Sun Microsystems 96257 manual Technology with ISO

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H

half-duplex. A communications channel that transmits data in either direction, but only one direction at a time. Contrast with full-duplex.

handshake. (1) A signal exchanged between two soft- ware components that uses characters inserted into a data stream to indicate when to start or stop sending da- ta. (2) A voltage or pulse signal exchanged between two hardware components to establish a valid connection be- tween two computers.

HBA. Host bus adapter. A printed circuit board that acts as an interface between a host microprocessor and disk controller to relieve the host of data storage and retrieval tasks, to improve data throughput performance.

HDA. Head disk assembly. A sealed enclosure contain- ing the mechanical parts of a disk drive, including read/ write heads, disk platters, and other non-electronic com- ponents.

HDI. Head disk interference.

head crash. Mechanical interference that causes a disk head and platter to make physical contact with each oth- er in a way that disables, or ‘crashes,’ the head and HDA. Head crashes can be caused by rough handling, sudden power loss, and particulates or other contami- nants on the surface of a disk.

hexadecimal. A base of 16 counting method (0 to 9, A to F) for the first position.

HIC. Human interface controller.

host path. In VSM, a communication path with four logi- cal paths between a host and VTSS logical devices.

hot-pluggable. In VSM, capability that allows a CSE to remove and replace FRUs while power to the FRU is maintained. This feature allows hardware maintenance actions and hardware upgrades to proceed without dis- rupting subsystem availability. See also hot swap.

hot swap. To remove and replace a system component (typically one with a redundant backup) while system power remains on and system operations continue. See also hot-pluggable. Contrast with cold swap.

HSC. Host Software Component. The portion of the Sun StorageTek Automated Cartridge System (ACS) that serves as an interface between the host operating sys- tem(s) and the rest of the automated library.

HSM. Hierarchical Storage Manager. HSSDC. High Speed Serial Data Connector.

HTTP. Hyper Text Transfer Protocol, Hyper Text Trans- port Protocol. The protocol most often used to transfer information from World Wide Web servers to browsers.

Hz. Hertz. The number of cycles per second in an elec- tromagnetic wave; one hertz equals one cycle.

I

ICEn. Iceberg Channel ESCON card used in VSM4- VTSS and earlier units.

IEC. International Electrotechnical Commission. An or- ganization in Geneva, Switzerland that sets international standards for the electrical and electronics fields. IEC created the Joint Technical Committee for information

technology with ISO.

IEEE. Institute of Electrical and Electronic Engineers. A worldwide professional organization that sets standards for telecommunications and computing applications.

IFCMB.VTSS Iceberg Fibre Channel Motherboard

IFES. VTSS Iceberg Fibre-channel Enclosure Services card

IFF. VTSS Iceberg Fibre-channel Freezer card

IFMZ. Iceberg Fiber-channel Mezzanine card; sub-com- ponent of IFES card.

IFPB. Iceberg Fiber-channel Port Bypass card; sub-com- ponent of IFES card.

IML. Initial microcode load, a.k.a. initial microprogram load. The loading of an operating instruction set, typically from external media such as a floppy diskette, into the microprocessor control store of a machine.

impedance. (1) The combined effect of resistance, in- ductance, and capacitance on a signal at a given fre- quency. (2) The total opposition (resistance or reactance) that a circuit offers to the flow of alternating current (AC), using ohms (Ω) as the unit of measure. A lower ohm val- ue indicates a better-quality conductor.

interface. (1) A shared boundary where two or more systems meet. (2) The means by which communication is achieved at this shared boundary. An interface can be between hardware and hardware (such as sockets and plugs, or electrical signals), hardware and software, soft- ware and software, human and computer (such as a mouse or keyboard and display screen).

interoperability. Ability to communicate, execute pro- grams, and transfer data across a variety of hardware and software platforms from different manufacturers.

interrupt. A temporary suspension of a process. Two main sources of interrupts are: a signal from outside the computer, such as someone touching the keyboard or mouse (hardware interrupt); or a machine instruction such as a request for input or output (software interrupt).

intranet. A local-area network that functions like the In- ternet, using web browser software to access and pro- cess information for employees, and which is located on computers within a company. An intranet may or may not be connected to the Internet through web servers.

I/O. Input/output. The movement of data between a host system and another device.

IPL. Initial program load. See initial microcode load. IPXn. Power PC functional microprocessor card. IS. Information systems; information services.

ISO. International Organization for Standardization. A voluntary organization comprised of the national stan- dards organizations of many countries which is responsi- ble for creating international standards in many areas, in- cluding computers and communications. ANSI (American National Standards Institute) is the U.S. mem- ber of ISO. ISO produced OSI (Open Systems Intercon- nection), a seven-layer model for network architecture.

ISPn. VSMn-VTSS Iceberg Support Processor card. IT. Information technology.

ITCC. Iceberg Tray Cable Crossover.

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Sun Confidential: Internal Only

96257

 

Revision A

 

