Texas Instruments TMS320C6727 warranty Orderable Device Status Package Pins Package Eco Plan, Qty

Page 111

PACKAGE OPTION ADDENDUM

www.ti.com

4-May-2009

 

 

PACKAGING INFORMATION

Orderable Device

Status (1)

Package

Package

Pins Package

Eco Plan (2)

Lead/Ball Finish

MSL Peak Temp (3)

 

 

Type

Drawing

Qty

 

 

 

TMX320C6722RFP

OBSOLETE

HTQFP

RFP

144

TBD

Call TI

Call TI

TMX320C6726RFP

OBSOLETE

HTQFP

RFP

144

TBD

Call TI

Call TI

 

 

 

 

 

 

 

 

TMX320C6727GDH

OBSOLETE

BGA

GDH

256

TBD

Call TI

Call TI

 

 

 

 

 

 

 

 

TMX320C6727ZDH

OBSOLETE

BGA

ZDH

256

TBD

Call TI

Call TI

 

 

 

 

 

 

 

 

(1)The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

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Contents TMS320C6727, TMS320C6726, TMS320C6722 DSPs FeaturesDescription Submit Documentation Feedback Device Compatibility Functional Block Diagram Package Thermal Resistance Characteristics ContentsC6726 Device CharacteristicsCharacteristics of the C672x Processors Hardware FeaturesCPU Data Paths Enhanced C67x+ CPUInstruction FLOATING-POINT Improves Operation CPU Interrupt AssignmentsNew Floating-Point Instructions for C67x+ CPU CPU Interrupt AssignmentsByte Bank Internal Program/Data ROM and RAMRegister Name Byte Address Description Cache ModeProgram Cache Program Cache Control RegistersBlock Diagram of Crossbar Switch High-Performance Crossbar SwitchLabel Bridge Description Master Clock Target Clock Bus BridgesCsprst BIT no Name Reset Value Read Write DescriptionMemory Map Summary C672x Memory MapFfff SPI0SIMO SPI0CLK Boot ModesRequired Boot Pin Settings at Device Reset Boot Mode UhpihcsPINCAP7 BIT no Name DescriptionPINCAP15 Pin Maps Pin AssignmentsPin Low-Profile Quad Flatpack RFP Suffix-Top View ZDH Signal Name RFP GDHTerminal Functions 12. Terminal FunctionsIO/I IPD Description ZDH AHCLKX0/AHCLKX2 AHCLKR0/AHCLKR1ACLKR0 AFSR0Power Pins 144-Pin RFP Package Power Pins 256-Terminal GDH/ZDH PackageDevelopment Development SupportDevice Support Package Type ‡ § TMS 320 C6727 GDH a 250Prefix Device Speed Range Device FamilyDocumentation Support C672x devices are documented in the tools v6.0 documentation Peripheral Pin Multiplexing Options Device Configuration RegistersDevice-Level Configuration Registers Options for Configuring SPI0, I2C0, and I2C1Peripheral Pin Multiplexing Control Options for Configuring SPI1, McASP0, and McASP1 Data PinsOptions for Configuring Emif and Uhpi C6727 Only Configuration Option PeripheralPIN First Priority Second Priority Third Priority Priority of Control of Data Output on Multiplexed PinsUnit Electrical SpecificationsAbsolute Maximum Ratings1 Recommended Operating Conditions1GDH, CV Parameter Test Conditions MIN TYP MAX UnitDvdd II, IOZParameter Information Parameter Information Device-Specific InformationTester Pin Electronics Timing Parameter Symbology Power Supplies Power-Supply SequencingPower-Supply Decoupling MIN MAX Unit ResetReset Electrical Data/Timing Reset Timing RequirementsDMAX Device-Specific Information Dual Data Movement Accelerator dMAXREQ RAM DMAXRAM REQSubmit Documentation Feedback Event Number Event Acronym Event Description DMAX Peripheral Event Input AssignmentsDMAX Configuration Registers DMAX Peripheral Registers DescriptionsByte Address Register Name Description External Interrupts Emif Device-Specific Information External Memory Interface EmifEmwe ResetDSP Emif EmrasEMWEDQM1 EmcasEmclk EMWEDQM0Emif Registers Emif Peripheral Registers DescriptionsParameter MIN MAX Unit Emif Sdram Interface Switching CharacteristicsEmif Electrical Data/Timing Emif Sdram Interface Timing RequirementsEmif Asynchronous Interface Timing Requirements1 Emif Asynchronous Interface Switching Characteristics1Basic Sdram Write Operation Emclk Emras Emcas EmweBasic Sdram Read Operation 10. Asynchronous Read Select Strobe Mode Asynchronous Read WE Strobe Mode12. Asynchronous Write Select Strobe Mode 11. Asynchronous Write WE Strobe Mode13. Emwait Timing Requirements Uhpi Major Modes on C672x 10. HPI Access Types Selected by UHPIHCNTL10Universal Host-Port Interface Uhpi C6727 Only Uhpi Device-Specific