Intel 5100 Thermal Calibration and Controls, IHS Groove, Thermocouple Attach Support Equipment

Page 16

Intel® 5100 MCH Chipset

Table 5.

Thermocouple Attach Support Equipment

 

 

 

 

 

Item

 

Description

Part Number

 

 

 

 

 

 

Measurement and Output

 

 

 

 

 

Microscope

 

Olympus* light microscope or equivalent

SZ-40

 

 

 

Digital multi-meter

Digital multi-meter for resistance measurement

Not Available

 

 

 

 

 

 

Test Fixture(s)

 

 

 

 

Micromanipulator1

Micromanipulator set from YOU Ltd. or equivalent mechanical 3D arm with needle

YOU-3

 

 

(not included) to maintain TC bead location during the attach process

 

 

 

Miscellaneous Hardware

 

 

 

 

Locite* 498* Super

 

 

Bonder* Instant

 

Super glue with thermal characteristics

49850

Adhesive Thermal

 

 

Cycling Resistant

 

 

 

 

 

 

Adhesive accelerator

Locite 7452 Tak Pak* accelerator for fast glue curing

18490

 

 

 

 

Kapton tape

 

For holding thermocouple in place or equivalent

Not Available

 

 

 

 

Thermocouple

 

OMEGA*, 36 gauge, “T” type

5SRTC-TT-36-72

 

 

 

 

 

 

Calibration and Control

 

 

 

 

 

ice point* Cell

 

OMEGA, stable 0 °C temperature source for calibration and offset

TRCIII

 

 

 

 

hot point* Cell

 

OMEGA, temperature source to control and understand meter slope gain

CL950-A-110

 

 

 

 

Notes:

1.Three axes set consists of (1 ea. U-31CF), (1 ea. UX-6-6), (1 ea. USM6) and (1 ea. UPN-1). More information is available at http://www.narishige.co.jp/you/english/products/set/index.htm.

5.1.2Thermal Calibration and Controls

It is recommended that full and routine calibration of temperature measurement equipment be performed before attempting to perform a temperature case measurement of the Intel® 5100 MCH Chipset. Intel recommends checking the meter probe set against known standards. This should be done at 0 °C (using an ice bath or other stable temperature source) and at an elevated temperature, around 80 °C (using an appropriate temperature source).

Wire gauge and length also should be considered because some less expensive measurement systems are heavily impacted by impedance. There are numerous resources available throughout the industry to assist with implementation of proper controls for thermal measurements.

Note: It is recommended to follow company standard procedures and wear safety items like glasses for cutting the IHS and gloves for chemical handling.

Note: Ask your Intel field sales representative if you need assistance to groove and/or install a thermocouple according to the reference process.

5.1.3IHS Groove

Cut a groove in the package IHS according to the drawing given in Figure 6.

Note: The center of the round at the end of the IHS groove should be at the center of the package.

Intel® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

TDG

July 2008

16

Order Number: 318676-003US

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Contents Thermal/Mechanical Design Guide Revision 003USTDG Contents Figures TablesRevision Number Descriptions Revision HistoryDate Revision Description Introduction Design FlowDefinition of Terms Definition of TermsTerm Definition Related Documents Sheet 1 Related DocumentsDocument Document Number/URL Thermal Simulation Packaging TechnologyRelated Documents Sheet 2 MCH Package Dimensions Top View MCH Package Dimensions Side ViewMCH Package Dimensions Bottom View Package Mechanical RequirementsThermal Specifications Thermal Solution RequirementsThermal Design Power TDP Case TemperatureProcessor Thermal Characterization Parameter Relationships Example 1. Calculating the Required Thermal Performance105 Thermal Metrology MCH Case MeasurementSupporting Test Equipment Required Heatsink Thermal Performance Ψ CAIHS Groove Thermal Calibration and ControlsThermocouple Attach Support Equipment IHS Groove Dimensions Thermocouple Conditioning and Preparation Thermocouple Attachment to IHSSecuring Thermocouple Wires with Kapton Tape Prior to Attach Thermocouple Bead Placement Using 3D Micromanipulator to Secure Bead Location Curing Process Applying Adhesive on Thermocouple BeadThermocouple Wire Management Thermocouple Wire Management in GrooveReference Thermal Solution Power Simulation SoftwareThermal Performance AdvancedTCA* Reference HeatsinkMechanical Design Envelope Board-level Components Keepout Dimensions Torsional Clip Heatsink Thermal Solution AssemblyHeatsink Orientation Extruded Heatsink ProfilesMechanical Interface Material Thermal Interface MaterialClip Retention Anchors Heatsink ClipReliability Guidelines CompactPCI* Reference Heatsink Component OverviewReliability Guidelines Test Requirement Pass/Fail CriteriaReliability Guidelines Thermal Solution Performance CharacteristicsReliability Requirements Mechanical Drawing List Appendix a Mechanical DrawingsDrawing Description AdvancedTCA* Heatsink Assembly Drawing AdvancedTCA* Heatsink Drawing AdvancedTCA* Component Keepout Zone CompactPCI* Heatsink Assembly Drawing CompactPCI* Heatsink Drawing CompactPCI* Component Keepout Zone Torsional Clip Heatsink Clip Drawing TIM2 Drawing Appendix B Thermal Solution Component Suppliers MCH Torsional Clip Heatsink Thermal Solution

5100 specifications

The Intel 5100, officially known as the Intel Core 2 Duo Processor T5100, is a notable entry in Intel's line of mobile processors, designed primarily for laptops and portable computing devices. Released in early 2007, it targets users seeking a balance between performance and energy efficiency.

At its core, the Intel 5100 features a dual-core architecture that allows it to handle multiple tasks simultaneously, significantly improving multitasking capabilities compared to single-core processors. Clocked at a speed of 1.6 GHz, it provides robust performance for everyday computing tasks such as web browsing, document editing, and casual gaming.

One of the key technologies integrated into the Intel 5100 is Intel's 64-bit architecture, which enables the processor to utilize more than 4GB of RAM, catering to modern computing needs. This feature is particularly beneficial for users running demanding applications or multitasking, as it provides increased processing power and efficiency.

The Intel 5100 also incorporates Intel's Enhanced Intel SpeedStep Technology, which optimizes power consumption by dynamically adjusting the processor's frequency and voltage based on workload. This not only extends battery life in portable devices but also helps in reducing heat output, promoting a cooler computing experience.

Another significant aspect of the Intel 5100 is its support for Intel Virtualization Technology (VT-x). This feature allows multiple operating systems to run concurrently on the same machine, making it an excellent choice for developers and IT professionals who require virtual environments for testing and development purposes.

The processor is built on a 65nm process technology, which contributes to its energy efficiency and thermal management. With a Thermal Design Power (TDP) of just 35 watts, it remains within a reasonable thermal envelope, suitable for laptop designs without requiring excessive cooling solutions.

In terms of connectivity, the Intel 5100 supports a range of communication technologies. It is commonly paired with Intel’s 965GM chipset, which enhances graphics capabilities through Intel GMA X3100 integrated graphics, offering decent performance for standard visual tasks.

Overall, the Intel 5100 represents a solid choice for users seeking a combination of performance, efficiency, and advanced features, making it a reliable processor option for laptops in the mid to late 2000s. With its dual-core capabilities, 64-bit support, and energy-efficient design, it paved the way for future developments in mobile computing technology.
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