Intel 5100 manual Curing Process, Applying Adhesive on Thermocouple Bead

Page 22

Intel® 5100 MCH Chipset

Figure 14. Applying Adhesive on Thermocouple Bead

5.1.6Curing Process

1.Let the thermocouple attach sit in the open air for at least half an hour. Using any curing accelerator like the Locite* 7452 Tak Pak* accelerator for this step is not recommended. Rapid contraction of the adhesive during curing may weaken bead attach on the IHS.

2.Reconfirm electrical connectivity with the DMM before removing the micromanipulator. See Section 5.1.4, step 2., and Figure 13.

3.Remove the 3D arm needle by holding down the MCH unit and lifting the arm.

4.Remove the Kapton tape, and straighten the wire in the groove so that it is flat all the way to the end of the groove (Figure 15).

5.Using a blade, shave excess adhesive above the IHS surface (Figure 16).

Note: Take usual precautions when using open blades.

6.Install new Kapton tape to hold the thermocouple wire down, and fill the rest of the groove with adhesive (Figure 17). Make sure the wire and insulation is entirely within the groove and below the IHS surface.

7.Curing time for the rest of the adhesive in the groove can be reduced using the Locite* 7452 Tak Pak* accelerator.

8.Repeat step 5. to remove any access adhesive to ensure a flat IHS for proper mechanical contact to the heatsink surface.

Intel® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

TDG

July 2008

22

Order Number: 318676-003US

Page 21 Page 23
Image 22
Page 21 Page 23
Contents Thermal/Mechanical Design Guide Revision 003USTDG Contents Figures TablesRevision Number Descriptions Revision HistoryDate Revision Description Introduction Design FlowDefinition of Terms Definition of TermsTerm Definition Related Documents Sheet 1 Related DocumentsDocument Document Number/URL Thermal Simulation Packaging TechnologyRelated Documents Sheet 2 MCH Package Dimensions Top View MCH Package Dimensions Side ViewMCH Package Dimensions Bottom View Package Mechanical RequirementsThermal Design Power TDP Thermal SpecificationsThermal Solution Requirements Case TemperatureProcessor Thermal Characterization Parameter Relationships Example 1. Calculating the Required Thermal Performance105 Supporting Test Equipment Thermal MetrologyMCH Case Measurement Required Heatsink Thermal Performance Ψ CAIHS Groove Thermal Calibration and ControlsThermocouple Attach Support Equipment IHS Groove Dimensions Thermocouple Conditioning and Preparation Thermocouple Attachment to IHSSecuring Thermocouple Wires with Kapton Tape Prior to Attach Thermocouple Bead Placement Using 3D Micromanipulator to Secure Bead Location Curing Process Applying Adhesive on Thermocouple BeadThermocouple Wire Management Thermocouple Wire Management in GrooveReference Thermal Solution Power Simulation SoftwareThermal Performance AdvancedTCA* Reference HeatsinkMechanical Design Envelope Board-level Components Keepout Dimensions Torsional Clip Heatsink Thermal Solution AssemblyMechanical Interface Material Heatsink OrientationExtruded Heatsink Profiles Thermal Interface MaterialClip Retention Anchors Heatsink ClipReliability Guidelines Reliability Guidelines CompactPCI* Reference HeatsinkComponent Overview Test Requirement Pass/Fail CriteriaReliability Guidelines Thermal Solution Performance CharacteristicsReliability Requirements Mechanical Drawing List Appendix a Mechanical DrawingsDrawing Description AdvancedTCA* Heatsink Assembly Drawing AdvancedTCA* Heatsink Drawing AdvancedTCA* Component Keepout Zone CompactPCI* Heatsink Assembly Drawing CompactPCI* Heatsink Drawing CompactPCI* Component Keepout Zone Torsional Clip Heatsink Clip Drawing TIM2 Drawing Appendix B Thermal Solution Component Suppliers MCH Torsional Clip Heatsink Thermal Solution

5100 specifications

The Intel 5100, officially known as the Intel Core 2 Duo Processor T5100, is a notable entry in Intel's line of mobile processors, designed primarily for laptops and portable computing devices. Released in early 2007, it targets users seeking a balance between performance and energy efficiency.

At its core, the Intel 5100 features a dual-core architecture that allows it to handle multiple tasks simultaneously, significantly improving multitasking capabilities compared to single-core processors. Clocked at a speed of 1.6 GHz, it provides robust performance for everyday computing tasks such as web browsing, document editing, and casual gaming.

One of the key technologies integrated into the Intel 5100 is Intel's 64-bit architecture, which enables the processor to utilize more than 4GB of RAM, catering to modern computing needs. This feature is particularly beneficial for users running demanding applications or multitasking, as it provides increased processing power and efficiency.

The Intel 5100 also incorporates Intel's Enhanced Intel SpeedStep Technology, which optimizes power consumption by dynamically adjusting the processor's frequency and voltage based on workload. This not only extends battery life in portable devices but also helps in reducing heat output, promoting a cooler computing experience.

Another significant aspect of the Intel 5100 is its support for Intel Virtualization Technology (VT-x). This feature allows multiple operating systems to run concurrently on the same machine, making it an excellent choice for developers and IT professionals who require virtual environments for testing and development purposes.

The processor is built on a 65nm process technology, which contributes to its energy efficiency and thermal management. With a Thermal Design Power (TDP) of just 35 watts, it remains within a reasonable thermal envelope, suitable for laptop designs without requiring excessive cooling solutions.

In terms of connectivity, the Intel 5100 supports a range of communication technologies. It is commonly paired with Intel’s 965GM chipset, which enhances graphics capabilities through Intel GMA X3100 integrated graphics, offering decent performance for standard visual tasks.

Overall, the Intel 5100 represents a solid choice for users seeking a combination of performance, efficiency, and advanced features, making it a reliable processor option for laptops in the mid to late 2000s. With its dual-core capabilities, 64-bit support, and energy-efficient design, it paved the way for future developments in mobile computing technology.
Top Page Image Contents