Intel 5100 manual Packaging Technology, Thermal Simulation, Related Documents Sheet 2

Page 9

Intel® 5100 MCH Chipset

Table 2.

Related Documents (Sheet 2 of 2)

 

 

 

 

 

Document

Document Number/URL

 

 

 

 

Intel® I/O Controller Hub 9 (ICH9) Family Thermal and

http://www.intel.com/ (316974)

 

Mechanical Design Guidelines

 

 

 

 

 

 

Quad-Core and Dual-Core Intel® Xeon® Processor 5000

 

 

Sequence with Intel® 5100 Memory Controller Hub Chipset for

Note 1

 

Communications, Embedded, and Storage Applications –

 

 

 

Platform Design Guide

 

 

 

 

 

Quad-Core Intel® Xeon® Processor 5300 Series Datasheet

http://www.intel.com/ (315569)

 

Quad-Core Intel® Xeon® Processor 5300 Series Specification

http://www.intel.com/ (315338)

 

Update

 

 

 

 

 

 

Quad-Core Intel® Xeon® Processor 5300 Series Thermal/

http://www.intel.com/ (315794)

 

Mechanical Design Guidelines

 

 

 

 

 

 

Quad-Core Intel® Xeon® Processor 5400 Series Datasheet

http://www.intel.com/ (318589)

 

Quad-Core Intel® Xeon® Processor 5400 Series Specification

http://www.intel.com/ (318585)

 

Update

 

 

 

 

 

 

Quad-Core Intel® Xeon® Processor 5400 Series Thermal/

http://www.intel.com/ (318611)

 

Mechanical Design Guidelines

 

 

 

 

 

 

Quad-Core Intel® Xeon® Processor L5318 in Embedded

http://www.intel.com/ (318474)

 

Applications Thermal and Mechanical Design Guidelines

 

 

 

 

 

 

Various system thermal design suggestions

http://www.formfactors.org

 

 

 

Notes:

1.Contact your Intel sales representative. Some documents may not be available at this time.

1.4Thermal Simulation

Intel provides thermal simulation models of the Intel® 5100 MCH Chipset and associated user’s guides to aid system designers in simulating, analyzing, and optimizing their thermal solutions in an integrated, system-level environment. The models are for use with the commercially available Computational Fluid Dynamics (CFD)-based thermal analysis tools Flomerics* FLOTHERM* (version 5.1 or higher) and Fluent* Icepak* (version 4.3.10 or higher). Contact your Intel field sales representative to order the thermal models and user’s guides.

2.0Packaging Technology

Intel® 5100 MCH Chipset-based platforms consist of two individual components: the Intel® 5100 MCH Chipset and the ICH9R. The Intel® 5100 MCH Chipset uses a 42.5 mm, 10-layer flip chip ball grid array (FC-BGA) package (see Figure 2, Figure 3, and Figure 4). For information on the ICH9R package, refer to the Intel® I/O Controller Hub 9 (ICH9) Family Thermal and Mechanical Design Guidelines.

Intel® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

July 2008

TDG

Order Number: 318676-003US

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Contents Revision 003US Thermal/Mechanical Design GuideTDG Contents Tables FiguresRevision History Revision Number DescriptionsDate Revision Description Design Flow IntroductionDefinition of Terms Definition of TermsTerm Definition Related Documents Related Documents Sheet 1Document Document Number/URL Packaging Technology Thermal SimulationRelated Documents Sheet 2 MCH Package Dimensions Side View MCH Package Dimensions Top ViewPackage Mechanical Requirements MCH Package Dimensions Bottom ViewThermal Solution Requirements Thermal SpecificationsThermal Design Power TDP Case TemperatureExample 1. Calculating the Required Thermal Performance Processor Thermal Characterization Parameter Relationships105 MCH Case Measurement Thermal MetrologySupporting Test Equipment Required Heatsink Thermal Performance Ψ CAThermal Calibration and Controls IHS GrooveThermocouple Attach Support Equipment IHS Groove Dimensions Thermocouple Attachment to IHS Thermocouple Conditioning and PreparationSecuring Thermocouple Wires with Kapton Tape Prior to Attach Thermocouple Bead Placement Using 3D Micromanipulator to Secure Bead Location Applying Adhesive on Thermocouple Bead Curing ProcessThermocouple Wire Management in Groove Thermocouple Wire ManagementPower Simulation Software Reference Thermal SolutionAdvancedTCA* Reference Heatsink Thermal PerformanceMechanical Design Envelope Torsional Clip Heatsink Thermal Solution Assembly Board-level Components Keepout DimensionsExtruded Heatsink Profiles Heatsink OrientationMechanical Interface Material Thermal Interface MaterialHeatsink Clip Clip Retention AnchorsReliability Guidelines Component Overview CompactPCI* Reference HeatsinkReliability Guidelines Test Requirement Pass/Fail CriteriaThermal Solution Performance Characteristics Reliability GuidelinesReliability Requirements Appendix a Mechanical Drawings Mechanical Drawing ListDrawing Description AdvancedTCA* Heatsink Assembly Drawing AdvancedTCA* Heatsink Drawing AdvancedTCA* Component Keepout Zone CompactPCI* Heatsink Assembly Drawing CompactPCI* Heatsink Drawing CompactPCI* Component Keepout Zone Torsional Clip Heatsink Clip Drawing TIM2 Drawing MCH Torsional Clip Heatsink Thermal Solution Appendix B Thermal Solution Component Suppliers
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