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X9SPV Motherboard Series User's Manual
Motherboard Features
CPU Onboard, Mobile, 3rd generation Intel® Core™ i7/i5/i3
processor (FCBGA1023)
Memory Two (2) SO-DIMM slots support up to 16 GB of DDR3,
unbuffered, 1066/1333 MHz, ECC SO-DIMM memory
Supports One DIMM per Channel
DIMM sizes
ECC SO-DIMM 2 GB, 4 GB and 8GB
Chipset Mobile Intel® QM77 Express (3.9W)
Expansion Slots One (1) PCI-E x 16, Gen 3 Slot (i3 with Gen 2 only)
Graphics Intel HD 4000 Integrated Graphics
Matrox G200eW Graphics
Network Connections Four (4) RJ-45 Rear I/O Panel Connectors (Intel 82574L)
on the X9SPV-LN4F only
Two (2) RJ-45 Rear I/O Panel Connectors (Intel 82574L)
on the X9SPV-F only
One (1) RJ-45 IPMI Connector
I/O Devices SATA Connections
SATA 3.0 Ports Two (2) (SATA 0/1)
RAID 0, 1 Support
SATA 2.0 Ports Four (4) (SATA 2~5)
RAID 0, 1, 5, 10
USB Devices
Four (4) USB 2.0 ports on the rear I/O panel (USB 4/5,
8/9)
Six (6) USB ports on headers for front panel access:
USB0/1 (3.0), USB 2/3 (3.0), USB 6/7 (2.0)
Graphics
One (1) Back panel VGA port
Keyboard/Mouse
Combination PS/2 Keyboard/Mouse port on the I/O
backpanel
Serial (COM) Ports
Two (2) Fast UART 16550 connections: one 9-pin RS-232
port (Backpanel COM1 port) and one header (COM2)
Super I/O
Winbond Super I/O NCT6776F