Intel 5100 manual AdvancedTCA* Reference Heatsink, Thermal Performance, Mechanical Design Envelope

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Intel® 5100 MCH Chipset

The Intel® 5100 MCH Chipset has a lower TDP than the Intel® 5000 Series Chipset and a similar package size. Due to this, any thermal solutions for the Intel® 5000 Series Chipset should be reusable for the Intel® 5100 MCH Chipset including the Intel reference solutions. The system designer still needs to verify that the entire thermal solution will meet the component temperature specifications and TDP in the intended system.

6.1AdvancedTCA* Reference Heatsink

6.1.1Thermal Performance

The AdvancedTCA* reference heatsink should be made from aluminum to achieve the necessary thermal performance. Depending on the boundary conditions, the reference heatsink can meet the thermal performance needed to cool the Intel® 5100 MCH Chipset in the AdvancedTCA* form factor. The heatsink performance versus airflow velocity is shown in Figure 18. The heatsink may be used in other form factors that can provide the required amount of airflow to meet the components thermal specifications.

Figure 18. Torsional Clip Heatsink Measured Thermal Performance versus Approach Velocity

 

 

4.500

 

 

 

 

 

 

 

 

 

 

 

 

 

Parameter

 

4.000

 

 

 

 

 

 

 

 

 

 

 

 

 

 

3.500

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Characterization

 

3.000

 

 

 

 

 

 

 

 

 

 

 

 

 

(°C/W)

2.500

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Thermal

ΨCA

2.000

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Case-to-Ambient

 

1.500

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1.000

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0.500

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0.000

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0

100

200

300

400

500

600

700

800

900

1000

1100

1200

1300

Airflow Approach Velocity (LFM)

AdvancedTCA* Heatsink

6.1.2Mechanical Design Envelope

While each design may have unique mechanical volume and height restrictions or implementation requirements, the height, width, and depth constraints typically placed on the Intel® 5100 MCH Chipset thermal solution are shown in Figure 19.

Intel® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

July 2008

TDG

Order Number: 318676-003US

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Contents Revision 003US Thermal/Mechanical Design GuideTDG Contents Tables FiguresRevision Number Descriptions Revision HistoryDate Revision Description Design Flow IntroductionDefinition of Terms Definition of TermsTerm Definition Related Documents Sheet 1 Related DocumentsDocument Document Number/URL Thermal Simulation Packaging TechnologyRelated Documents Sheet 2 MCH Package Dimensions Side View MCH Package Dimensions Top ViewPackage Mechanical Requirements MCH Package Dimensions Bottom ViewThermal Solution Requirements Thermal SpecificationsThermal Design Power TDP Case TemperatureExample 1. Calculating the Required Thermal Performance Processor Thermal Characterization Parameter Relationships105 MCH Case Measurement Thermal MetrologySupporting Test Equipment Required Heatsink Thermal Performance Ψ CAIHS Groove Thermal Calibration and ControlsThermocouple Attach Support Equipment IHS Groove Dimensions Thermocouple Attachment to IHS Thermocouple Conditioning and PreparationSecuring Thermocouple Wires with Kapton Tape Prior to Attach Thermocouple Bead Placement Using 3D Micromanipulator to Secure Bead Location Applying Adhesive on Thermocouple Bead Curing ProcessThermocouple Wire Management in Groove Thermocouple Wire ManagementPower Simulation Software Reference Thermal SolutionThermal Performance AdvancedTCA* Reference HeatsinkMechanical Design Envelope Torsional Clip Heatsink Thermal Solution Assembly Board-level Components Keepout DimensionsExtruded Heatsink Profiles Heatsink OrientationMechanical Interface Material Thermal Interface MaterialClip Retention Anchors Heatsink ClipReliability Guidelines Component Overview CompactPCI* Reference HeatsinkReliability Guidelines Test Requirement Pass/Fail CriteriaReliability Guidelines Thermal Solution Performance CharacteristicsReliability Requirements Mechanical Drawing List Appendix a Mechanical DrawingsDrawing Description AdvancedTCA* Heatsink Assembly Drawing AdvancedTCA* Heatsink Drawing AdvancedTCA* Component Keepout Zone CompactPCI* Heatsink Assembly Drawing CompactPCI* Heatsink Drawing CompactPCI* Component Keepout Zone Torsional Clip Heatsink Clip Drawing TIM2 Drawing MCH Torsional Clip Heatsink Thermal Solution Appendix B Thermal Solution Component Suppliers

5100 specifications

The Intel 5100, officially known as the Intel Core 2 Duo Processor T5100, is a notable entry in Intel's line of mobile processors, designed primarily for laptops and portable computing devices. Released in early 2007, it targets users seeking a balance between performance and energy efficiency.

At its core, the Intel 5100 features a dual-core architecture that allows it to handle multiple tasks simultaneously, significantly improving multitasking capabilities compared to single-core processors. Clocked at a speed of 1.6 GHz, it provides robust performance for everyday computing tasks such as web browsing, document editing, and casual gaming.

One of the key technologies integrated into the Intel 5100 is Intel's 64-bit architecture, which enables the processor to utilize more than 4GB of RAM, catering to modern computing needs. This feature is particularly beneficial for users running demanding applications or multitasking, as it provides increased processing power and efficiency.

The Intel 5100 also incorporates Intel's Enhanced Intel SpeedStep Technology, which optimizes power consumption by dynamically adjusting the processor's frequency and voltage based on workload. This not only extends battery life in portable devices but also helps in reducing heat output, promoting a cooler computing experience.

Another significant aspect of the Intel 5100 is its support for Intel Virtualization Technology (VT-x). This feature allows multiple operating systems to run concurrently on the same machine, making it an excellent choice for developers and IT professionals who require virtual environments for testing and development purposes.

The processor is built on a 65nm process technology, which contributes to its energy efficiency and thermal management. With a Thermal Design Power (TDP) of just 35 watts, it remains within a reasonable thermal envelope, suitable for laptop designs without requiring excessive cooling solutions.

In terms of connectivity, the Intel 5100 supports a range of communication technologies. It is commonly paired with Intel’s 965GM chipset, which enhances graphics capabilities through Intel GMA X3100 integrated graphics, offering decent performance for standard visual tasks.

Overall, the Intel 5100 represents a solid choice for users seeking a combination of performance, efficiency, and advanced features, making it a reliable processor option for laptops in the mid to late 2000s. With its dual-core capabilities, 64-bit support, and energy-efficient design, it paved the way for future developments in mobile computing technology.