Intel 5100 manual Contents

Intel® 5100 MCH Chipset

Contents

1.0	Introduction		..............................................................................................................	6
	1.1	Design Flow		6
	1.2	Definition of Terms		7
	1.3	Related Documents		8
	1.4	Thermal Simulation		9
2.0	Packaging Technology			9
	2.1	Package Mechanical Requirements		11
3.0	Thermal Specifications			12
	3.1	Thermal Design Power (TDP)		12
	3.2	Case Temperature		12
4.0	Thermal Solution Requirements			12
	4.1	Characterizing the Thermal Solution Requirement		12
5.0	Thermal Metrology			15
	5.1	MCH Case Measurement		15
		5.1.1	Supporting Test Equipment	15
		5.1.2	Thermal Calibration and Controls	16
		5.1.3	IHS Groove	16
		5.1.4	Thermocouple Conditioning and Preparation	18
		5.1.5	Thermocouple Attachment to IHS	18
		5.1.6	Curing Process	22
		5.1.7	Thermocouple Wire Management	23
	5.2	Power Simulation Software		24
6.0	Reference Thermal Solution			24
	6.1	AdvancedTCA* Reference Heatsink		25
		6.1.1	Thermal Performance	25
		6.1.2	Mechanical Design Envelope	25
		6.1.3	Board-level Components Keepout Dimensions	26
		6.1.4	Torsional Clip Heatsink Thermal Solution Assembly	26
		6.1.5	Heatsink Orientation	27
		6.1.6	Extruded Heatsink Profiles	27
		6.1.7	Mechanical Interface Material	27
		6.1.8	Thermal Interface Material	27
			6.1.8.1 Effect of Pressure on TIM Performance	28
		6.1.9	Heatsink Clip	28
		6.1.10	Clip Retention Anchors	28
		6.1.11	Reliability Guidelines	28
	6.2	CompactPCI* Reference Heatsink		29
		6.2.1	Component Overview	29
		6.2.2	Thermal Solution Performance Characteristics	30
7.0	Reliability Guidelines			30
A	Mechanical Drawings			31
B	Thermal Solution Component Suppliers			40

Intel® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

July 2008	TDG
Order Number: 318676-003US	3