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Contents StorageTek Page Virtual Tape Storage Subsystem Vtss Export Destination Control Statement Disclaimer of Warranties and Limitation of LiabilityProprietary Information Statement Revision a SeptemberRevision History / Summary of Changes SAPContents 96257 Sun Confidential Internal Only Vii Revision a Implementation Planning Site Readiness Planning96257 Sun Confidential Internal Only Viii Revision a Figures Tables Cabling Notice Warranty NoticeClass 1 Laser Product Notice Product Safety Standards Hazardous Materials HandlingStandards Conformance Electromagnetic CompatibilityPage Internal Code License Statement DefinitionsSafety / Fiber Optic / ESD Precautions Safety PrecautionsElectrostatic Discharge Precautions Strictly Comply With Caution and Warning MessagesFiber Optic Component Handling Precautions Protect Your EyesOptimizing Content For Electronic Viewing About This GuideProduct Overview Intended AudienceExamples Description of Convention Alert MessagesNotational and Typographic Conventions Where to Find Additional Information Reference DocumentsVSM Engineering Website Colophon SE Support ToolsPlanning and Implementation Overview System Assurance Process FlowCreating Planning Teams Planning / Readiness / Implementation Timelines Page Key High-Level Activities Key Sub-Tasks Key Participants Configuration PlanningConfiguration Planning Overview Defining Customer Requirements VSM Quick Tool Tool Selection ScreenVSM Sizer Tool VSM Sizer ToolMVC Sizer Tool MVC Sizer ToolMVC Migration Tool MVC Migration ToolCDS Sizer Tool CDS Sizer ToolVtss Configuration Planning VSM5-VTSS Physical CharacteristicsVSM5-VTSS Physical Characteristics VSM5-VTSS Environmental RequirementsModel Numbers / Configurations / Capacities VSM5-VTSS Model Numbers / Configurations / CapacitiesPrerequisites for Ficon Connectivity Additional Prerequisites for Ficon RTDsNative Ficon Attachment Native Ficon Attachment OptionsSingle-Mode vs. Multi-Mode Ficon Cabling Ficon Data Transfer RatesFicon Cabling Short-Wave vs. Long-Wave Connections VCF3 Ficon Card Configuration Examples Ficon Channel Card Configuration 4 VCF CardsFicon Channel Card Configuration 6 VCF Cards Description / Length Part Number Fibre Channel Cables Available LengthsFibre Channel Cables Available Lengths AC Source Power Specifications and Connectors DC Power Supply Voltage Ripple SpecificationsVSM5-VTSS AC Source Power Specifications and Connectors VSM5-VTSS DC Power Supply Voltage RipplePower Requirements Implementation Planning Implementation Planning OverviewPage Site Readiness Planning Site Readiness Planning OverviewSite Evaluation External Considerations Site Evaluation Internal ConsiderationsStructural Dimensions and Obstructions Transfering Equipment Point-to-PointData Center Safety Emergency Power ControlSite Power Distribution Systems Site Electrical Power Distribution SystemSource Power Requirements for VSM5 Equipment Source Power Voltage Range Frequency Range HzElectrostatic Discharge Hvac RequirementsFloor Loading Requirements Environmental Requirements and HazardsFloor Construction Requirements VSM5-VTSS Cabinet Superimposed Floor Loading Example VSM5-VTSS Floor Loading SpecificationsSite Evaluation Internal Considerations VSM5-VTSS Cabinet Weight Distribution and Leveler Locations Raised Flooring Horizontal Force ChartVSM5-VTSS Cabinet Dimensions for Physical Space Planning Physical Space RequirementsPage Specifications and Additional Information Motherboard and FRU Interconnections Side Motherboard and FRU Interconnections Side Power Safety Grounding Diagram Side Figure A-3. VSM5-VTSS Power Safety Grounding Diagram SideFigure A-4. VSM5-VTSS Power Safety Grounding Diagram Side Power System Diagram Figure A-5. VSM5-VTSS Power System DiagramData Paths and Interfaces Figure A-6. VSM5-VTSS Data Paths and InterfacesFiber Optic Cable Specifications VShell Command ReferenceTable A-1. Fiber Optic Cable Specifications Table A-2. VShell Command ReferenceSample Iocp Gen for Ficon Configuration Figure A-7. Sample Iocp Gen for Ficon ConfigurationVirtual Tape Drive Mapping and Host Addressing Sequential Device Parameters NumbersFRU Identifiers Table A-4. VSM5-VTSS FRU IdentifiersHex Decimal Unit.Tray.Slot Logic Motherboard and Cards ISP1Physical Array Disk Drive Tray Hex Decimal Unit.Tray.Slot Logic Power Supply FansCard Cage Impellers Hex Decimal Unit.Tray.Slot Physical Array Disk Drive Tray DA.5.DRV0 Array Drive Module Status Descriptions Figure A-8. Array Drive Module States and RelationshipsTable A-5. Array Drive Module Status Descriptions Media Acceptance Test MAT PartitionSpares Partition Unavailable PartitionPage Ficon Channel Extension Guidelines Definition of Terms General Channel Extension Considerations Understand Channel Extension Performance LimitationsFicon Topologies Placement of Extension EquipmentInteroperability Testing Ficon Channel Extension Sample Configurations Channel Director/Switch ExtenderTape Silo HostFigure B-4. VTSS-to-RTD Channel Extension Direct Attachment McData/CNT Channel Extension Interoperability McData/CNT Channel Extension InteroperabilityISL Failover Is Supported Only in Shuttle Mode Cisco Systems Channel Extension Interoperability Page Glossary Sun Confidential Internal Only 96257 Revision a 96257 Sun Confidential Internal Only Revision a Data compression. See compression 96257 Sun Confidential Internal Only Revision a Sun Confidential Internal Only 96257 Revision a Functional device. See functional volume Technology with ISO 96257 Sun Confidential Internal Only Revision a MLC. Machine-Level Control Part number Service Delivery Platform SDP. a Sun StorageTek 96257 Sun Confidential Internal Only Revision a Sun Confidential Internal Only 96257 Revision a Forms and Reference Notes Host System Configuration Information Customer Personnel Contacts Sun StorageTek / QSP Personnel Contacts Planning Worksheet 1 Planning Worksheet 2 Planning Worksheet 3 Planning Worksheet 4 Planning Worksheet 5 Software Information Hardware Information Tape Devices Hardware Information Switches / Routers Hardware Information SDP and Modem Devices Account Account Account Account Account Page Headquarters