h for

CY7C1474V33, BWa,b,c,d for CY7C1470V33 and BWa,b for CY7C1472V33) inputs must be driven in each cycle of the burst write in order to write the correct bytes of data.

Sleep Mode

The ZZ input pin is an asynchronous input. Asserting ZZ places the SRAM in a power conservation “sleep” mode. Two clock cycles are required to enter into or exit from this “sleep” mode. While in this mode, data integrity is guaranteed. Accesses pending when entering the “sleep” mode are not considered valid nor is the completion of the operation guaranteed. The device must be deselected prior to entering the “sleep” mode. CE1, CE2, and CE3, must remain inactive for the duration of tZZREC after the ZZ input returns LOW.

Interleaved Burst Address Table (MODE = Floating or VDD)

First

Second

Third

Fourth

Address

Address

Address

Address

 

 

 

 

A1,A0

A1,A0

A1,A0

A1,A0

 

 

 

 

00

01

10

11

 

 

 

 

01

00

11

10

 

 

 

 

10

11

00

01

 

 

 

 

11

10

01

00

 

 

 

 

Linear Burst Address Table (MODE = GND)

First

Second

Third

Fourth

Address

Address

Address

Address

 

 

 

 

A1,A0

A1,A0

A1,A0

A1,A0

 

 

 

 

00

01

10

11

 

 

 

 

01

10

11

00

 

 

 

 

10

11

00

01

 

 

 

 

11

00

01

10

 

 

 

 

ZZ Mode Electrical Characteristics

Parameter

Description

Test Conditions

Min.

Max

Unit

IDDZZ

Sleep mode standby current

ZZ > VDD 0.2V

 

120

mA

tZZS

Device operation to ZZ

ZZ > VDD 0.2V

 

2tCYC

ns

tZZREC

ZZ recovery time

ZZ < 0.2V

2tCYC

 

ns

tZZI

ZZ active to sleep current

This parameter is sampled

 

2tCYC

ns

tRZZI

ZZ Inactive to exit sleep current

This parameter is sampled

0

 

ns

Document #: 38-05289 Rev. *I

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Contents Features Logic Block Diagram-CY7C1470V33 2M xFunctional Description Cypress Semiconductor CorporationLogic Block Diagram-CY7C1472V33 4M x Maximum Access Time Maximum Operating Current250 MHz 200 MHz 167 MHz Unit Maximum Cmos Standby CurrentPin Configurations Pin Tqfp Packages 4M xCY7C1472V33 4M x BWS Byte Write Select Inputs, active LOW. Qualified with Pin DefinitionsPin Name Type Pin Description Functional Overview ZZ Mode Electrical Characteristics Interleaved Burst Address Table Mode = Floating or VDDLinear Burst Address Table Mode = GND Operation Address Used Partial Write Cycle Description1, 2, 3 Function CY7C1470V33 BW d BW c BW b BW aFunction CY7C1472V33 Function CY7C1474V33TAP Controller Block Diagram TAP Controller State Diagram Ieee 1149.1 Serial Boundary Scan JtagInstruction Register TAP Instruction SetTAP AC Switching Characteristics Over the Operating Range9 TAP TimingParameter Description Min Max Unit Clock Output Times3V TAP AC Test Conditions 5V TAP AC Test ConditionsIdentification Codes Identification Register DefinitionsScan Register Sizes Bit # Ball ID Boundary Scan Exit Order 2M xBoundary Scan Exit Order 4M x Boundary Scan Exit Order 1M x A11J10 W10Electrical Characteristics Over the Operating Range13 Maximum RatingsOperating Range Ambient RangeAC Test Loads and Waveforms Capacitance15Thermal Resistance Set-up Times Switching Characteristics Over the Operating Range 16250 200 167 Parameter Description Unit Min Max Switching Waveforms Read/Write/Timing22, 23CEN Address A1 A2ZZ Mode Timing26 NOP, Stall and Deselect Cycles22, 23Ordering Information 250 Package Diagrams Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mmBall Fbga 15 x 17 x 1.4 mm Ball Fbga 14 x 22 x 1.76 mm ECN No Issue Date Orig. Description of Change Document HistoryRXU VKN