Intel 5100 manual Thermocouple Bead Placement

Page 20

Intel® 5100 MCH Chipset

Figure 10. Thermocouple Bead Placement

Figure 11. Positioning Bead on Groove

Intel® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

TDG	July 2008
20	Order Number: 318676-003US

Image 20

Contents Thermal/Mechanical Design Guide Revision 003USTDG Contents Figures TablesDate Revision Description Revision HistoryRevision Number Descriptions Introduction Design FlowTerm Definition Definition of TermsDefinition of Terms Document Document Number/URL Related DocumentsRelated Documents Sheet 1 Related Documents Sheet 2 Packaging TechnologyThermal Simulation MCH Package Dimensions Top View MCH Package Dimensions Side ViewMCH Package Dimensions Bottom View Package Mechanical RequirementsThermal Specifications Thermal Solution RequirementsThermal Design Power TDP Case TemperatureProcessor Thermal Characterization Parameter Relationships Example 1. Calculating the Required Thermal Performance105 Thermal Metrology MCH Case MeasurementSupporting Test Equipment Required Heatsink Thermal Performance Ψ CAThermocouple Attach Support Equipment Thermal Calibration and ControlsIHS Groove IHS Groove Dimensions Thermocouple Conditioning and Preparation Thermocouple Attachment to IHSSecuring Thermocouple Wires with Kapton Tape Prior to Attach Thermocouple Bead Placement Using 3D Micromanipulator to Secure Bead Location Curing Process Applying Adhesive on Thermocouple BeadThermocouple Wire Management Thermocouple Wire Management in GrooveReference Thermal Solution Power Simulation SoftwareMechanical Design Envelope AdvancedTCA* Reference HeatsinkThermal Performance Board-level Components Keepout Dimensions Torsional Clip Heatsink Thermal Solution AssemblyHeatsink Orientation Extruded Heatsink ProfilesMechanical Interface Material Thermal Interface MaterialReliability Guidelines Heatsink ClipClip Retention Anchors CompactPCI* Reference Heatsink Component OverviewReliability Guidelines Test Requirement Pass/Fail CriteriaReliability Requirements Thermal Solution Performance CharacteristicsReliability Guidelines Drawing Description Appendix a Mechanical DrawingsMechanical Drawing List AdvancedTCA* Heatsink Assembly Drawing AdvancedTCA* Heatsink Drawing AdvancedTCA* Component Keepout Zone CompactPCI* Heatsink Assembly Drawing CompactPCI* Heatsink Drawing CompactPCI* Component Keepout Zone Torsional Clip Heatsink Clip Drawing TIM2 Drawing Appendix B Thermal Solution Component Suppliers MCH Torsional Clip Heatsink Thermal Solution