Intel 5100 manual CompactPCI* Reference Heatsink, Component Overview, Reliability Guidelines

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Intel® 5100 MCH Chipset

Table 7.

Reliability Guidelines

 

 

 

 

 

Test1

 

Requirement

Pass/Fail Criteria2

Mechanical Shock

50 g, board level, 11 ms, three shocks/axis

Visual Check and Electrical Functional Test

 

 

 

Random Vibration

7.3 g, board level, 45 minutes/axis, 50 Hz to 2000 Hz

Visual Check and Electrical Functional Test

 

 

 

 

Temperature Life

 

85 °C, 2000 hours total, checkpoints at 168, 500, 1000,

Visual Check

 

and 2000 hours

 

 

 

 

 

 

 

Thermal Cycling

 

-5 °C to +70 °C, 500 cycles

Visual Check

 

 

 

 

Humidity

 

85% relative humidity, 55 °C, 1000 hours

Visual Check

 

 

 

 

Notes:

1.It is recommended that the above tests be performed on a sample size of at least 12 assemblies from three lots of material.

2.Additional pass/fail criteria may be added at the discretion of the user.

6.2CompactPCI* Reference Heatsink

Intel has also developed a reference thermal solution compatible with the CompactPCI* form factor. The reference solution was developed assuming a maximum ambient temperature of 67 °C with a minimum volumetric airflow rate of 10 CFM through each slot. Assuming these boundary conditions are met, the reference thermal solution meets the thermal specifications for Intel® 5100 Memory Controller Hub Chipset.

6.2.1Component Overview

The CompactPCI* reference heatsink is an extruded aluminum heatsink and does not share the same volumetric footprint as the AdvancedTCA* reference heatsink. Full mechanical drawings of the thermal solution assembly, full mechanical drawings, volumetric footprint, and the heatsink clip are provided in Appendix A. It uses the same spring clip retention and Honeywell* PCM45F Thermal Interface Material (TIM) as the AdvancedTCA* reference solution.

Figure 21 shows the isometric view of the CompactPCI* reference heatsink.

Figure 21. Isometric View of the CompactPCI* Reference Heatsink

Note: Refer to Appendix A for more detailed mechanical drawings of the heatsink.

Intel® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

July 2008

TDG

Order Number: 318676-003US

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Contents Revision 003US Thermal/Mechanical Design GuideTDG Contents Tables FiguresDate Revision Description Revision HistoryRevision Number Descriptions Design Flow IntroductionTerm Definition Definition of TermsDefinition of Terms Document Document Number/URL Related DocumentsRelated Documents Sheet 1 Related Documents Sheet 2 Packaging TechnologyThermal Simulation MCH Package Dimensions Side View MCH Package Dimensions Top ViewPackage Mechanical Requirements MCH Package Dimensions Bottom ViewThermal Solution Requirements Thermal SpecificationsThermal Design Power TDP Case TemperatureExample 1. Calculating the Required Thermal Performance Processor Thermal Characterization Parameter Relationships105 MCH Case Measurement Thermal MetrologySupporting Test Equipment Required Heatsink Thermal Performance Ψ CAThermocouple Attach Support Equipment Thermal Calibration and ControlsIHS Groove IHS Groove Dimensions Thermocouple Attachment to IHS Thermocouple Conditioning and PreparationSecuring Thermocouple Wires with Kapton Tape Prior to Attach Thermocouple Bead Placement Using 3D Micromanipulator to Secure Bead Location Applying Adhesive on Thermocouple Bead Curing ProcessThermocouple Wire Management in Groove Thermocouple Wire ManagementPower Simulation Software Reference Thermal SolutionMechanical Design Envelope AdvancedTCA* Reference HeatsinkThermal Performance Torsional Clip Heatsink Thermal Solution Assembly Board-level Components Keepout DimensionsExtruded Heatsink Profiles Heatsink OrientationMechanical Interface Material Thermal Interface MaterialReliability Guidelines Heatsink ClipClip Retention Anchors Component Overview CompactPCI* Reference HeatsinkReliability Guidelines Test Requirement Pass/Fail CriteriaReliability Requirements Thermal Solution Performance CharacteristicsReliability Guidelines Drawing Description Appendix a Mechanical DrawingsMechanical Drawing List AdvancedTCA* Heatsink Assembly Drawing AdvancedTCA* Heatsink Drawing AdvancedTCA* Component Keepout Zone CompactPCI* Heatsink Assembly Drawing CompactPCI* Heatsink Drawing CompactPCI* Component Keepout Zone Torsional Clip Heatsink Clip Drawing TIM2 Drawing MCH Torsional Clip Heatsink Thermal Solution Appendix B Thermal Solution Component Suppliers

5100 specifications

The Intel 5100, officially known as the Intel Core 2 Duo Processor T5100, is a notable entry in Intel's line of mobile processors, designed primarily for laptops and portable computing devices. Released in early 2007, it targets users seeking a balance between performance and energy efficiency.

At its core, the Intel 5100 features a dual-core architecture that allows it to handle multiple tasks simultaneously, significantly improving multitasking capabilities compared to single-core processors. Clocked at a speed of 1.6 GHz, it provides robust performance for everyday computing tasks such as web browsing, document editing, and casual gaming.

One of the key technologies integrated into the Intel 5100 is Intel's 64-bit architecture, which enables the processor to utilize more than 4GB of RAM, catering to modern computing needs. This feature is particularly beneficial for users running demanding applications or multitasking, as it provides increased processing power and efficiency.

The Intel 5100 also incorporates Intel's Enhanced Intel SpeedStep Technology, which optimizes power consumption by dynamically adjusting the processor's frequency and voltage based on workload. This not only extends battery life in portable devices but also helps in reducing heat output, promoting a cooler computing experience.

Another significant aspect of the Intel 5100 is its support for Intel Virtualization Technology (VT-x). This feature allows multiple operating systems to run concurrently on the same machine, making it an excellent choice for developers and IT professionals who require virtual environments for testing and development purposes.

The processor is built on a 65nm process technology, which contributes to its energy efficiency and thermal management. With a Thermal Design Power (TDP) of just 35 watts, it remains within a reasonable thermal envelope, suitable for laptop designs without requiring excessive cooling solutions.

In terms of connectivity, the Intel 5100 supports a range of communication technologies. It is commonly paired with Intel’s 965GM chipset, which enhances graphics capabilities through Intel GMA X3100 integrated graphics, offering decent performance for standard visual tasks.

Overall, the Intel 5100 represents a solid choice for users seeking a combination of performance, efficiency, and advanced features, making it a reliable processor option for laptops in the mid to late 2000s. With its dual-core capabilities, 64-bit support, and energy-efficient design, it paved the way for future developments in mobile computing technology.
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