ENVIRONMENTAL CONDITIONS

 

 

 

Ambient Temperature Rating:

 

 

 

TAMB

= TCASE – (PD x θCA)

 

 

 

TCASE

= Case Temperature in °C

 

PD

= Power Dissipation in W

 

 

 

θCA

=

Thermal Resistance (Case-to-Ambient)

 

θJA

=

Thermal Resistance (Junction-to-Ambient)

θJC

=

Thermal Resistance (Junction-to-Case)

 

 

 

 

 

 

 

 

Package

 

uJA

 

uJC

 

uCA

TQFP

 

50°C/W

 

2°C/W

 

48°C/W

 

 

 

 

 

 

 

POWER DISSIPATION

To determine total power dissipation in a specific application, the following equation should be applied for each output:

C× VDD2 × f

C = load capacitance, f = output switching frequency.

Example

In an application where external data memory is used and no other outputs are active, power dissipation is calculated as follows:

Assumptions

External data memory is accessed every cycle with 50% of the address pins switching.

External data memory writes occur every other cycle with 50% of the data pins switching.

Each address and data pin has a 10 pF total load at the pin.

The application operates at VDD = 5.0 V and tCK = 30 ns.

Total Power Dissipation = PINT + (C × VDD2 × f)

PINT = internal power dissipation from Power vs. Frequency graph (Figure 8).

(C × VDD2 × f) is calculated for each output:

 

# of

 

3 VDD2

 

 

 

Pins

3 C

3f

 

 

 

 

 

 

 

 

Address, DMS

8

× 10 pF

× 52

V

× 33.3 MHz =

66.6 mW

Data Output, WR

9

× 10 pF

× 52

V

× 16.67 MHz = 37.5 mW

RD

1

× 10 pF

× 52

V

× 16.67 MHz =

4.2 mW

CLKOUT

1

× 10 pF

× 52

V

× 33.3 MHz =

8.3 mW

 

 

 

 

 

116.6 mW

 

 

 

 

 

 

 

Total power dissipation for this example is PINT + 116.6 mW.

 

 

 

ADSP-2186

 

450

2186 POWER, INTERNAL1, 3, 4, 5

 

 

 

 

425

 

VDD = 5.5V

 

400

 

430mW

 

 

370mW

– mW

375

 

 

 

350

330mW

325mW

)

 

INT

325

 

VDD = 5.0V

(P

300

 

275mW

POWER

 

275

245mW

 

250

235mW

 

 

225

 

VDD = 4.5V

 

 

195mW

 

200

175mW

 

 

175

 

 

 

 

 

150

 

 

 

30

32

34

36

38

40

42

 

 

 

 

1/fCK – MHz

 

 

 

85

 

POWER, IDLE1, 2, 3, 5

 

 

 

 

 

 

 

 

84mW

 

80

 

 

76mW

 

 

 

 

 

 

 

 

 

75

69mW

 

 

VDD = 5.5V

 

 

– mW

70

 

 

 

 

 

 

 

 

 

 

67mW

65

 

 

61mW

 

 

 

 

 

 

 

)

 

 

 

 

 

 

 

IDLE

60

56mW

 

 

VDD = 5.0V

 

 

(P

55

 

 

 

 

 

54mW

POWER

 

 

49mW

 

 

 

 

 

 

 

50

 

 

 

 

 

45mW

 

 

VDD = 4.5V

 

 

45

 

 

 

 

 

 

 

 

 

 

 

40

 

 

 

 

 

 

 

35

 

 

 

 

 

 

 

30

32

34

36

38

40

42

 

30

 

 

 

 

1/fCK – MHz

 

 

 

70

 

POWER, IDLE n MODES3, 5

 

 

 

 

 

 

 

 

67mW

IDLE

 

65

 

 

61mW

 

 

 

 

 

 

 

mW

60

 

56mW

 

 

 

 

 

 

 

 

 

 

 

 

55

 

 

 

 

 

 

 

n) –

50

 

 

 

 

 

 

 

IDLE

 

 

 

 

 

 

 

(P

45

 

 

 

 

 

 

 

POWER

35

 

 

 

32mW

 

34mW

IDLE (16)

 

40

 

 

 

 

 

 

 

 

30

 

30mW

 

 

 

32mW

IDLE (128)

 

 

 

 

30mW

 

 

 

 

25

 

28mW

 

 

 

 

 

 

 

 

 

 

 

 

20

30

32

34

36

38

40

42

 

28

 

 

 

 

1/fCK – MHz

 

 

 

VALID FOR ALL TEMPERATURE GRADES.

1POWER REFLECTS DEVICE OPERATING WITH NO OUTPUT LOADS.

2IDLE REFERS TO ADSP-2186 STATE OF OPERATION DURING EXECUTION OF IDLE INSTRUCTION. DEASSERTED PINS ARE DRIVEN TO EITHER VDD OR GND.

3TYPICAL POWER DISSIPATION AT 5.0V VDD AND TA = 25°C EXCEPT WHERE SPECIFIED.

4IDD MEASUREMENT TAKEN WITH ALL INSTRUCTIONS EXECUTING FROM INTERNAL MEMORY. 50% OF THE INSTRUCTIONS ARE MULTIFUNCTION (TYPES 1, 4, 5, 12, 13, 14 30% ARE TYPE 2 AND TYPE 6, AND 20% ARE IDLE INSTRUCTIONS.

5SPECIFICATIONS AT 40MHz ARE PRELIMINARY AT THIS PRINTING.

Figure 8. Power vs. Frequency

REV. 0

–15–

Page 15
Image 15
Analog Devices ADSP-2186 Package, Assumptions, Total Power Dissipation = Pint + C × VDD2 × f, Environmental Conditions