Intel 5100 manual Figures, Tables

Page 4

 

Intel® 5100 MCH Chipset

Figures

 

1

Thermal Design Process

7

2

MCH Package Dimensions (Top View)

10

3

MCH Package Dimensions (Side View)

10

4

MCH Package Dimensions (Bottom View)

11

5

Processor Thermal Characterization Parameter Relationships

13

6

IHS Groove Dimensions

17

7

Orientation of Thermocouple Groove Relative to Package Pin

18

8

Bending Tip of Thermocouple

18

9

Securing Thermocouple Wires with Kapton Tape Prior to Attach

19

10

Thermocouple Bead Placement

20

11

Positioning Bead on Groove

20

12

Using 3D Micromanipulator to Secure Bead Location

21

13

Measuring Resistance between Thermocouple and IHS

21

14

Applying Adhesive on Thermocouple Bead

22

15

Thermocouple Wire Management in Groove

23

16

Removing Excess Adhesive from IHS

23

17

Filling Groove with Adhesive

24

18

Torsional Clip Heatsink Measured Thermal Performance versus Approach Velocity

25

19

AdvancedTCA* Torsional Clip Heatsink Volumetric Envelope for MCH Heatsink

26

20

Torsional Clip Heatsink Assembly

27

21

Isometric View of the CompactPCI* Reference Heatsink

29

22

CompactPCI* Reference Heatsink Thermal Performance

30

23

AdvancedTCA* Heatsink Assembly Drawing

32

24

AdvancedTCA* Heatsink Drawing

33

25

AdvancedTCA* Component Keepout Zone

34

26

CompactPCI* Heatsink Assembly Drawing

35

27

CompactPCI* Heatsink Drawing

36

28

CompactPCI* Component Keepout Zone

37

29

Torsional Clip Heatsink Clip Drawing

38

30

TIM2 Drawing

39

Tables

 

1

Definition of Terms

7

2

Related Documents

8

3

Intel® 5100 Memory Controller Hub Chipset Thermal Specifications

12

4

Required Heatsink Thermal Performance (ΨCA)

15

5

Thermocouple Attach Support Equipment

16

6

Honeywell* PCM45F TIM Performance as Function of Attach Pressure

28

7

Reliability Guidelines

29

8

Reliability Requirements

30

9

Mechanical Drawing List

31

10

MCH Torsional Clip Heatsink Thermal Solution

40

Intel® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

TDG

July 2008

4

Order Number: 318676-003US

Image 4
Contents Thermal/Mechanical Design Guide Revision 003USTDG Contents Figures TablesRevision Number Descriptions Revision HistoryDate Revision Description Introduction Design FlowDefinition of Terms Definition of TermsTerm Definition Related Documents Sheet 1 Related DocumentsDocument Document Number/URL Thermal Simulation Packaging TechnologyRelated Documents Sheet 2 MCH Package Dimensions Top View MCH Package Dimensions Side ViewMCH Package Dimensions Bottom View Package Mechanical RequirementsThermal Specifications Thermal Solution RequirementsThermal Design Power TDP Case TemperatureProcessor Thermal Characterization Parameter Relationships Example 1. Calculating the Required Thermal Performance105 Thermal Metrology MCH Case MeasurementSupporting Test Equipment Required Heatsink Thermal Performance Ψ CAIHS Groove Thermal Calibration and ControlsThermocouple Attach Support Equipment IHS Groove Dimensions Thermocouple Conditioning and Preparation Thermocouple Attachment to IHSSecuring Thermocouple Wires with Kapton Tape Prior to Attach Thermocouple Bead Placement Using 3D Micromanipulator to Secure Bead Location Curing Process Applying Adhesive on Thermocouple BeadThermocouple Wire Management Thermocouple Wire Management in GrooveReference Thermal Solution Power Simulation SoftwareThermal Performance AdvancedTCA* Reference HeatsinkMechanical Design Envelope Board-level Components Keepout Dimensions Torsional Clip Heatsink Thermal Solution AssemblyHeatsink Orientation Extruded Heatsink ProfilesMechanical Interface Material Thermal Interface MaterialClip Retention Anchors Heatsink ClipReliability Guidelines CompactPCI* Reference Heatsink Component OverviewReliability Guidelines Test Requirement Pass/Fail CriteriaReliability Guidelines Thermal Solution Performance CharacteristicsReliability Requirements Mechanical Drawing List Appendix a Mechanical DrawingsDrawing Description AdvancedTCA* Heatsink Assembly Drawing AdvancedTCA* Heatsink Drawing AdvancedTCA* Component Keepout Zone CompactPCI* Heatsink Assembly Drawing CompactPCI* Heatsink Drawing CompactPCI* Component Keepout Zone Torsional Clip Heatsink Clip Drawing TIM2 Drawing Appendix B Thermal Solution Component Suppliers MCH Torsional Clip Heatsink Thermal Solution

5100 specifications

The Intel 5100, officially known as the Intel Core 2 Duo Processor T5100, is a notable entry in Intel's line of mobile processors, designed primarily for laptops and portable computing devices. Released in early 2007, it targets users seeking a balance between performance and energy efficiency.

At its core, the Intel 5100 features a dual-core architecture that allows it to handle multiple tasks simultaneously, significantly improving multitasking capabilities compared to single-core processors. Clocked at a speed of 1.6 GHz, it provides robust performance for everyday computing tasks such as web browsing, document editing, and casual gaming.

One of the key technologies integrated into the Intel 5100 is Intel's 64-bit architecture, which enables the processor to utilize more than 4GB of RAM, catering to modern computing needs. This feature is particularly beneficial for users running demanding applications or multitasking, as it provides increased processing power and efficiency.

The Intel 5100 also incorporates Intel's Enhanced Intel SpeedStep Technology, which optimizes power consumption by dynamically adjusting the processor's frequency and voltage based on workload. This not only extends battery life in portable devices but also helps in reducing heat output, promoting a cooler computing experience.

Another significant aspect of the Intel 5100 is its support for Intel Virtualization Technology (VT-x). This feature allows multiple operating systems to run concurrently on the same machine, making it an excellent choice for developers and IT professionals who require virtual environments for testing and development purposes.

The processor is built on a 65nm process technology, which contributes to its energy efficiency and thermal management. With a Thermal Design Power (TDP) of just 35 watts, it remains within a reasonable thermal envelope, suitable for laptop designs without requiring excessive cooling solutions.

In terms of connectivity, the Intel 5100 supports a range of communication technologies. It is commonly paired with Intel’s 965GM chipset, which enhances graphics capabilities through Intel GMA X3100 integrated graphics, offering decent performance for standard visual tasks.

Overall, the Intel 5100 represents a solid choice for users seeking a combination of performance, efficiency, and advanced features, making it a reliable processor option for laptops in the mid to late 2000s. With its dual-core capabilities, 64-bit support, and energy-efficient design, it paved the way for future developments in mobile computing technology.