Cypress CY7C1474BV33 manual Ieee 1149.1 Serial Boundary Scan Jtag, TAP Controller State Diagram

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CY7C1470BV33 CY7C1472BV33, CY7C1474BV33

IEEE 1149.1 Serial Boundary Scan (JTAG)

The CY7C1470BV33, CY7C1472BV33, and CY7C1474BV33 incorporates a serial boundary scan test access port (TAP). This port operates in accordance with IEEE Standard 1149.1-1990 but does not have the set of functions required for full 1149.1 compliance. These functions from the IEEE specification are excluded because their inclusion places an added delay in the critical speed path of the SRAM. Note that the TAP controller functions in a manner that does not conflict with the operation of other devices using 1149.1 fully compliant TAPs. The TAP operates using JEDEC-standard 3.3V or 2.5V IO logic levels.

The CY7C1470BV33, CY7C1472BV33, and CY7C1474BV33 contains a TAP controller, instruction register, boundary scan register, bypass register, and ID register.

Disabling the JTAG Feature

It is possible to operate the SRAM without using the JTAG feature. To disable the TAP controller, TCK must be tied LOW (VSS) to prevent clocking of the device. TDI and TMS are inter- nally pulled up and may be unconnected. They may alternately be connected to VDD through a pull up resistor. TDO must be left unconnected. During power up, the device comes up in a reset state, which does not interfere with the operation of the device.

Figure 2. TAP Controller State Diagram

Test Mode Select (TMS)

The TMS input is used to give commands to the TAP controller and is sampled on the rising edge of TCK. It is allowable to leave this ball unconnected if the TAP is not used. The ball is pulled up internally, resulting in a logic HIGH level.

Test Data-In (TDI)

The TDI ball is used to serially input information into the registers and can be connected to the input of any of the registers. The register between TDI and TDO is chosen by the instruction that is loaded into the TAP instruction register. For information about loading the instruction register, see the TAP Controller State Diagram. TDI is internally pulled up and can be unconnected if the TAP is unused in an application. TDI is connected to the most significant bit (MSB) of any register. (See TAP Controller Block Diagram.)

Test Data-Out (TDO)

The TDO output ball is used to serially clock data-out from the registers. The output is active depending upon the current state of the TAP state machine. The output changes on the falling edge of TCK. TDO is connected to the least significant bit (LSB) of any register. (See TAP Controller State Diagram.)

Figure 3. TAP Controller Block Diagram

1

0

TEST-LOGIC

RESET

0

RUN-TEST/

IDLE

1

SELECT

1

SELECT

1

 

DR-SCA N

 

IR-SCA N

 

 

0

 

0

 

 

1

 

1

 

 

CA PTURE-DR

 

CA PTURE-IR

 

 

0

 

0

 

 

SHIFT-DR

0

SHIFT-IR

0

 

1

 

1

 

 

EXIT1-DR

1

EXIT1-IR

1

 

 

 

 

0

 

0

 

TDI

Selection Circuitry

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Bypass Register

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

2

1

0

 

 

Selection

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Instruction Register

 

 

 

 

 

 

 

 

Circuitry

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

31

30

29

.

.

.

2

1

0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Identification Register

 

 

 

 

 

 

 

 

 

 

 

 

x

.

.

.

.

.

2

1

0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Boundary Scan Register

 

TDO

 

 

PA USE-DR

0

 

 

PA USE-IR

0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1

 

 

 

 

 

 

1

 

 

 

 

0

 

 

 

 

 

 

0

 

 

 

 

 

 

EXIT2-DR

 

 

EXIT2-IR

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1

 

 

 

 

 

 

1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

UPDA TE-DR

 

 

 

UPDA TE-IR

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1

0

 

 

 

1

0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

TCK

TAP CONTROLLER

TM S

Performing a TAP Reset

A RESET is performed by forcing TMS HIGH (VDD) for five rising edges of TCK. This RESET does not affect the operation of the SRAM and may be performed while the SRAM is operating.

The 0/1 next to each state represents the value of TMS at the rising edge of TCK.

Test Access Port (TAP)

Test Clock (TCK)

The test clock is used only with the TAP controller. All inputs are captured on the rising edge of TCK. All outputs are driven from the falling edge of TCK.

During power up, the TAP is reset internally to ensure that TDO comes up in a High-Z state.

TAP Registers

Registers are connected between the TDI and TDO balls and scans data into and out of the SRAM test circuitry. Only one register can be selected at a time through the instruction register. Data is serially loaded into the TDI ball on the rising edge of TCK. Data is output on the TDO ball on the falling edge of TCK.

Document #: 001-15031 Rev. *C

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Contents Functional Description Selection GuideDescription 250 MHz 200 MHz 167 MHz Unit Cypress Semiconductor Corporation 198 Champion CourtLogic Block Diagram CY7C1470BV33 2M x Logic Block Diagram CY7C1472BV33 4M xLogic Block Diagram CY7C1474BV33 1M x ADV/LDPin Configurations Pin Tqfp PinoutCEN NC/1G CE2 CLKTDI TDO ModeBall Fbga 14 x 22 x 1.76 mm Pinout CY7C1474BV33 1M × Pin Definitions Pin Name IO Type Pin Description Byte Write Select Inputs, Active LOW. Qualified withFunctional Overview ZZ Mode Electrical Characteristics Parameter Description Test Conditions Min Max UnitTruth Table Operation Address UsedPartial Write Cycle Description Function CY7C1470BV33 BW d BW c BW b BW aFunction CY7C1472BV33 Function CY7C1474BV33TAP Controller State Diagram Ieee 1149.1 Serial Boundary Scan JtagTAP Instruction Set TAP Timing TAP AC Switching Characteristics Parameter Description Min Max Unit ClockOutput Times Hold TimesTAP DC Electrical Characteristics And Operating Conditions 3V TAP AC Test Conditions5V TAP AC Test Conditions GND VIN VddqScan Register Sizes Register Name Bit Size Identification Codes Instruction DescriptionBoundary Scan Exit Order 2M x Bit # Ball ID Boundary Scan Exit Order 4M x Bit # Ball IDBoundary Scan Exit Order 1M x Bit # Ball IDE10 V10Electrical Characteristics Maximum RatingsOperating Range Range AmbientCapacitance Thermal ResistanceAC Test Loads and Waveforms Switching Characteristics Setup TimesParameter Description 250 200 167 Unit Min Max Switching Waveforms ADV/LD AddressData A3 A4NOP, Stall and Deselect Cycles Ordering Information 250 Package Diagrams Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mmBall Fbga 15 x 17 x 1.4 mm Ball Fbga 14 x 22 x 1.76 mm ECN No Issue Date Orig. Description of Change VKN/KKVTMPVKN/AESA VKN