X9SPV Motherboard Series User's Manual

Motherboard Features

CPU

Onboard, Mobile, 3rd generation Intel® Core™ i7/i5/i3

 

processor (FCBGA1023)

 

 

 

 

Memory

Two (2) SO-DIMM slots support up to 16 GB of DDR3,

 

unbuffered, 1066/1333 MHz, ECC SO-DIMM memory

 

 

 

 

 

Supports One DIMM per Channel

 

 

 

 

 

 

DIMM sizes

 

 

 

ECC SO-DIMM

 

2 GB, 4 GB and 8GB

 

 

 

 

Chipset

Mobile Intel® QM77 Express (3.9W)

Expansion Slots

One (1) PCI-E x 16, Gen 3 Slot (i3 with Gen 2 only)

Graphics

Intel HD 4000 Integrated Graphics

 

Matrox G200eW Graphics

 

 

 

Network Connections

Four (4) RJ-45 Rear I/O Panel Connectors (Intel 82574L)

 

on the X9SPV-LN4F only

 

Two (2) RJ-45 Rear I/O Panel Connectors (Intel 82574L)

 

on the X9SPV-F only

 

One (1) RJ-45 IPMI Connector

 

 

 

 

I/O Devices

SATA Connections

 

SATA 3.0 Ports

 

Two (2) (SATA 0/1)

 

 

 

 

 

 

 

 

 

RAID 0, 1 Support

 

 

 

 

 

SATA 2.0 Ports

 

Four (4) (SATA 2~5)

 

 

 

 

 

 

 

 

 

RAID 0, 1, 5, 10

 

USB Devices

 

 

 

Four (4) USB 2.0 ports on the rear I/O panel (USB 4/5,

 

8/9)

 

 

 

 

Six (6) USB ports on headers for front panel access:

 

USB0/1 (3.0), USB 2/3 (3.0), USB 6/7 (2.0)

 

Graphics

 

 

 

One (1) Back panel VGA port

 

 

 

 

 

Keyboard/Mouse

 

Combination PS/2 Keyboard/Mouse port on the I/O

 

backpanel

 

 

 

Serial (COM) Ports

 

Two (2) Fast UART 16550 connections: one 9-pin RS-232

 

port (Backpanel COM1 port) and one header (COM2)

 

Super I/O

 

 

 

Winbond Super I/O NCT6776F

 

 

 

 

 

1-6

Page 18
Image 18
SUPER MICRO Computer X9SPV-F, X9SPV-LN4F user manual Motherboard Features