Cypress CY7C1546V18 manual Features, Functional Description, Configurations, Selection Guide

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CY7C1546V18, CY7C1557V18

CY7C1548V18, CY7C1550V18

72-Mbit DDR-II+ SRAM 2-Word Burst Architecture (2.0 Cycle Read Latency)

Features

72-Mbit density (8M x 8, 8M x 9, 4M x 18, 2M x 36)

375 MHz clock for high bandwidth

2-word burst for reducing address bus frequency

Double Data Rate (DDR) interfaces

(data transferred at 750 MHz) at 375 MHz

Available in 2.0 clock cycle latency

Two input clocks (K and K) for precise DDR timing SRAM uses rising edges only

Echo clocks (CQ and CQ) simplify data capture in high-speed systems

Data valid pin (QVLD) to indicate valid data on the output

Synchronous internally self-timed writes

Core VDD = 1.8V ± 0.1V; IO VDDQ = 1.4V to VDD [1]

HSTL inputs and variable drive HSTL output buffers

Available in 165-Ball FBGA package (15 x 17 x 1.4 mm)

Offered in both Pb-free and non Pb-free packages

JTAG 1149.1 compatible test access port

Delay Lock Loop (DLL) for accurate data placement

Functional Description

The CY7C1546V18, CY7C1557V18, CY7C1548V18, and CY7C1550V18 are 1.8V Synchronous Pipelined SRAM equipped with DDR-II+ architecture. The DDR-II+ consists of an SRAM core with advanced synchronous peripheral circuitry. Addresses for read and write are latched on alternate rising edges of the input (K) clock. Write data is registered on the rising edges of both K and K. Read data is driven on the rising edges of both K and K. Each address location is associated with two 8-bit words (CY7C1546V18), 9-bit words (CY7C1557V18), 18-bit words (CY7C1548V18), or 36-bit words (CY7C1550V18) that burst sequentially into or out of the device.

Asynchronous inputs include an output impedance matching input (ZQ). Synchronous data outputs (Q, sharing the same physical pins as the data inputs, D) are tightly matched to the two output echo clocks CQ/CQ, eliminating the need for separately capturing data from each individual DDR SRAM in the system design.

All synchronous inputs pass through input registers controlled by the K or K input clocks. All data outputs pass through output registers controlled by the K or K input clocks. Writes are conducted with on-chip synchronous self-timed write circuitry.

Configurations

With Read Cycle Latency of 2.0 cycles:

CY7C1546V18 – 8M x 8

CY7C1557V18 – 8M x 9

CY7C1548V18 – 4M x 18

CY7C1550V18 – 2M x 36

Selection Guide

Description

 

375 MHz

333 MHz

300 MHz

Unit

Maximum Operating Frequency

 

375

333

300

MHz

 

 

 

 

 

 

Maximum Operating Current

x8

1300

1200

1100

mA

 

 

 

 

 

 

 

x9

1300

1200

1100

 

 

 

 

 

 

 

 

x18

1300

1200

1100

 

 

 

 

 

 

 

 

x36

1300

1200

1100

 

 

 

 

 

 

 

Note

1.The QDR consortium specification for VDDQ is 1.5V + 0.1V. The Cypress QDR devices exceed the QDR consortium specification and are capable of supporting VDDQ = 1.4V to VDD.

Cypress Semiconductor Corporation • 198 Champion Court

San Jose, CA 95134-1709

408-943-2600

Document Number: 001-06550 Rev. *E

 

Revised March 11, 2008

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Contents Configurations FeaturesFunctional Description Selection GuideLogic Block Diagram CY7C1557V18 Logic Block Diagram CY7C1546V18Logic Block Diagram CY7C1550V18 Logic Block Diagram CY7C1548V18Ball Fbga 15 x 17 x 1.4 mm Pinout Pin ConfigurationCY7C1546V18 8M x CY7C1557V18 8M xCY7C1550V18 2M x CY7C1548V18 4M xPin Name Pin Description Pin DefinitionsBWS BWS2, BWS3 Synchronous Read or Write Input. WhenPower Supply Inputs for the Outputs of the Device Power Supply Inputs to the Core of the DeviceTDO for Jtag TCK Pin for JtagFunctional Overview Application Example Valid Data Indicator QvldEcho Clocks SRAM#1 SRAM#2Operation Write Cycle DescriptionsBWS0 BWS1 CommentsBWS0 BWS1 BWS2 BWS3 BWS0Ieee 1149.1 Serial Boundary Scan Jtag Idcode State diagram for the TAP controller follows TAP Controller State DiagramTAP Electrical Characteristics TAP Controller Block DiagramTDI TCKTAP Timing and Test Conditions TAP AC Switching CharacteristicsScan Register Sizes Identification Register DefinitionsInstruction Codes Register Name Bit SizeBit Number Bump ID Power Up Waveforms Power Up Sequence in DDR-II+ SramPower Up Sequence DLL ConstraintsDC Electrical Characteristics Electrical CharacteristicsMaximum Ratings Range AmbientCapacitance AC Electrical CharacteristicsThermal Resistance Parameter Description Test Conditions Max UnitAC Test Loads and Waveforms AC Test Loads and WaveformsCypress Consortium Description 375 MHz 333 MHz 300 MHz Unit Switching CharacteristicsParameter Min Max DLL TimingRead/Write/Deselect Sequence 29, 30, 31 Switching WaveformsNOP Read NOP WriteOrdering Information 300 Ball Fbga 15 x 17 x 1.4 mm Package DiagramDocument History ECN No Issue Orig. Description of Change DateREV