Intel 5100 manual Thermocouple Wire Management in Groove

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Intel® 5100 MCH Chipset

5.1.7Thermocouple Wire Management

Figure 15. Thermocouple Wire Management in Groove

Figure 16. Removing Excess Adhesive from IHS

Intel® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

July 2008	TDG
Order Number: 318676-003US	23

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Contents Revision 003US Thermal/Mechanical Design GuideTDG Contents Tables FiguresDate Revision Description Revision HistoryRevision Number Descriptions Design Flow IntroductionTerm Definition Definition of TermsDefinition of Terms Document Document Number/URL Related DocumentsRelated Documents Sheet 1 Related Documents Sheet 2 Packaging TechnologyThermal Simulation MCH Package Dimensions Side View MCH Package Dimensions Top ViewPackage Mechanical Requirements MCH Package Dimensions Bottom ViewCase Temperature Thermal SpecificationsThermal Solution Requirements Thermal Design Power TDPExample 1. Calculating the Required Thermal Performance Processor Thermal Characterization Parameter Relationships105 Required Heatsink Thermal Performance Ψ CA Thermal MetrologyMCH Case Measurement Supporting Test EquipmentThermocouple Attach Support Equipment Thermal Calibration and ControlsIHS Groove IHS Groove Dimensions Thermocouple Attachment to IHS Thermocouple Conditioning and PreparationSecuring Thermocouple Wires with Kapton Tape Prior to Attach Thermocouple Bead Placement Using 3D Micromanipulator to Secure Bead Location Applying Adhesive on Thermocouple Bead Curing ProcessThermocouple Wire Management in Groove Thermocouple Wire ManagementPower Simulation Software Reference Thermal SolutionMechanical Design Envelope AdvancedTCA* Reference HeatsinkThermal Performance Torsional Clip Heatsink Thermal Solution Assembly Board-level Components Keepout DimensionsThermal Interface Material Heatsink OrientationExtruded Heatsink Profiles Mechanical Interface MaterialReliability Guidelines Heatsink ClipClip Retention Anchors Test Requirement Pass/Fail Criteria CompactPCI* Reference HeatsinkComponent Overview Reliability GuidelinesReliability Requirements Thermal Solution Performance CharacteristicsReliability Guidelines Drawing Description Appendix a Mechanical DrawingsMechanical Drawing List AdvancedTCA* Heatsink Assembly Drawing AdvancedTCA* Heatsink Drawing AdvancedTCA* Component Keepout Zone CompactPCI* Heatsink Assembly Drawing CompactPCI* Heatsink Drawing CompactPCI* Component Keepout Zone Torsional Clip Heatsink Clip Drawing TIM2 Drawing MCH Torsional Clip Heatsink Thermal Solution Appendix B Thermal Solution Component Suppliers