Intel 5100 manual Revision History, Revision Number Descriptions, Date Revision Description

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Intel® 5100 MCH Chipset

Revision History

Date

Revision

Description

 

 

 

 

 

Added the CompactPCI* reference solution

July 2008

003

Added Figure 26, Figure 27, and Figure 28

 

 

Updated the supplier information

 

 

 

February 2008

002

Updated the TDPMax config value to 25.7 W in Table 3

November 2007

001

Initial release

 

 

 

Revision Number Descriptions

Revision

Associated Life Cycle Milestone

Release Information

 

 

 

0.0

POP L3 Closure

Initial Documentation - Typically Internal Only

 

 

 

0.1–0.4

When Needed

Project Dependent - Typically Internal Only

 

 

 

0.5

Design Win Phase

First, Required Customer Release

0.6–0.7

When Needed

Project Dependent

 

 

 

0.7

Simulations Complete

Second, Recommended Customer Release

 

 

 

0.8–0.9

When Needed

Project Dependent

 

 

 

1.0

First Silicon Samples

Required Customer Release

1.1–1.4

When Needed

Project Dependent (Recommended)

 

 

 

1.5

Qualification Silicon Samples

Project Dependent

 

 

 

1.6–1.9

When Needed

Project Dependent

 

 

 

NDA - 2.0

First SKU Launch

Required Customer Release - Product Launch

Public - XXXXXX-001

 

 

2.1 and up

When Needed

Project Dependent

 

 

 

Note: Rows highlighted in gray are required revisions.

 

Intel® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

July 2008

TDG

Order Number: 318676-003US

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Contents Revision 003US Thermal/Mechanical Design Guide TDG Contents Tables FiguresDate Revision Description Revision HistoryRevision Number Descriptions Design Flow IntroductionTerm Definition Definition of TermsDefinition of Terms Document Document Number/URL Related DocumentsRelated Documents Sheet 1 Related Documents Sheet 2 Packaging TechnologyThermal Simulation MCH Package Dimensions Side View MCH Package Dimensions Top ViewPackage Mechanical Requirements MCH Package Dimensions Bottom ViewThermal Solution Requirements Thermal SpecificationsThermal Design Power TDP Case TemperatureExample 1. Calculating the Required Thermal Performance Processor Thermal Characterization Parameter Relationships105 MCH Case Measurement Thermal MetrologySupporting Test Equipment Required Heatsink Thermal Performance Ψ CAThermocouple Attach Support Equipment Thermal Calibration and ControlsIHS Groove IHS Groove Dimensions Thermocouple Attachment to IHS Thermocouple Conditioning and PreparationSecuring Thermocouple Wires with Kapton Tape Prior to Attach Thermocouple Bead Placement Using 3D Micromanipulator to Secure Bead Location Applying Adhesive on Thermocouple Bead Curing ProcessThermocouple Wire Management in Groove Thermocouple Wire ManagementPower Simulation Software Reference Thermal SolutionMechanical Design Envelope AdvancedTCA* Reference HeatsinkThermal Performance Torsional Clip Heatsink Thermal Solution Assembly Board-level Components Keepout DimensionsExtruded Heatsink Profiles Heatsink OrientationMechanical Interface Material Thermal Interface MaterialReliability Guidelines Heatsink ClipClip Retention Anchors Component Overview CompactPCI* Reference HeatsinkReliability Guidelines Test Requirement Pass/Fail CriteriaReliability Requirements Thermal Solution Performance CharacteristicsReliability Guidelines Drawing Description Appendix a Mechanical DrawingsMechanical Drawing List AdvancedTCA* Heatsink Assembly Drawing AdvancedTCA* Heatsink Drawing AdvancedTCA* Component Keepout Zone CompactPCI* Heatsink Assembly Drawing CompactPCI* Heatsink Drawing CompactPCI* Component Keepout Zone Torsional Clip Heatsink Clip Drawing TIM2 Drawing MCH Torsional Clip Heatsink Thermal Solution Appendix B Thermal Solution Component Suppliers