Intel 5100 manual Reliability Guidelines, Thermal Solution Performance Characteristics

Intel® 5100 MCH Chipset

6.2.2Thermal Solution Performance Characteristics

Figure 22 shows the performance of the CompactPCI* reference heatsink. This figure shows the thermal performance of the heatsink versus the airflow approach velocity provided.

Figure 22. CompactPCI* Reference Heatsink Thermal Performance

		4
Parameter		3.5
		3
Characterization		2.5
	C/W)	2
	o
	(
Thermal	ca
	Ψ	1.5							CompactPCI* Heatsink
-To-Ambient		1
		0.5
Case
		0
		0	100	200	300	400	500	600	700	800	900	1000	1100	1200

Airflow Approach Velocity (LFM)

7.0Reliability Guidelines

Each motherboard, heatsink, and attach combination may vary the mechanical loading of the component. The user should carefully evaluate the reliability of the completed assembly prior to use in high volume. Some general recommendations are shown in Table 8.

Table 8.	Reliability Requirements
Test1		Requirement	Pass/Fail Criteria2
Mechanical Shock		50 g, board level, 11 ms, three shocks/axis	Visual Check and Electrical Functional Test
Random Vibration		7.3 g, board level, 45 minutes/axis, 50 Hz to 2000 Hz	Visual Check and Electrical Functional Test
Temperature Life		85 °C, 2000 hours total, checkpoints at 168, 500, 1000,	Visual Check
		and 2000 hours
Thermal Cycling		-5 °C to +70 °C, 500 cycles	Visual Check
Humidity		85% relative humidity, 55 °C, 1000 hours	Visual Check

Notes:

1.The above tests should be performed on a sample size of at least 12 assemblies from three lots of material.

2.Additional pass/fail criteria may be added at the discretion of the user.

Intel® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

TDG	July 2008
30	Order Number: 318676-003US