Cypress CY7C2561KV18 Depth Expansion, Programmable Impedance, Echo Clocks, On-Die Termination ODT

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PRELIMINARY

CY7C2561KV18, CY7C2576KV18

 

 

CY7C2563KV18, CY7C2565KV18

 

 

 

 

 

 

 

 

Read access and write access must be scheduled such that one transaction is initiated on any clock cycle. If both ports are selected on the same K clock rise, the arbitration depends on the previous state of the SRAM. If both ports are deselected, the read port takes priority. If a read was initiated on the previous cycle, the write port takes priority (as read operations can not be initiated on consecutive cycles). If a write was initiated on the previous cycle, the read port takes priority (as write operations can not be initiated on consecutive cycles). Therefore, asserting both port selects active from a deselected state results in alter- nating read or write operations being initiated, with the first access being a read.

Depth Expansion

The CY7C2563KV18 has a port select input for each port. This enables for easy depth expansion. Both port selects are sampled on the rising edge of the positive input clock only (K). Each port select input can deselect the specified port. Deselecting a port does not affect the other port. All pending transactions (read and write) are completed before the device is deselected.

Programmable Impedance

An external resistor, RQ, must be connected between the ZQ pin on the SRAM and VSS to allow the SRAM to adjust its output driver impedance. The value of RQ must be 5X the value of the intended line impedance driven by the SRAM, the allowable range of RQ to guarantee impedance matching with a tolerance of ±15% is between 175Ω and 350Ω, with VDDQ = 1.5V. The output impedance is adjusted every 1024 cycles upon power up to account for drifts in supply voltage and temperature.

Echo Clocks

Echo clocks are provided on the QDR-II+ to simplify data capture on high-speed systems. Two echo clocks are generated by the QDR-II+. CQ is referenced with respect to K and CQ is refer- enced with respect to K. These are free-running clocks and are synchronized to the input clock of the QDR-II+. The timing for the echo clocks is shown in the Switching Characteristics on page 24.

Valid Data Indicator (QVLD)

QVLD is provided on the QDR-II+ to simplify data capture on high speed systems. The QVLD is generated by the QDR-II+ device along with data output. This signal is also edge-aligned with the echo clock and follows the timing of any data pin. This signal is asserted half a cycle before valid data arrives.

On-Die Termination (ODT)

These devices have an On-Die Termination feature for Data inputs (D[x:0]), Byte Write Selects (BWS[x:0]), and Input Clocks (K and K). The termination resistors are integrated within the chip. The ODT range selection is enabled through ball R6 (ODT pin). The ODT termination tracks value of RQ where RQ is the resistor tied to the ZQ pin. ODT range selection is made during power up initialization. A LOW on this pin selects a low range that follows RQ/3.33 for 175Ω < RQ < 350Ω (where RQ is the resistor tied to ZQ pin). A HIGH on this pin selects a high range that follows RQ/1.66 for 175Ω < RQ < 250Ω (where RQ is the resistor tied to ZQ pin). When left floating, a high range termination value is selected by default. For a detailed description on the ODT imple- mentation, refer to the application note, On-Die Termination for QDRII+/DDRII+ SRAMs.

PLL

These chips use a PLL that is designed to function between 120 MHz and the specified maximum clock frequency. During power up, when the DOFF is tied HIGH, the PLL is locked after 20 μs of stable clock. The PLL can also be reset by slowing or stopping the input clocks K and K for a minimum of 30 ns. However, it is not necessary to reset the PLL to lock to the desired frequency. The PLL automatically locks 20 μs after a stable clock is presented. The PLL may be disabled by applying ground to the DOFF pin. When the PLL is turned off, the device behaves in QDR-I mode (with one cycle latency and a longer access time). For information, refer to the application note, PLL Considerations in QDRII/DDRII/QDRII+/DDRII+.

Document Number: 001-15887 Rev. *E

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Contents Features Configurations Functional DescriptionCypress Semiconductor Corporation 198 Champion Court Logic Block Diagram CY7C2561KV18 Logic Block Diagram CY7C2576KV18Doff Logic Block Diagram CY7C2565KV18 Logic Block Diagram CY7C2563KV18Pin Configuration CY7C2561KV18 8M xCY7C2576KV18 8M x CY7C2563KV18 4M x WPS BWSCY7C2565KV18 2M x Pin Definitions Pin Name Pin Description Power Supply Inputs for the Outputs of the Device Power Supply Inputs to the Core of the DeviceTDO for Jtag TCK Pin for JtagRead Operations Functional OverviewWrite Operations Byte Write OperationsDepth Expansion Valid Data Indicator QvldProgrammable Impedance Echo ClocksApplication Example Truth TableOperation Comments Write Cycle DescriptionsRemains unaltered During the data portion of a write sequenceDevice Write cycle description table for CY7C2565KV18 followsInto the device. D359 remains unaltered Device. D80 and D3518 remains unalteredIeee 1149.1 Serial Boundary Scan Jtag Idcode State diagram for the TAP controller follows TAP Controller State DiagramTAP Controller TAP Electrical CharacteristicsParameter Description Test Conditions Min Max Unit GND ≤ VI ≤ VDDTAP Timing and Test Conditions TAP AC Switching CharacteristicsInstruction Codes Description Scan Register Sizes Register Name Bit SizeBoundary Scan Order Bit # Bump ID Power Up Sequence Power Up Sequence in QDR-II+ SramPLL Constraints VDD / VddqDC Electrical Characteristics Electrical CharacteristicsMaximum Ratings Operating RangeCapacitance AC Electrical CharacteristicsThermal Resistance Parameter Description Test Conditions Max UnitIncluding JIG Scope AC Test Loads and WaveformsParameter Min Max Switching CharacteristicsHigh LOWRead/Write/Deselect Sequence 32, 33 Switching WaveformsOrdering Information 450 Ball Fbga 13 x 15 x 1.4 mm Package DiagramSales, Solutions, and Legal Information Worldwide Sales and Design Support Products PSoC SolutionsDocument History