Intel 5100 manual Package Mechanical Requirements, MCH Package Dimensions Bottom View

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Intel® 5100 MCH Chipset

Figure 4. MCH Package Dimensions (Bottom View)

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Notes:

1.All dimensions are in millimeters.

2.All dimensions and tolerances conform to ANSI Y14.5M-1994.

2.1Package Mechanical Requirements

The Intel® 5100 MCH Chipset package has an integrated heat spreader (IHS) that is capable of sustaining a maximum static normal load of 15 lbf. These mechanical load limits must not be exceeded during heatsink installation, mechanical stress testing, standard shipping conditions and/or any other use condition.

Note: The heatsink attach solutions must not include continuous stress to the chipset package with the exception of a uniform load to maintain the heatsink-to-package thermal interface.

Intel® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

July 2008	TDG
Order Number: 318676-003US	11

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Contents Revision 003US Thermal/Mechanical Design GuideTDG Contents Tables FiguresDate Revision Description Revision HistoryRevision Number Descriptions Design Flow IntroductionTerm Definition Definition of TermsDefinition of Terms Document Document Number/URL Related Documents Related Documents Sheet 1 Related Documents Sheet 2 Packaging TechnologyThermal Simulation MCH Package Dimensions Side View MCH Package Dimensions Top ViewPackage Mechanical Requirements MCH Package Dimensions Bottom ViewCase Temperature Thermal SpecificationsThermal Solution Requirements Thermal Design Power TDPExample 1. Calculating the Required Thermal Performance Processor Thermal Characterization Parameter Relationships105 Required Heatsink Thermal Performance Ψ CA Thermal MetrologyMCH Case Measurement Supporting Test EquipmentThermocouple Attach Support Equipment Thermal Calibration and ControlsIHS Groove IHS Groove Dimensions Thermocouple Attachment to IHS Thermocouple Conditioning and PreparationSecuring Thermocouple Wires with Kapton Tape Prior to Attach Thermocouple Bead Placement Using 3D Micromanipulator to Secure Bead Location Applying Adhesive on Thermocouple Bead Curing ProcessThermocouple Wire Management in Groove Thermocouple Wire ManagementPower Simulation Software Reference Thermal SolutionMechanical Design Envelope AdvancedTCA* Reference HeatsinkThermal Performance Torsional Clip Heatsink Thermal Solution Assembly Board-level Components Keepout DimensionsThermal Interface Material Heatsink OrientationExtruded Heatsink Profiles Mechanical Interface MaterialReliability Guidelines Heatsink ClipClip Retention Anchors Test Requirement Pass/Fail Criteria CompactPCI* Reference HeatsinkComponent Overview Reliability GuidelinesReliability Requirements Thermal Solution Performance CharacteristicsReliability Guidelines Drawing Description Appendix a Mechanical DrawingsMechanical Drawing List AdvancedTCA* Heatsink Assembly Drawing AdvancedTCA* Heatsink Drawing AdvancedTCA* Component Keepout Zone CompactPCI* Heatsink Assembly Drawing CompactPCI* Heatsink Drawing CompactPCI* Component Keepout Zone Torsional Clip Heatsink Clip Drawing TIM2 Drawing MCH Torsional Clip Heatsink Thermal Solution Appendix B Thermal Solution Component Suppliers