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CY7C68053
10.0Ordering Information
Table
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Ordering Code | Package Type | RAM Size | # Prog I/Os | Address/Data |
Busses | ||||
56 VFBGA– | 16K | 24 | – | |
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Development Tool Kit |
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CY3687 |
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11.0Package Diagram
The FX2LP18 is available in a 56-pin VFBGA package.
Figure 11-1. 56 VFBGA (5 x 5 x 1.0 mm) 0.50 Pitch, 0.30 Ball BZ56
TOP VIEW
PIN A1 CORNER
1 2 3 4 5 6 6 8
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5.00±0.10 | C | ||
D | |||
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| 5.00±0.10 |
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| SIDE VIEW | C |
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| 0.10 |
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0.45 |
| 0.080 C | |
SEATING PLANE |
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0.21 |
| ~0.260 | 1.0 max |
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| 0.160 |
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BOTTOM VIEW
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| Ø0.05 M C |
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| Ø0.15 M C A B |
| A1 CORNER | |||
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| Ø0.30±0.05(56X) |
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| 8 | 7 | 6 | 5 | 4 | 3 | 2 | 1 |
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| A |
5.00±0.10 | 3.50 | 0.50 |
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| C | |||
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| D |
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| G |
H
0.50
3.50
5.00±0.10
0.10(4X)
REFERENCE JEDEC:
PACKAGE WEIGHT: 0.02 grams
Document # | Page 37 of 39 |
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