Cypress CY7C2576KV18, CY7C2563KV18, CY7C2561KV18, CY7C2565KV18 manual Idcode

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PRELIMINARY

CY7C2561KV18, CY7C2576KV18

 

 

CY7C2563KV18, CY7C2565KV18

 

 

 

 

 

 

 

 

IDCODE

The IDCODE instruction loads a vendor-specific, 32-bit code into the instruction register. It also places the instruction register between the TDI and TDO pins and shifts the IDCODE out of the device when the TAP controller enters the Shift-DR state. The IDCODE instruction is loaded into the instruction register at power up or whenever the TAP controller is supplied a Test-Logic-Reset state.

SAMPLE Z

The SAMPLE Z instruction connects the boundary scan register between the TDI and TDO pins when the TAP controller is in a Shift-DR state. The SAMPLE Z command puts the output bus into a High-Z state until the next command is supplied during the Update IR state.

SAMPLE/PRELOAD

SAMPLE/PRELOAD is a 1149.1 mandatory instruction. When the SAMPLE/PRELOAD instructions are loaded into the instruction register and the TAP controller is in the Capture-DR state, a snapshot of data on the input and output pins is captured in the boundary scan register.

The user must be aware that the TAP controller clock can only operate at a frequency up to 20 MHz, while the SRAM clock operates more than an order of magnitude faster. Because there is a large difference in the clock frequencies, it is possible that during the Capture-DR state, an input or output undergoes a transition. The TAP may then try to capture a signal while in transition (metastable state). This does not harm the device, but there is no guarantee as to the value that is captured. Repeatable results may not be possible.

To guarantee that the boundary scan register captures the correct value of a signal, the SRAM signal must be stabilized long enough to meet the TAP controller's capture setup plus hold times (tCS and tCH). The SRAM clock input might not be captured correctly if there is no way in a design to stop (or slow) the clock during a SAMPLE/PRELOAD instruction. If this is an issue, it is still possible to capture all other signals and simply ignore the value of the CK and CK captured in the boundary scan register.

After the data is captured, it is possible to shift out the data by putting the TAP into the Shift-DR state. This places the boundary scan register between the TDI and TDO pins.

PRELOAD places an initial data pattern at the latched parallel outputs of the boundary scan register cells before the selection of another boundary scan test operation.

The shifting of data for the SAMPLE and PRELOAD phases can occur concurrently when required, that is, while the data captured is shifted out, the preloaded data can be shifted in.

BYPASS

When the BYPASS instruction is loaded in the instruction register and the TAP is placed in a Shift-DR state, the bypass register is placed between the TDI and TDO pins. The advantage of the BYPASS instruction is that it shortens the boundary scan path when multiple devices are connected together on a board.

EXTEST

The EXTEST instruction drives the preloaded data out through the system output pins. This instruction also connects the boundary scan register for serial access between the TDI and TDO in the Shift-DR controller state.

EXTEST OUTPUT BUS TRI-STATE

IEEE Standard 1149.1 mandates that the TAP controller be able to put the output bus into a tri-state mode.

The boundary scan register has a special bit located at bit #108. When this scan cell, called the “extest output bus tri-state,” is latched into the preload register during the Update-DR state in the TAP controller, it directly controls the state of the output (Q-bus) pins, when the EXTEST is entered as the current instruction. When HIGH, it enables the output buffers to drive the output bus. When LOW, this bit places the output bus into a High-Z condition.

This bit can be set by entering the SAMPLE/PRELOAD or EXTEST command, and then shifting the desired bit into that cell, during the Shift-DR state. During Update-DR, the value loaded into that shift-register cell latches into the preload register. When the EXTEST instruction is entered, this bit directly controls the output Q-bus pins. Note that this bit is preset HIGH to enable the output when the device is powered up, and also when the TAP controller is in the Test-Logic-Reset state.

Reserved

These instructions are not implemented but are reserved for future use. Do not use these instructions.

Document Number: 001-15887 Rev. *E

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Contents Cypress Semiconductor Corporation 198 Champion Court Features ConfigurationsFunctional Description Doff Logic Block Diagram CY7C2561KV18Logic Block Diagram CY7C2576KV18 Logic Block Diagram CY7C2563KV18 Logic Block Diagram CY7C2565KV18CY7C2576KV18 8M x Pin ConfigurationCY7C2561KV18 8M x CY7C2565KV18 2M x CY7C2563KV18 4M xWPS BWS Pin Definitions Pin Name Pin Description TDO for Jtag Power Supply Inputs to the Core of the DevicePower Supply Inputs for the Outputs of the Device TCK Pin for JtagWrite Operations Functional OverviewRead Operations Byte Write OperationsProgrammable Impedance Valid Data Indicator QvldDepth Expansion Echo ClocksOperation Application ExampleTruth Table Remains unaltered Write Cycle DescriptionsComments During the data portion of a write sequenceInto the device. D359 remains unaltered Write cycle description table for CY7C2565KV18 followsDevice Device. D80 and D3518 remains unalteredIeee 1149.1 Serial Boundary Scan Jtag Idcode TAP Controller State Diagram State diagram for the TAP controller followsParameter Description Test Conditions Min Max Unit TAP Electrical CharacteristicsTAP Controller GND ≤ VI ≤ VDDTAP AC Switching Characteristics TAP Timing and Test ConditionsScan Register Sizes Register Name Bit Size Instruction Codes DescriptionBoundary Scan Order Bit # Bump ID PLL Constraints Power Up Sequence in QDR-II+ SramPower Up Sequence VDD / VddqMaximum Ratings Electrical CharacteristicsDC Electrical Characteristics Operating RangeThermal Resistance AC Electrical CharacteristicsCapacitance Parameter Description Test Conditions Max UnitAC Test Loads and Waveforms Including JIG ScopeHigh Switching CharacteristicsParameter Min Max LOWSwitching Waveforms Read/Write/Deselect Sequence 32, 33Ordering Information 450 Package Diagram Ball Fbga 13 x 15 x 1.4 mmDocument History Sales, Solutions, and Legal InformationWorldwide Sales and Design Support Products PSoC Solutions
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