Intel 5100 manual Heatsink Orientation, Extruded Heatsink Profiles, Mechanical Interface Material

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Intel® 5100 MCH Chipset

Full mechanical drawings of the thermal solution assembly and the heatsink clip are provided in Appendix A. Appendix B contains vendor information for each thermal solution component.

6.1.5Heatsink Orientation

Because this solution is based on a unidirectional heatsink, the mean airflow direction must be aligned with the direction of the heatsink fins.

Figure 20. Torsional Clip Heatsink Assembly

6.1.6Extruded Heatsink Profiles

The reference thermal solution uses an extruded heatsink for cooling the MCH. Appendix B lists a supplier for this extruded heatsink. Other heatsinks with similar dimensions and increased thermal performance may be available. A full mechanical drawing of this heatsink is provided in Appendix A.

6.1.7Mechanical Interface Material

There is no mechanical interface material associated with this reference solution.

6.1.8Thermal Interface Material

A thermal interface material (TIM) provides improved conductivity between the IHS and heatsink. The reference thermal solution uses Honeywell* PCM45F, 0.25 mm (0.010") thick, 25 mm x 25 mm (0.984" x 0.984") squared.

Note: Unflowed or “dry” Honeywell* PCM45F has a material thickness of 0.010". The flowed or “wet” Honeywell* PCM45F has a material thickness of ~0.003" after it reaches its phase change temperature.

Intel® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

July 2008

TDG

Order Number: 318676-003US

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Contents Revision 003US Thermal/Mechanical Design GuideTDG Contents Tables FiguresRevision History Revision Number DescriptionsDate Revision Description Design Flow IntroductionDefinition of Terms Definition of TermsTerm Definition Related Documents Related Documents Sheet 1Document Document Number/URL Packaging Technology Thermal SimulationRelated Documents Sheet 2 MCH Package Dimensions Side View MCH Package Dimensions Top ViewPackage Mechanical Requirements MCH Package Dimensions Bottom ViewCase Temperature Thermal SpecificationsThermal Solution Requirements Thermal Design Power TDPExample 1. Calculating the Required Thermal Performance Processor Thermal Characterization Parameter Relationships105 Required Heatsink Thermal Performance Ψ CA Thermal MetrologyMCH Case Measurement Supporting Test EquipmentThermal Calibration and Controls IHS GrooveThermocouple Attach Support Equipment IHS Groove Dimensions Thermocouple Attachment to IHS Thermocouple Conditioning and PreparationSecuring Thermocouple Wires with Kapton Tape Prior to Attach Thermocouple Bead Placement Using 3D Micromanipulator to Secure Bead Location Applying Adhesive on Thermocouple Bead Curing ProcessThermocouple Wire Management in Groove Thermocouple Wire ManagementPower Simulation Software Reference Thermal SolutionAdvancedTCA* Reference Heatsink Thermal PerformanceMechanical Design Envelope Torsional Clip Heatsink Thermal Solution Assembly Board-level Components Keepout DimensionsThermal Interface Material Heatsink OrientationExtruded Heatsink Profiles Mechanical Interface MaterialHeatsink Clip Clip Retention AnchorsReliability Guidelines Test Requirement Pass/Fail Criteria CompactPCI* Reference HeatsinkComponent Overview Reliability GuidelinesThermal Solution Performance Characteristics Reliability GuidelinesReliability Requirements Appendix a Mechanical Drawings Mechanical Drawing ListDrawing Description AdvancedTCA* Heatsink Assembly Drawing AdvancedTCA* Heatsink Drawing AdvancedTCA* Component Keepout Zone CompactPCI* Heatsink Assembly Drawing CompactPCI* Heatsink Drawing CompactPCI* Component Keepout Zone Torsional Clip Heatsink Clip Drawing TIM2 Drawing MCH Torsional Clip Heatsink Thermal Solution Appendix B Thermal Solution Component Suppliers

5100 specifications

The Intel 5100, officially known as the Intel Core 2 Duo Processor T5100, is a notable entry in Intel's line of mobile processors, designed primarily for laptops and portable computing devices. Released in early 2007, it targets users seeking a balance between performance and energy efficiency.

At its core, the Intel 5100 features a dual-core architecture that allows it to handle multiple tasks simultaneously, significantly improving multitasking capabilities compared to single-core processors. Clocked at a speed of 1.6 GHz, it provides robust performance for everyday computing tasks such as web browsing, document editing, and casual gaming.

One of the key technologies integrated into the Intel 5100 is Intel's 64-bit architecture, which enables the processor to utilize more than 4GB of RAM, catering to modern computing needs. This feature is particularly beneficial for users running demanding applications or multitasking, as it provides increased processing power and efficiency.

The Intel 5100 also incorporates Intel's Enhanced Intel SpeedStep Technology, which optimizes power consumption by dynamically adjusting the processor's frequency and voltage based on workload. This not only extends battery life in portable devices but also helps in reducing heat output, promoting a cooler computing experience.

Another significant aspect of the Intel 5100 is its support for Intel Virtualization Technology (VT-x). This feature allows multiple operating systems to run concurrently on the same machine, making it an excellent choice for developers and IT professionals who require virtual environments for testing and development purposes.

The processor is built on a 65nm process technology, which contributes to its energy efficiency and thermal management. With a Thermal Design Power (TDP) of just 35 watts, it remains within a reasonable thermal envelope, suitable for laptop designs without requiring excessive cooling solutions.

In terms of connectivity, the Intel 5100 supports a range of communication technologies. It is commonly paired with Intel’s 965GM chipset, which enhances graphics capabilities through Intel GMA X3100 integrated graphics, offering decent performance for standard visual tasks.

Overall, the Intel 5100 represents a solid choice for users seeking a combination of performance, efficiency, and advanced features, making it a reliable processor option for laptops in the mid to late 2000s. With its dual-core capabilities, 64-bit support, and energy-efficient design, it paved the way for future developments in mobile computing technology.
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