Intel 5100 manual Board-level Components Keepout Dimensions

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Intel® 5100 MCH Chipset

When using heatsinks that extend beyond the MCH chipset reference heatsink envelope shown in Figure 19, any motherboard components placed between the heatsink and motherboard cannot exceed 2 mm (0.07") in height.

Figure 19. AdvancedTCA* Torsional Clip Heatsink Volumetric Envelope for MCH Heatsink

6.1.3Board-level Components Keepout Dimensions

The location of hole patterns and keepout zones for the AdvancedTCA* reference thermal solution are shown in Figure 25. This reference thermal solution has the same hole patterns as that of the Intel® E7500 Series Chipset and Intel® 5000 Series Chipset.

6.1.4Torsional Clip Heatsink Thermal Solution Assembly

The reference thermal solution for the MCH is a passive extruded heatsink with a thermal interface. It is attached using a clip with each end hooked through an anchor soldered to the board. Figure 20 shows the reference thermal solution assembly and associated components. The torsional clip and the clip retention anchor are the same as the ones used on the Intel® E7500 Series Chipset reference thermal solution.

Intel® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

TDG

July 2008

26

Order Number: 318676-003US

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Contents Thermal/Mechanical Design Guide Revision 003USTDG Contents Figures TablesDate Revision Description Revision HistoryRevision Number Descriptions Introduction Design FlowTerm Definition Definition of TermsDefinition of Terms Document Document Number/URL Related DocumentsRelated Documents Sheet 1 Related Documents Sheet 2 Packaging TechnologyThermal Simulation MCH Package Dimensions Top View MCH Package Dimensions Side ViewMCH Package Dimensions Bottom View Package Mechanical RequirementsThermal Design Power TDP Thermal SpecificationsThermal Solution Requirements Case TemperatureProcessor Thermal Characterization Parameter Relationships Example 1. Calculating the Required Thermal Performance105 Supporting Test Equipment Thermal MetrologyMCH Case Measurement Required Heatsink Thermal Performance Ψ CAThermocouple Attach Support Equipment Thermal Calibration and ControlsIHS Groove IHS Groove Dimensions Thermocouple Conditioning and Preparation Thermocouple Attachment to IHSSecuring Thermocouple Wires with Kapton Tape Prior to Attach Thermocouple Bead Placement Using 3D Micromanipulator to Secure Bead Location Curing Process Applying Adhesive on Thermocouple BeadThermocouple Wire Management Thermocouple Wire Management in GrooveReference Thermal Solution Power Simulation SoftwareMechanical Design Envelope AdvancedTCA* Reference HeatsinkThermal Performance Board-level Components Keepout Dimensions Torsional Clip Heatsink Thermal Solution AssemblyMechanical Interface Material Heatsink OrientationExtruded Heatsink Profiles Thermal Interface MaterialReliability Guidelines Heatsink ClipClip Retention Anchors Reliability Guidelines CompactPCI* Reference HeatsinkComponent Overview Test Requirement Pass/Fail CriteriaReliability Requirements Thermal Solution Performance CharacteristicsReliability Guidelines Drawing Description Appendix a Mechanical DrawingsMechanical Drawing List AdvancedTCA* Heatsink Assembly Drawing AdvancedTCA* Heatsink Drawing AdvancedTCA* Component Keepout Zone CompactPCI* Heatsink Assembly Drawing CompactPCI* Heatsink Drawing CompactPCI* Component Keepout Zone Torsional Clip Heatsink Clip Drawing TIM2 Drawing Appendix B Thermal Solution Component Suppliers MCH Torsional Clip Heatsink Thermal Solution

5100 specifications

The Intel 5100, officially known as the Intel Core 2 Duo Processor T5100, is a notable entry in Intel's line of mobile processors, designed primarily for laptops and portable computing devices. Released in early 2007, it targets users seeking a balance between performance and energy efficiency.

At its core, the Intel 5100 features a dual-core architecture that allows it to handle multiple tasks simultaneously, significantly improving multitasking capabilities compared to single-core processors. Clocked at a speed of 1.6 GHz, it provides robust performance for everyday computing tasks such as web browsing, document editing, and casual gaming.

One of the key technologies integrated into the Intel 5100 is Intel's 64-bit architecture, which enables the processor to utilize more than 4GB of RAM, catering to modern computing needs. This feature is particularly beneficial for users running demanding applications or multitasking, as it provides increased processing power and efficiency.

The Intel 5100 also incorporates Intel's Enhanced Intel SpeedStep Technology, which optimizes power consumption by dynamically adjusting the processor's frequency and voltage based on workload. This not only extends battery life in portable devices but also helps in reducing heat output, promoting a cooler computing experience.

Another significant aspect of the Intel 5100 is its support for Intel Virtualization Technology (VT-x). This feature allows multiple operating systems to run concurrently on the same machine, making it an excellent choice for developers and IT professionals who require virtual environments for testing and development purposes.

The processor is built on a 65nm process technology, which contributes to its energy efficiency and thermal management. With a Thermal Design Power (TDP) of just 35 watts, it remains within a reasonable thermal envelope, suitable for laptop designs without requiring excessive cooling solutions.

In terms of connectivity, the Intel 5100 supports a range of communication technologies. It is commonly paired with Intel’s 965GM chipset, which enhances graphics capabilities through Intel GMA X3100 integrated graphics, offering decent performance for standard visual tasks.

Overall, the Intel 5100 represents a solid choice for users seeking a combination of performance, efficiency, and advanced features, making it a reliable processor option for laptops in the mid to late 2000s. With its dual-core capabilities, 64-bit support, and energy-efficient design, it paved the way for future developments in mobile computing technology.
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