Intel 5100 manual AdvancedTCA* Component Keepout Zone

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Intel® 5100 MCH Chipset

Figure 25. AdvancedTCA* Component Keepout Zone

Intel® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

TDG	July 2008
34	Order Number: 318676-003US

Image 34

Contents Thermal/Mechanical Design Guide Revision 003USTDG Contents Figures TablesRevision Number Descriptions Revision HistoryDate Revision Description Introduction Design FlowDefinition of Terms Definition of TermsTerm Definition Related Documents Sheet 1 Related DocumentsDocument Document Number/URL Thermal Simulation Packaging TechnologyRelated Documents Sheet 2 MCH Package Dimensions Top View MCH Package Dimensions Side ViewMCH Package Dimensions Bottom View Package Mechanical RequirementsThermal Design Power TDP Thermal SpecificationsThermal Solution Requirements Case TemperatureProcessor Thermal Characterization Parameter Relationships Example 1. Calculating the Required Thermal Performance105 Supporting Test Equipment Thermal MetrologyMCH Case Measurement Required Heatsink Thermal Performance Ψ CAIHS Groove Thermal Calibration and ControlsThermocouple Attach Support Equipment IHS Groove Dimensions Thermocouple Conditioning and Preparation Thermocouple Attachment to IHSSecuring Thermocouple Wires with Kapton Tape Prior to Attach Thermocouple Bead Placement Using 3D Micromanipulator to Secure Bead Location Curing Process Applying Adhesive on Thermocouple BeadThermocouple Wire Management Thermocouple Wire Management in GrooveReference Thermal Solution Power Simulation SoftwareThermal Performance AdvancedTCA* Reference HeatsinkMechanical Design Envelope Board-level Components Keepout Dimensions Torsional Clip Heatsink Thermal Solution AssemblyMechanical Interface Material Heatsink OrientationExtruded Heatsink Profiles Thermal Interface MaterialClip Retention Anchors Heatsink ClipReliability Guidelines Reliability Guidelines CompactPCI* Reference HeatsinkComponent Overview Test Requirement Pass/Fail CriteriaReliability Guidelines Thermal Solution Performance CharacteristicsReliability Requirements Mechanical Drawing List Appendix a Mechanical Drawings Drawing Description AdvancedTCA* Heatsink Assembly Drawing AdvancedTCA* Heatsink Drawing AdvancedTCA* Component Keepout Zone CompactPCI* Heatsink Assembly Drawing CompactPCI* Heatsink Drawing CompactPCI* Component Keepout Zone Torsional Clip Heatsink Clip Drawing TIM2 Drawing Appendix B Thermal Solution Component Suppliers MCH Torsional Clip Heatsink Thermal Solution