Intel 5100 manual Appendix a Mechanical Drawings, Mechanical Drawing List, Drawing Description

Page 31

Intel® 5100 MCH Chipset

Appendix A Mechanical Drawings

 

Table 9 lists the mechanical drawings included in this appendix.

Table 9.

Mechanical Drawing List

 

 

 

 

 

Drawing Description

Figure Number

 

 

 

 

AdvancedTCA* Heatsink Assembly

Figure 23

 

 

 

 

AdvancedTCA* Heatsink

Figure 24

 

 

 

 

AdvancedTCA* Component Keepout Zone

Figure 25

 

 

 

 

CompactPCI* Heatsink Assembly

Figure 26

 

 

 

 

CompactPCI* Heatsink

Figure 27

 

 

 

 

CompactPCI* Component Keepout Zone

Figure 28

 

 

 

 

Reference Heatsink Torsional Clip

Figure 29

 

 

 

 

TIM2

Figure 30

 

 

 

Intel® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

July 2008

TDG

Order Number: 318676-003US

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Contents Revision 003US Thermal/Mechanical Design GuideTDG Contents Tables FiguresRevision Number Descriptions Revision HistoryDate Revision Description Design Flow IntroductionDefinition of Terms Definition of TermsTerm Definition Related Documents Sheet 1 Related DocumentsDocument Document Number/URL Thermal Simulation Packaging TechnologyRelated Documents Sheet 2 MCH Package Dimensions Side View MCH Package Dimensions Top ViewPackage Mechanical Requirements MCH Package Dimensions Bottom ViewCase Temperature Thermal SpecificationsThermal Solution Requirements Thermal Design Power TDPExample 1. Calculating the Required Thermal Performance Processor Thermal Characterization Parameter Relationships105 Required Heatsink Thermal Performance Ψ CA Thermal MetrologyMCH Case Measurement Supporting Test EquipmentIHS Groove Thermal Calibration and ControlsThermocouple Attach Support Equipment IHS Groove Dimensions Thermocouple Attachment to IHS Thermocouple Conditioning and PreparationSecuring Thermocouple Wires with Kapton Tape Prior to Attach Thermocouple Bead Placement Using 3D Micromanipulator to Secure Bead Location Applying Adhesive on Thermocouple Bead Curing ProcessThermocouple Wire Management in Groove Thermocouple Wire ManagementPower Simulation Software Reference Thermal SolutionThermal Performance AdvancedTCA* Reference HeatsinkMechanical Design Envelope Torsional Clip Heatsink Thermal Solution Assembly Board-level Components Keepout DimensionsThermal Interface Material Heatsink OrientationExtruded Heatsink Profiles Mechanical Interface MaterialClip Retention Anchors Heatsink ClipReliability Guidelines Test Requirement Pass/Fail Criteria CompactPCI* Reference HeatsinkComponent Overview Reliability GuidelinesReliability Guidelines Thermal Solution Performance CharacteristicsReliability Requirements Mechanical Drawing List Appendix a Mechanical DrawingsDrawing Description AdvancedTCA* Heatsink Assembly Drawing AdvancedTCA* Heatsink Drawing AdvancedTCA* Component Keepout Zone CompactPCI* Heatsink Assembly Drawing CompactPCI* Heatsink Drawing CompactPCI* Component Keepout Zone Torsional Clip Heatsink Clip Drawing TIM2 Drawing MCH Torsional Clip Heatsink Thermal Solution Appendix B Thermal Solution Component Suppliers

5100 specifications

The Intel 5100, officially known as the Intel Core 2 Duo Processor T5100, is a notable entry in Intel's line of mobile processors, designed primarily for laptops and portable computing devices. Released in early 2007, it targets users seeking a balance between performance and energy efficiency.

At its core, the Intel 5100 features a dual-core architecture that allows it to handle multiple tasks simultaneously, significantly improving multitasking capabilities compared to single-core processors. Clocked at a speed of 1.6 GHz, it provides robust performance for everyday computing tasks such as web browsing, document editing, and casual gaming.

One of the key technologies integrated into the Intel 5100 is Intel's 64-bit architecture, which enables the processor to utilize more than 4GB of RAM, catering to modern computing needs. This feature is particularly beneficial for users running demanding applications or multitasking, as it provides increased processing power and efficiency.

The Intel 5100 also incorporates Intel's Enhanced Intel SpeedStep Technology, which optimizes power consumption by dynamically adjusting the processor's frequency and voltage based on workload. This not only extends battery life in portable devices but also helps in reducing heat output, promoting a cooler computing experience.

Another significant aspect of the Intel 5100 is its support for Intel Virtualization Technology (VT-x). This feature allows multiple operating systems to run concurrently on the same machine, making it an excellent choice for developers and IT professionals who require virtual environments for testing and development purposes.

The processor is built on a 65nm process technology, which contributes to its energy efficiency and thermal management. With a Thermal Design Power (TDP) of just 35 watts, it remains within a reasonable thermal envelope, suitable for laptop designs without requiring excessive cooling solutions.

In terms of connectivity, the Intel 5100 supports a range of communication technologies. It is commonly paired with Intel’s 965GM chipset, which enhances graphics capabilities through Intel GMA X3100 integrated graphics, offering decent performance for standard visual tasks.

Overall, the Intel 5100 represents a solid choice for users seeking a combination of performance, efficiency, and advanced features, making it a reliable processor option for laptops in the mid to late 2000s. With its dual-core capabilities, 64-bit support, and energy-efficient design, it paved the way for future developments in mobile computing technology.
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