Intel 5100 manual Reference Thermal Solution, Power Simulation Software

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Intel® 5100 MCH Chipset

Figure 17. Filling Groove with Adhesive

Note: Prior to installing the heatsink, be sure that the thermocouple wires remain below the

IHS top surface by running a flat blade on top of the IHS, for example.

5.2Power Simulation Software

Power simulation software now exists for the Intel® 5100 MCH Chipset. The power simulation software is a utility designed to dissipate the thermal design power on a Intel® 5100 MCH Chipset when used in conjunction with the Dual-Core Intel® Xeon® processor 5X00 series. The combination of the above mentioned processor(s) and the higher bandwidth capability of the Intel® 5100 MCH Chipset enables higher levels of system performance. To assess the thermal performance of the MCH chipset thermal solution under “worst-case realistic application” conditions, Intel developed a software utility that operates the chipset at near worst-case thermal power dissipation.

The power simulation software developed should only be used to test thermal solutions at or near the thermal design power. Real world applications may exceed the thermal design power limit for transient time periods. For power supply current requirements under these transient conditions, please refer to each component’s datasheet for the ICC (Max Power Supply Current) specification. Contact your Intel field sales representative to order the power simulation software: Intel® 5100 Memory Controller Hub Chipset (embedded) – Maximum Power Application.

6.0Reference Thermal Solution

Intel has developed two reference thermal solutions that meet the cooling needs of the Intel® 5100 MCH Chipset under the embedded operating environments and specifications defined in this document. This chapter describes the overall requirements for the torsional clip heatsink reference thermal solution including critical-to-function dimensions, operating environment, and validation criteria. Other chipset components may or may not need attached thermal solutions depending on your specific system local-ambient operating conditions. For information on the ICH9R, refer to the thermal specification in the Intel® I/O Controller Hub 9 (ICH9) Family Thermal and Mechanical Design Guidelines.

Intel® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

TDG

July 2008

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Order Number: 318676-003US

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Contents Thermal/Mechanical Design Guide Revision 003USTDG Contents Figures TablesRevision History Revision Number DescriptionsDate Revision Description Introduction Design FlowDefinition of Terms Definition of TermsTerm Definition Related Documents Related Documents Sheet 1Document Document Number/URL Packaging Technology Thermal SimulationRelated Documents Sheet 2 MCH Package Dimensions Top View MCH Package Dimensions Side ViewMCH Package Dimensions Bottom View Package Mechanical RequirementsThermal Specifications Thermal Solution RequirementsThermal Design Power TDP Case TemperatureProcessor Thermal Characterization Parameter Relationships Example 1. Calculating the Required Thermal Performance105 Thermal Metrology MCH Case MeasurementSupporting Test Equipment Required Heatsink Thermal Performance Ψ CAThermal Calibration and Controls IHS GrooveThermocouple Attach Support Equipment IHS Groove Dimensions Thermocouple Conditioning and Preparation Thermocouple Attachment to IHSSecuring Thermocouple Wires with Kapton Tape Prior to Attach Thermocouple Bead Placement Using 3D Micromanipulator to Secure Bead Location Curing Process Applying Adhesive on Thermocouple BeadThermocouple Wire Management Thermocouple Wire Management in GrooveReference Thermal Solution Power Simulation SoftwareAdvancedTCA* Reference Heatsink Thermal PerformanceMechanical Design Envelope Board-level Components Keepout Dimensions Torsional Clip Heatsink Thermal Solution AssemblyHeatsink Orientation Extruded Heatsink ProfilesMechanical Interface Material Thermal Interface MaterialHeatsink Clip Clip Retention AnchorsReliability Guidelines CompactPCI* Reference Heatsink Component OverviewReliability Guidelines Test Requirement Pass/Fail CriteriaThermal Solution Performance Characteristics Reliability GuidelinesReliability Requirements Appendix a Mechanical Drawings Mechanical Drawing ListDrawing Description AdvancedTCA* Heatsink Assembly Drawing AdvancedTCA* Heatsink Drawing AdvancedTCA* Component Keepout Zone CompactPCI* Heatsink Assembly Drawing CompactPCI* Heatsink Drawing CompactPCI* Component Keepout Zone Torsional Clip Heatsink Clip Drawing TIM2 Drawing Appendix B Thermal Solution Component Suppliers MCH Torsional Clip Heatsink Thermal Solution

5100 specifications

The Intel 5100, officially known as the Intel Core 2 Duo Processor T5100, is a notable entry in Intel's line of mobile processors, designed primarily for laptops and portable computing devices. Released in early 2007, it targets users seeking a balance between performance and energy efficiency.

At its core, the Intel 5100 features a dual-core architecture that allows it to handle multiple tasks simultaneously, significantly improving multitasking capabilities compared to single-core processors. Clocked at a speed of 1.6 GHz, it provides robust performance for everyday computing tasks such as web browsing, document editing, and casual gaming.

One of the key technologies integrated into the Intel 5100 is Intel's 64-bit architecture, which enables the processor to utilize more than 4GB of RAM, catering to modern computing needs. This feature is particularly beneficial for users running demanding applications or multitasking, as it provides increased processing power and efficiency.

The Intel 5100 also incorporates Intel's Enhanced Intel SpeedStep Technology, which optimizes power consumption by dynamically adjusting the processor's frequency and voltage based on workload. This not only extends battery life in portable devices but also helps in reducing heat output, promoting a cooler computing experience.

Another significant aspect of the Intel 5100 is its support for Intel Virtualization Technology (VT-x). This feature allows multiple operating systems to run concurrently on the same machine, making it an excellent choice for developers and IT professionals who require virtual environments for testing and development purposes.

The processor is built on a 65nm process technology, which contributes to its energy efficiency and thermal management. With a Thermal Design Power (TDP) of just 35 watts, it remains within a reasonable thermal envelope, suitable for laptop designs without requiring excessive cooling solutions.

In terms of connectivity, the Intel 5100 supports a range of communication technologies. It is commonly paired with Intel’s 965GM chipset, which enhances graphics capabilities through Intel GMA X3100 integrated graphics, offering decent performance for standard visual tasks.

Overall, the Intel 5100 represents a solid choice for users seeking a combination of performance, efficiency, and advanced features, making it a reliable processor option for laptops in the mid to late 2000s. With its dual-core capabilities, 64-bit support, and energy-efficient design, it paved the way for future developments in mobile computing technology.
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