Intel 5100 manual Securing Thermocouple Wires with Kapton Tape Prior to Attach

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Intel® 5100 MCH Chipset

2.Place the thermocouple wire inside the groove letting the exposed wire and bead extend about 3.2 mm (0.125") past the end of the groove. Secure it with Kapton tape (Figure 9).

3.Lift the wire at the middle of groove with tweezers and bend the front of the wire to place the thermocouple in the channel ensuring that the tip is in contact with the end of the channel grooved in the IHS (Figure 10 A and B).

4.Place the MCH under the microscope unit (similar to the one used in Figure 13) to continue with the process. It is also recommended to use a fixture to help hold the unit in place for the rest of the attach process.

5.Press the wire down about 6 mm (0.125") from the thermocouple bead using the tweezers. Look in the microscope to perform this task. Place a piece of Kapton tape to hold the wire inside the groove (Figure 12). Refer to Figure 11 for detailed bead placement.

6.Using the micromanipulator, place the needle near the end of groove on top of the thermocouple. Using the X, Y, and Z axes on the arm, place the tip of the needle on top of the thermocouple bead. Press down until the bead is seated at the end of the groove on top of the step (see Figure 11 and Figure 12).

7.Measure resistance from thermocouple end wires (hold both wires to a DMM probe) to the IHS surface. This should be the same value as measured during the thermocouple conditioning. See Section 5.1.4, step 2., and Figure 13.

8.Place a small amount of Locite* 498* Super Bonder* adhesive in the groove where the bead is installed. Using a fine point device, spread the adhesive in the groove around the needle, the thermocouple bead, and the thermocouple wires already installed in the groove during step 5. Be careful not to move the thermocouple bead during this step (Figure 14).

Figure 9. Securing Thermocouple Wires with Kapton Tape Prior to Attach

Intel® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

July 2008

TDG

Order Number: 318676-003US

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Contents Revision 003US Thermal/Mechanical Design GuideTDG Contents Tables FiguresRevision Number Descriptions Revision HistoryDate Revision Description Design Flow IntroductionDefinition of Terms Definition of TermsTerm Definition Related Documents Sheet 1 Related DocumentsDocument Document Number/URL Thermal Simulation Packaging TechnologyRelated Documents Sheet 2 MCH Package Dimensions Side View MCH Package Dimensions Top ViewPackage Mechanical Requirements MCH Package Dimensions Bottom ViewCase Temperature Thermal SpecificationsThermal Solution Requirements Thermal Design Power TDPExample 1. Calculating the Required Thermal Performance Processor Thermal Characterization Parameter Relationships105 Required Heatsink Thermal Performance Ψ CA Thermal MetrologyMCH Case Measurement Supporting Test EquipmentIHS Groove Thermal Calibration and ControlsThermocouple Attach Support Equipment IHS Groove Dimensions Thermocouple Attachment to IHS Thermocouple Conditioning and PreparationSecuring Thermocouple Wires with Kapton Tape Prior to Attach Thermocouple Bead Placement Using 3D Micromanipulator to Secure Bead Location Applying Adhesive on Thermocouple Bead Curing ProcessThermocouple Wire Management in Groove Thermocouple Wire ManagementPower Simulation Software Reference Thermal SolutionThermal Performance AdvancedTCA* Reference HeatsinkMechanical Design Envelope Torsional Clip Heatsink Thermal Solution Assembly Board-level Components Keepout DimensionsThermal Interface Material Heatsink OrientationExtruded Heatsink Profiles Mechanical Interface MaterialClip Retention Anchors Heatsink ClipReliability Guidelines Test Requirement Pass/Fail Criteria CompactPCI* Reference HeatsinkComponent Overview Reliability GuidelinesReliability Guidelines Thermal Solution Performance CharacteristicsReliability Requirements Mechanical Drawing List Appendix a Mechanical DrawingsDrawing Description AdvancedTCA* Heatsink Assembly Drawing AdvancedTCA* Heatsink Drawing AdvancedTCA* Component Keepout Zone CompactPCI* Heatsink Assembly Drawing CompactPCI* Heatsink Drawing CompactPCI* Component Keepout Zone Torsional Clip Heatsink Clip Drawing TIM2 Drawing MCH Torsional Clip Heatsink Thermal Solution Appendix B Thermal Solution Component Suppliers

5100 specifications

The Intel 5100, officially known as the Intel Core 2 Duo Processor T5100, is a notable entry in Intel's line of mobile processors, designed primarily for laptops and portable computing devices. Released in early 2007, it targets users seeking a balance between performance and energy efficiency.

At its core, the Intel 5100 features a dual-core architecture that allows it to handle multiple tasks simultaneously, significantly improving multitasking capabilities compared to single-core processors. Clocked at a speed of 1.6 GHz, it provides robust performance for everyday computing tasks such as web browsing, document editing, and casual gaming.

One of the key technologies integrated into the Intel 5100 is Intel's 64-bit architecture, which enables the processor to utilize more than 4GB of RAM, catering to modern computing needs. This feature is particularly beneficial for users running demanding applications or multitasking, as it provides increased processing power and efficiency.

The Intel 5100 also incorporates Intel's Enhanced Intel SpeedStep Technology, which optimizes power consumption by dynamically adjusting the processor's frequency and voltage based on workload. This not only extends battery life in portable devices but also helps in reducing heat output, promoting a cooler computing experience.

Another significant aspect of the Intel 5100 is its support for Intel Virtualization Technology (VT-x). This feature allows multiple operating systems to run concurrently on the same machine, making it an excellent choice for developers and IT professionals who require virtual environments for testing and development purposes.

The processor is built on a 65nm process technology, which contributes to its energy efficiency and thermal management. With a Thermal Design Power (TDP) of just 35 watts, it remains within a reasonable thermal envelope, suitable for laptop designs without requiring excessive cooling solutions.

In terms of connectivity, the Intel 5100 supports a range of communication technologies. It is commonly paired with Intel’s 965GM chipset, which enhances graphics capabilities through Intel GMA X3100 integrated graphics, offering decent performance for standard visual tasks.

Overall, the Intel 5100 represents a solid choice for users seeking a combination of performance, efficiency, and advanced features, making it a reliable processor option for laptops in the mid to late 2000s. With its dual-core capabilities, 64-bit support, and energy-efficient design, it paved the way for future developments in mobile computing technology.
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