| Intel® 5100 MCH Chipset | |
Figures |
| |
1 | Thermal Design Process | 7 |
2 | MCH Package Dimensions (Top View) | 10 |
3 | MCH Package Dimensions (Side View) | 10 |
4 | MCH Package Dimensions (Bottom View) | 11 |
5 | Processor Thermal Characterization Parameter Relationships | 13 |
6 | IHS Groove Dimensions | 17 |
7 | Orientation of Thermocouple Groove Relative to Package Pin | 18 |
8 | Bending Tip of Thermocouple | 18 |
9 | Securing Thermocouple Wires with Kapton Tape Prior to Attach | 19 |
10 | Thermocouple Bead Placement | 20 |
11 | Positioning Bead on Groove | 20 |
12 | Using 3D Micromanipulator to Secure Bead Location | 21 |
13 | Measuring Resistance between Thermocouple and IHS | 21 |
14 | Applying Adhesive on Thermocouple Bead | 22 |
15 | Thermocouple Wire Management in Groove | 23 |
16 | Removing Excess Adhesive from IHS | 23 |
17 | Filling Groove with Adhesive | 24 |
18 | Torsional Clip Heatsink Measured Thermal Performance versus Approach Velocity | 25 |
19 | AdvancedTCA* Torsional Clip Heatsink Volumetric Envelope for MCH Heatsink | 26 |
20 | Torsional Clip Heatsink Assembly | 27 |
21 | Isometric View of the CompactPCI* Reference Heatsink | 29 |
22 | CompactPCI* Reference Heatsink Thermal Performance | 30 |
23 | AdvancedTCA* Heatsink Assembly Drawing | 32 |
24 | AdvancedTCA* Heatsink Drawing | 33 |
25 | AdvancedTCA* Component Keepout Zone | 34 |
26 | CompactPCI* Heatsink Assembly Drawing | 35 |
27 | CompactPCI* Heatsink Drawing | 36 |
28 | CompactPCI* Component Keepout Zone | 37 |
29 | Torsional Clip Heatsink Clip Drawing | 38 |
30 | TIM2 Drawing | 39 |
Tables |
| |
1 | Definition of Terms | 7 |
2 | Related Documents | 8 |
3 | Intel® 5100 Memory Controller Hub Chipset Thermal Specifications | 12 |
4 | Required Heatsink Thermal Performance (ΨCA) | 15 |
5 | Thermocouple Attach Support Equipment | 16 |
6 | Honeywell* PCM45F TIM Performance as Function of Attach Pressure | 28 |
7 | Reliability Guidelines | 29 |
8 | Reliability Requirements | 30 |
9 | Mechanical Drawing List | 31 |
10 | MCH Torsional Clip Heatsink Thermal Solution | 40 |
Intel® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications
TDG | July 2008 |
4 | Order Number: |