Intel 41210 manual Material, Impedance, Bridge Customer Reference Boards, CRB Board Stackup

41210 Bridge Customer Reference Boards

Table 18. CRB Board Stackup

Layer	Type	Thickness	Copper Weight
		(mils)
1	Signal	2.00	1/2 + plating
	Prepreg	4.50
2	Plane: GND	1.20	1
	Core	4.80
3	Signal	1.20	1
	Prepreg	14.00
4	Plane: PWR	1.20	1
	Core	3.8
5	Plane: PWR	1.20	1
	Prepreg	14.00
6	Signal	1.20	1
	Core	4.80
7	Plane: Power	1.20	1
	Prepreg	4.50
8	Signal	2.00	1/2 + plating
Est. Total		62 +/- 7
Thickness

11.2Material

The following materials are used with the 41210 Bridge CRB:

•FR-4, 0.062 in. +/- .007, 1.0 oz Copper Power/GND.

•Full length PCI Raw Card (3.3V Universal) 6.2” high x 7.00” long max with ½ inch cut away.

11.3Impedance

Most signal layers require controlled Impedance of 60 Ω +/- 5% microstrip or stripline where appropriate.

Differential signals for the PCI-E interface require matched 100 Ω differential termination realized as matched 50Ω resistances referenced to ground.

56 Intel® 41210 Serial to Parallel PCI Bridge Design Guide