ADSP-2181/ADSP-2183
ADSP-2181
ENVIRONMENTAL CONDITIONS
Ambient Temperature Rating:
TAMB = TCASE – (PD × θCA)
TCASE = Case Temperature in °C PD = Power Dissipation in W
θCA = Thermal Resistance
θJA = Thermal Resistance
θJC = Thermal Resistance
Package | θJA | θJC |
| θCA | ||||
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TQFP | 50°C/W | 2°C/W |
| 48°C/W | ||||
PQFP | 41°C/W | 10°C/W |
| 31°C/W | ||||
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| 1000 |
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| VDD = 5.5V |
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µA |
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| VDD = 5.0V |
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| VDD = 4.5V | |
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(LOG SCALE) | 100 |
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CURRENT | 10 |
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| 0 |
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| 25 | 55 | 85 | ||||
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TEMPERATURE – °C
NOTES:
1.REFLECTS
2.CURRENT REFLECTS DEVICE OPERATING WITH NO OUTPUT LOADS.
Figure 8. Power-Down Supply Current (Typical)
POWER DISSIPATION
To determine total power dissipation in a specific application, the following equation should be applied for each output:
C × VDD2 × f
C = load capacitance, f = output switching frequency.
Example:
In an application where external data memory is used and no other outputs are active, power dissipation is calculated as follows:
Assumptions:
•External data memory is accessed every cycle with 50% of the address pins switching.
•External data memory writes occur every other cycle with 50% of the data pins switching.
•Each address and data pin has a 10 pF total load at the pin.
•The application operates at VDD = 5.0 V and tCK = 30 ns.
Total Power Dissipation = PINT + (C × VDD2 × f )
PINT = internal power dissipation from Power vs. Frequency graph (Figure 9).
(C × VDD2 × f ) is calculated for each output:
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| Pins | × C | × VDD2 | × f |
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Address, |
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| 8 | × 10 pF | × 52 | V | × 33.3 MHz | = | 66.6 mW | ||
DMS | |||||||||||||
Data Output, |
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| 9 | × 10 pF | × 52 | V | × 16.67 MHz | = | 37.5 mW | ||||
WR | |||||||||||||
RD |
| 1 | × 10 pF | × 52 | V | × 16.67 MHz | = | 4.2 mW | |||||
CLKOUT | 1 | × 10 pF | × 52 | V | × 33.3 MHz | = | 8.3 mW | ||||||
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| 116.6 mW |
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Total power dissipation for this example is PINT + 116.6 mW.
| 570 | 2181 POWER, INTERNAL |
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| 550 |
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| VDD = 5.5V |
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| 530 |
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| 550mW |
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mW | 510 | 490mW |
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480 |
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) – | 450 |
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INT |
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420 |
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(P |
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POWER | 390 | 365mW |
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| 425mW |
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| 360 |
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| 330 |
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| VDD = 4.5V |
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| 300 | 275mW |
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| 330mW |
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| 270 |
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| 240 | 29 | 30 | 31 | 32 | 33 |
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| 28 | 34 | |||||
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| 1/tCK – MHz |
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POWER, IDLE1, 2
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| 90 |
| VDD = 5.5V |
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| 85 |
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| 90mW |
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– mW | 80 |
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75 |
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) |
| 75mW |
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IDLE | 70 | VDD | = 5.0V |
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(P | 65 |
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| 70mW |
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POWER |
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60 | 60mW |
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55 | VDD = 4.5V |
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| 50 |
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| 54mW |
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| 45 | 47mW |
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| 40 |
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| 28 | 29 | 30 | 31 | 32 | 33 | 34 |
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| 1/fCK – MHz |
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| 75 |
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| POWER, IDLE n MODES3 |
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| 70 |
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| IDLE; |
| 65 |
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| 70mW |
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mW | 60 |
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| 60mW |
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) | 55 |
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n |
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IDLE | 50 |
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(P |
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POWER | 45 |
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40 |
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| 35mW |
| IDLE (16) | |||
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| 35 |
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| 31mW |
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| IDLE (128) | |||
| 30 |
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| 33mW |
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| 25 |
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| 29mW |
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| 28 | 29 | 30 | 31 | 32 | 33 | 34 |
1/fCK – MHz
VALID FOR ALL TEMPERATURE GRADES.
1POWER REFLECTS DEVICE OPERATING WITH NO OUTPUT LOADS.
2IDLE REFERS TO
3TYPICAL POWER DISSIPATION AT 5.0V VDD DURING EXECUTION OF IDLE n
INSTRUCTION (CLOCK FREQUENCY REDUCTION).
4IDD MEASUREMENT TAKEN WITH ALL INSTRUCTIONS EXECUTING FROM INTERNAL MEMORY. 50% OF THE INSTRUCTIONS ARE MULTIFUNCTION (TYPES 1,4,5,12,13,14), 30% ARE TYPE 2 AND TYPE 6, AND 20% ARE IDLE INSTRUCTIONS.
Figure 9. Power vs. Frequency
REV. 0 |