Intel 5100 manual CompactPCI* Component Keepout Zone

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Intel® 5100 MCH Chipset

Figure 28. CompactPCI* Component Keepout Zone

Intel® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

July 2008	TDG
Order Number: 318676-003US	37

Image 37

Contents Revision 003US Thermal/Mechanical Design GuideTDG Contents Tables FiguresRevision Number Descriptions Revision HistoryDate Revision Description Design Flow IntroductionDefinition of Terms Definition of TermsTerm Definition Related Documents Sheet 1 Related DocumentsDocument Document Number/URL Thermal Simulation Packaging TechnologyRelated Documents Sheet 2 MCH Package Dimensions Side View MCH Package Dimensions Top ViewPackage Mechanical Requirements MCH Package Dimensions Bottom ViewThermal Solution Requirements Thermal SpecificationsThermal Design Power TDP Case TemperatureExample 1. Calculating the Required Thermal Performance Processor Thermal Characterization Parameter Relationships105 MCH Case Measurement Thermal MetrologySupporting Test Equipment Required Heatsink Thermal Performance Ψ CAIHS Groove Thermal Calibration and ControlsThermocouple Attach Support Equipment IHS Groove Dimensions Thermocouple Attachment to IHS Thermocouple Conditioning and PreparationSecuring Thermocouple Wires with Kapton Tape Prior to Attach Thermocouple Bead Placement Using 3D Micromanipulator to Secure Bead Location Applying Adhesive on Thermocouple Bead Curing ProcessThermocouple Wire Management in Groove Thermocouple Wire ManagementPower Simulation Software Reference Thermal SolutionThermal Performance AdvancedTCA* Reference HeatsinkMechanical Design Envelope Torsional Clip Heatsink Thermal Solution Assembly Board-level Components Keepout DimensionsExtruded Heatsink Profiles Heatsink OrientationMechanical Interface Material Thermal Interface MaterialClip Retention Anchors Heatsink ClipReliability Guidelines Component Overview CompactPCI* Reference HeatsinkReliability Guidelines Test Requirement Pass/Fail CriteriaReliability Guidelines Thermal Solution Performance CharacteristicsReliability Requirements Mechanical Drawing List Appendix a Mechanical DrawingsDrawing Description AdvancedTCA* Heatsink Assembly Drawing AdvancedTCA* Heatsink Drawing AdvancedTCA* Component Keepout Zone CompactPCI* Heatsink Assembly Drawing CompactPCI* Heatsink Drawing CompactPCI* Component Keepout Zone Torsional Clip Heatsink Clip Drawing TIM2 Drawing MCH Torsional Clip Heatsink Thermal Solution Appendix B Thermal Solution Component Suppliers