InformationUhpihrw UHPIHDS2G UHPIHDS1G Uhpihcs Uhpihrdy AMUTE2/HINT DSPUHPIHD16/HHWIL UhpihasbExternal Host MCU AxyC D150 D16 D3117 BE30D 16. Uhpi Multiplexed Host Address/Data Fullword ModeExternal Host MCU A172 AxyA D150 D16 D3117 BE30C 17. Uhpi Non-Multiplexed Host Address/Data Fullword ModeUhpi Internal Registers 11. Uhpi Configuration RegistersDevice-Level Configuration Registers Controlling Uhpi Uhpi Peripheral Registers DescriptionsBytead Full Nmux Pagem ENA BIT no Name Reset Read Description Value WriteHpiaumb Description BIT no Name Reset Read Value Write318 Reserved Hpiamsb DescriptionUhpi Electrical Data/Timing Universal Host-Port Interface Uhpi Read and Write Timing15. Uhpi Read and Write Timing Requirements1 16. Uhpi Read and Write Switching Characteristics1 UHPIHDSx Read Write UHPIHA150Valid Read data Write data Uhpihcs Uhpihas UHPIHCNTL10 Uhpihrw Uhpihhwil Hstrobe a 22. Multiplexed Read Timings Using Uhpihas23. Multiplexed Read Timings With Uhpihas Held High 24. Multiplexed Write Timings With Uhpihas Held High GIO Multichannel Audio Serial Ports McASP0, McASP1, and McASP2DIT Clock Pins Data Pins Comments 17. McASP Configurations on C672x DSPMcASP Internal Registers Device-Level Configuration Registers Controlling McASPMcASP Peripheral Registers Descriptions Register Byte Description Name AddressDITCSRA1 XclkchkXevtctl DITCSRA00x4500 020C XBUF3 Transmit buffer register for serializer AMUTEIN0 313 ReservedAMUTEIN0 Description AMUTEIN1 Description AMUTEIN1AMUTEIN2 AMUTEIN2McASP Electrical Data/Timing Multichannel Audio Serial Port McASP Timing22. McASP Timing Requirements1 23. McASP Switching Characteristics1 ACLKR/X Clkrp = Clkxp = 0A ACLKR/X Clkrp = Clkxp = 1B 29. McASP Input TimingsACLKR/X Clkrp = Clkxp = 1A ACLKR/X Clkrp = Clkxp = 0B 30. McASP Output TimingsSPI Device-Specific Information Serial Peripheral Interface Ports SPI0, SPI1SPIxSCS SPIxENA SPIxCLK SPIxSOMI SPIxSIMO Master SPISlave SPI 24. SPIx Configuration Registers SPI Peripheral Registers DescriptionsSPI0 SPI1 Register Name Description Byte Address SPI Electrical Data/Timing Serial Peripheral Interface SPI Timing25. General Timing Requirements for SPIx Master Modes1 26. General Timing Requirements for SPIx Slave Modes1 MIN MAX Unit 2P 27. Additional1 SPI Master Timings, 4-Pin Enable Option229. Additional1 SPI Master Timings, 5-Pin Option2 31. Additional1 SPI Slave Timings, 4-Pin Chip Select Option2 30. Additional1 SPI Slave Timings, 4-Pin Enable Option232. Additional1 SPI Slave Timings, 5-Pin Option2 33. SPI Timings-Master Mode 34. SPI Timings-Slave Mode 35. SPI Timings-Master Mode 4-Pin and 5-Pin 36. SPI Timings-Slave Mode 4-Pin and 5-Pin 15.1 I2C Device-Specific Information Inter-Integrated Circuit Serial Ports I2C0, I2C133. I2Cx Configuration Registers 15.2 I2C Peripheral Registers DescriptionsRegister Name Description Byte Address 34. I2C Input Timing Requirements 35. I2C Switching Characteristics115.3 I2C Electrical Data/Timing Inter-Integrated Circuit I2C Timing35. I2C Switching Characteristics ParameterI2CxSDA I2CxSCL Stop Start Repeated Real-Time Interrupt RTI Timer With Digital Watchdog 16.1 RTI/Digital Watchdog Device-Specific InformationWatchdog Key Register Bit Key RTI Interrupt RTI Internal Registers Device-Level Configuration Registers Controlling RTI16.2 RTI/Digital Watchdog Registers Descriptions 36. RTI RegistersRtiwdstatus RtiintflagRtidwdctrl Rtidwdprld38. Recommended On-Chip Oscillator Components External Clock Input From Oscillator or Clkin Pin39. Clkin Timing Requirements Clock Electrical Data/TimingPLL Device-Specific Information Phase-Locked Loop PLLEMI Parameter Default Value Allowed Setting or Range40. Allowed PLL Operating Conditions Board41. PLL Controller Registers PLL Registers DescriptionsRTI CODEC, DIRADC, DAC, DSD SpioADDS/CHANGES/DELETES Package Thermal Resistance Characteristics Thermal Characteristics for GDH/ZDH PackageThermal Characteristics for RFP Package Standoff Height Standoff HeightPackaging Information PowerPAD PCB FootprintPage Orderable Device Status Package Pins Package Eco Plan MSL Peak TempQty Page Page Important Notice
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