Intel 31244 PCI-X manual Cable Interconnect With Backplane, Backplane Stackup, Microstrip

Intel® 31244 PCI-X to Serial ATA Controller

Printed Circuit Board (PCB) Methodology

Table 15.	Backplane Stackup, Microstrip
	Variable	Nominal (mil)	Tolerance	Min (mil)	Max (mil)
	Mask Thickness	0.8	+/- 0.2	0.6	1.0
	Mask Er	3.6		3.6	3.6
	Trace Height	1.4	+/-0.3	1.1	1.7
	Preg Er	4.66	+/-0.55	3.6	4.7
	Plane Thickness	1.4	+/-0.2	1.2	1.6
	Trace Thickness	1.4	+/-0.4	1.0	1.8
	Trace Width	11.5	+/-1.5	10	13
	Total Thickness	70.0	+/-7.0	63.0	77.0

Table 16.	Backplane Stackup, Offset Stripline
	Variable	Nominal (mil)	Tolerance	Min (mil)	Max (mil)
	Mask Thickness	0.8	+/- 0.2	0.6	1.0
	Mask Er	3.6		3.6	3.6
	Trace Height	1	+/-0.3
	Preg Er	4.15	+/-0.55	3.6	4.7
	Plane Thickness	2.2	+/-0.2	1.2	1.6
	Trace Thickness	1.4	+/-0.4	1.8	2.6
	Trace Width	11.5	+/-1.5
	Total Thickness	70.0	+/-7.0	63.0	77.0

6.2.4Cable Interconnect With Backplane

Figure 14 provides the topology which uses a cable as an interconnect between the motherboard and backplane.

Table 17.	Cable Specification
	Parameter	Routing Guideline	Notes
	Characteristic Z - Cable	100 ohms +/- 15%
	Trace Length	1”-6”
	Trace Matching	150 mils

Design Guide 45