Analog Devices ADSP-2183, ADSP-2181 manual Tqfp

ADSP-2181/ADSP-2183

ADSP-2183

ENVIRONMENTAL CONDITIONS

Ambient Temperature Rating:

TAMB = TCASE – (PD × θCA)

TCASE = Case Temperature in °C PD = Power Dissipation in W

θCA = Thermal Resistance (Case-to-Ambient)

θJA = Thermal Resistance (Junction-to-Ambient)

θJC = Thermal Resistance (Junction-to-Case)

Package	θJA	θJC	θCA
TQFP	50°C/W	2°C/W	48°C/W
PQFP	41°C/W	10°C/W	31°C/W

	1000
µA				VDD = 3.6V
–
				VDD = 3.3V
(LOG SCALE)	100
				VDD = 3.0V
CURRENT	10
	0	25	55	85
	–5
		TEMPERATURE – °C

NOTES:

1.REFLECTS ADSP-2183 OPERATION IN LOWEST POWER MODE. (SEE "SYSTEM INTERFACE" CHAPTER OF THE ADSP-2100 FAMILY USER'S MANUAL FOR DETAILS.)

2.CURRENT REFLECTS DEVICE OPERATING WITH NO OUTPUT LOADS.

Figure 15. Power-Down Supply Current (Typical)

POWER DISSIPATION

To determine total power dissipation in a specific application, the following equation should be applied for each output:

C × VDD2 × f

C = load capacitance, f = output switching frequency.

Example:

In an application where external data memory is used and no other outputs are active, power dissipation is calculated as follows:

Assumptions:

•External data memory is accessed every cycle with 50% of the address pins switching.

•External data memory writes occur every other cycle with 50% of the data pins switching.

•Each address and data pin has a 10 pF total load at the pin.

•The application operates at VDD = 3.3 V and tCK = 34.7 ns.

Total Power Dissipation = PINT + (C × VDD2 × f )

PINT = internal power dissipation from Power vs. Frequency graph (Figure 16).

(C × VDD2 × f ) is calculated for each output:

			# of
			Pins	× C	× VDD2		× f
Address,			8	× 10 pF	× 3.32	V	× 33.3 MHz	=	29.0 mW
	DMS
Data Output,		WR	9	× 10 pF	× 3.32	V	× 16.67 MHz =		16.3 mW
RD			1	× 10 pF	× 3.32	V	× 16.67 MHz =		1.8 mW
CLKOUT			1	× 10 pF	× 3.32	V	× 33.3 MHz	=	3.6 mW
									50.7 mW

Total power dissipation for this example is PINT + 50.7 mW.

POWER, INTERNAL1,4

	200
	190			VDD = 3.6V				195mW
	180		175mW
mW	170
								160mW
) –
	160			VDD = 3.3V
INT	150
(P
POWER	140		140mW
	130			VDD = 3.0V				125mW
	120
	110	110mW
	100	23	24	25	26	27	28	29	30	31
	22
					1/tCK – MHz

POWER, IDLE1,2

	34
	32			VDD = 3.6V				33mW
	30
– mW	28		27mW
	26				VDD = 3.3V
								27mW
)	24
IDLE
	22
(P			21mW
	20				VDD = 3.0V
POWER								21mW
	18
	16		17mW
	14
	12
	10	23	24	25	26	27
	22						28	29	30	31
					1/tCK – MHz

POWER, IDLE n MODES3

	30
	28		IDLE
	26
		27mW
	24
mW
	22
) –	20	21mW
n
IDLE	18
(P	16
POWER
	14	13mW	IDLE
		12mW
	12		(16)
	10	12mW	IDLE
		11mW	(128)
	8
	6

22 23 24 25 26 27 28 29 30 31

1/tCK – MHz

VALID FOR ALL TEMPERATURE GRADES.

1POWER REFLECTS DEVICE OPERATING WITH NO OUTPUT LOADS.

2IDLE REFERS TO ADSP-2183 STATE OF OPERATION DURING EXECUTION OF IDLE INSTRUCTION. DEASSERTED PINS ARE DRIVEN TO EITHER VDD OR GND.

3TYPICAL POWER DISSIPATION AT 3.3V VDD DURING EXECUTION OF IDLE n

INSTRUCTION (CLOCK FREQUENCY REDUCTION).

4IDD MEASUREMENT TAKEN WITH ALL INSTRUCTIONS EXECUTING FROM INTERNAL MEMORY. 50% OF THE INSTRUCTIONS ARE MULTIFUNCTION (TYPES 1,4,5,12,13,14), 30% ARE TYPE 2 AND TYPE 6, AND 20% ARE IDLE INSTRUCTIONS.

Figure 16. Power vs. Frequency

–18– REV. 0