Intel 5100 manual AdvancedTCA* Reference Heatsink, Thermal Performance, Mechanical Design Envelope

Intel® 5100 MCH Chipset

The Intel® 5100 MCH Chipset has a lower TDP than the Intel® 5000 Series Chipset and a similar package size. Due to this, any thermal solutions for the Intel® 5000 Series Chipset should be reusable for the Intel® 5100 MCH Chipset including the Intel reference solutions. The system designer still needs to verify that the entire thermal solution will meet the component temperature specifications and TDP in the intended system.

6.1AdvancedTCA* Reference Heatsink

6.1.1Thermal Performance

The AdvancedTCA* reference heatsink should be made from aluminum to achieve the necessary thermal performance. Depending on the boundary conditions, the reference heatsink can meet the thermal performance needed to cool the Intel® 5100 MCH Chipset in the AdvancedTCA* form factor. The heatsink performance versus airflow velocity is shown in Figure 18. The heatsink may be used in other form factors that can provide the required amount of airflow to meet the components thermal specifications.

Figure 18. Torsional Clip Heatsink Measured Thermal Performance versus Approach Velocity

		4.500
Parameter		4.000
		3.500
Characterization		3.000
	(°C/W)	2.500
Thermal	ΨCA	2.000
Case-to-Ambient		1.500
		1.000
		0.500
		0.000
		0	100	200	300	400	500	600	700	800	900	1000	1100	1200	1300

Airflow Approach Velocity (LFM)

AdvancedTCA* Heatsink

6.1.2Mechanical Design Envelope

While each design may have unique mechanical volume and height restrictions or implementation requirements, the height, width, and depth constraints typically placed on the Intel® 5100 MCH Chipset thermal solution are shown in Figure 19.

Intel® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

July 2008	TDG
Order Number: 318676-003US	25