Intel 5100 manual Processor Thermal Characterization Parameter Relationships

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Intel® 5100 MCH Chipset

The case-to-local ambient thermal characterization parameter (ΨCA) is used as a measure of the thermal performance of the overall thermal solution. It is defined by Equation 1 and is measured in units of °C/W.

Equation 1. Case-to-local Ambient Thermal Characterization Parameter (ΨCA)

ΨCA =

TCASE – TLA

----------TDP---------------

The case-to-local ambient thermal characterization parameter, ΨCA, is comprised of ΨCS, the thermal interface material (TIM) thermal characterization parameter, and of ΨSA, the sink-to-local ambient thermal characterization parameter.

Equation 2. Case-to-local Ambient Thermal Characterization Parameter (ΨCA)

ΨCA = ΨCS + ΨSA

ΨCS is strongly dependent on the thermal conductivity and thickness of the TIM between the heatsink and device package.

ΨSA is a measure of the thermal characterization parameter from the bottom of the heatsink to the local ambient air. ΨSA is dependent on the heatsink material, thermal conductivity, and geometry. It is also strongly dependent on the air velocity through the fins of the heatsink. Figure 5 illustrates the combination of the different thermal characterization parameters.

Figure 5. Processor Thermal Characterization Parameter Relationships

TA

ΨSA

ΨCA

TS

TIM

ΨCS

TC

Device

Example 1. Calculating the Required Thermal Performance

The cooling performance, ΨCA, is defined using the thermal characterization parameter previously described. The process to determine the required thermal performance to cool the device includes the following.

1. Define a target component temperature TCASE and corresponding TDP.

Intel® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

July 2008

TDG

Order Number: 318676-003US

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Contents Revision 003US Thermal/Mechanical Design GuideTDG Contents Tables FiguresRevision Number Descriptions Revision HistoryDate Revision Description Design Flow IntroductionDefinition of Terms Definition of TermsTerm Definition Related Documents Sheet 1 Related DocumentsDocument Document Number/URL Thermal Simulation Packaging TechnologyRelated Documents Sheet 2 MCH Package Dimensions Side View MCH Package Dimensions Top ViewPackage Mechanical Requirements MCH Package Dimensions Bottom ViewThermal Solution Requirements Thermal SpecificationsThermal Design Power TDP Case TemperatureExample 1. Calculating the Required Thermal Performance Processor Thermal Characterization Parameter Relationships105 MCH Case Measurement Thermal MetrologySupporting Test Equipment Required Heatsink Thermal Performance Ψ CAIHS Groove Thermal Calibration and ControlsThermocouple Attach Support Equipment IHS Groove Dimensions Thermocouple Attachment to IHS Thermocouple Conditioning and PreparationSecuring Thermocouple Wires with Kapton Tape Prior to Attach Thermocouple Bead Placement Using 3D Micromanipulator to Secure Bead Location Applying Adhesive on Thermocouple Bead Curing ProcessThermocouple Wire Management in Groove Thermocouple Wire ManagementPower Simulation Software Reference Thermal SolutionThermal Performance AdvancedTCA* Reference HeatsinkMechanical Design Envelope Torsional Clip Heatsink Thermal Solution Assembly Board-level Components Keepout DimensionsExtruded Heatsink Profiles Heatsink OrientationMechanical Interface Material Thermal Interface MaterialClip Retention Anchors Heatsink ClipReliability Guidelines Component Overview CompactPCI* Reference HeatsinkReliability Guidelines Test Requirement Pass/Fail CriteriaReliability Guidelines Thermal Solution Performance CharacteristicsReliability Requirements Mechanical Drawing List Appendix a Mechanical DrawingsDrawing Description AdvancedTCA* Heatsink Assembly Drawing AdvancedTCA* Heatsink Drawing AdvancedTCA* Component Keepout Zone CompactPCI* Heatsink Assembly Drawing CompactPCI* Heatsink Drawing CompactPCI* Component Keepout Zone Torsional Clip Heatsink Clip Drawing TIM2 Drawing MCH Torsional Clip Heatsink Thermal Solution Appendix B Thermal Solution Component Suppliers

5100 specifications

The Intel 5100, officially known as the Intel Core 2 Duo Processor T5100, is a notable entry in Intel's line of mobile processors, designed primarily for laptops and portable computing devices. Released in early 2007, it targets users seeking a balance between performance and energy efficiency.

At its core, the Intel 5100 features a dual-core architecture that allows it to handle multiple tasks simultaneously, significantly improving multitasking capabilities compared to single-core processors. Clocked at a speed of 1.6 GHz, it provides robust performance for everyday computing tasks such as web browsing, document editing, and casual gaming.

One of the key technologies integrated into the Intel 5100 is Intel's 64-bit architecture, which enables the processor to utilize more than 4GB of RAM, catering to modern computing needs. This feature is particularly beneficial for users running demanding applications or multitasking, as it provides increased processing power and efficiency.

The Intel 5100 also incorporates Intel's Enhanced Intel SpeedStep Technology, which optimizes power consumption by dynamically adjusting the processor's frequency and voltage based on workload. This not only extends battery life in portable devices but also helps in reducing heat output, promoting a cooler computing experience.

Another significant aspect of the Intel 5100 is its support for Intel Virtualization Technology (VT-x). This feature allows multiple operating systems to run concurrently on the same machine, making it an excellent choice for developers and IT professionals who require virtual environments for testing and development purposes.

The processor is built on a 65nm process technology, which contributes to its energy efficiency and thermal management. With a Thermal Design Power (TDP) of just 35 watts, it remains within a reasonable thermal envelope, suitable for laptop designs without requiring excessive cooling solutions.

In terms of connectivity, the Intel 5100 supports a range of communication technologies. It is commonly paired with Intel’s 965GM chipset, which enhances graphics capabilities through Intel GMA X3100 integrated graphics, offering decent performance for standard visual tasks.

Overall, the Intel 5100 represents a solid choice for users seeking a combination of performance, efficiency, and advanced features, making it a reliable processor option for laptops in the mid to late 2000s. With its dual-core capabilities, 64-bit support, and energy-efficient design, it paved the way for future developments in mobile computing technology.
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