Cypress CY7C1472BV33 Switching Characteristics, Parameter Description 250 200 167 Unit Min Max

Page 22

CY7C1470BV33

CY7C1472BV33, CY7C1474BV33

Switching Characteristics

Over the Operating Range. Timing reference is 1.5V when VDDQ = 3.3V and is 1.25V when VDDQ = 2.5V. Test conditions shown in

(a) of “AC Test Loads and Waveforms” on page 21 unless otherwise noted.

Parameter

 

 

 

 

 

 

 

 

Description

 

–250

–200

 

–167

Unit

 

 

 

 

 

 

 

 

Min

 

Max

Min

Max

Min

 

Max

 

 

 

 

 

 

 

 

 

 

 

 

 

tPower[16]

 

VCC (typical) to the First Access Read or Write

1

 

 

1

 

1

 

 

ms

Clock

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tCYC

 

Clock Cycle Time

4.0

 

 

5.0

 

6.0

 

 

ns

FMAX

 

Maximum Operating Frequency

 

 

250

 

200

 

 

167

MHz

tCH

 

Clock HIGH

2.0

 

 

2.0

 

2.2

 

 

ns

tCL

 

Clock LOW

2.0

 

 

2.0

 

2.2

 

 

ns

Output Times

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tCO

 

Data Output Valid After CLK Rise

 

 

3.0

 

3.0

 

 

3.4

ns

tOEV

 

 

 

LOW to Output Valid

 

 

3.0

 

3.0

 

 

3.4

ns

OE

 

 

 

tDOH

 

Data Output Hold After CLK Rise

1.3

 

 

1.3

 

1.5

 

 

ns

tCHZ

 

Clock to High-Z[17, 18, 19]

 

 

3.0

 

3.0

 

 

3.4

ns

tCLZ

 

Clock to Low-Z[17, 18, 19]

1.3

 

 

1.3

 

1.5

 

 

ns

tEOHZ

 

 

 

HIGH to Output High-Z[17, 18, 19]

 

 

3.0

 

3.0

 

 

3.4

ns

OE

 

 

 

tEOLZ

 

 

 

LOW to Output Low-Z[17, 18, 19]

0

 

 

0

 

0

 

 

ns

OE

 

 

 

 

 

Setup Times

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tAS

 

Address Setup Before CLK Rise

1.4

 

 

1.4

 

1.5

 

 

ns

tDS

 

Data Input Setup Before CLK Rise

1.4

 

 

1.4

 

1.5

 

 

ns

tCENS

 

 

 

 

 

 

Setup Before CLK Rise

1.4

 

 

1.4

 

1.5

 

 

ns

CEN

 

 

 

 

 

tWES

 

 

 

 

 

 

 

x Setup Before CLK Rise

1.4

 

 

1.4

 

1.5

 

 

ns

WE,

BW

 

 

 

 

 

tALS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ADV/LD

Setup Before CLK Rise

1.4

 

 

1.4

 

1.5

 

 

ns

tCES

 

Chip Select Setup

1.4

 

 

1.4

 

1.5

 

 

ns

Hold Times

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tAH

 

Address Hold After CLK Rise

0.4

 

 

0.4

 

0.5

 

 

ns

tDH

 

Data Input Hold After CLK Rise

0.4

 

 

0.4

 

0.5

 

 

ns

tCENH

 

 

 

 

Hold After CLK Rise

0.4

 

 

0.4

 

0.5

 

 

ns

CEN

 

 

 

 

 

tWEH

 

 

 

 

 

 

 

x Hold After CLK Rise

0.4

 

 

0.4

 

0.5

 

 

ns

WE,

BW

 

 

 

 

 

tALH

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ADV/LD

Hold after CLK Rise

0.4

 

 

0.4

 

0.5

 

 

ns

tCEH

 

Chip Select Hold After CLK Rise

0.4

 

 

0.4

 

0.5

 

 

ns

Notes

16.This part has an internal voltage regulator; tpower is the time power is supplied above VDD minimum initially, before a read or write operation can be initiated.

17.tCHZ, tCLZ, tEOLZ, and tEOHZ are specified with AC test conditions shown in (b) of “AC Test Loads and Waveforms” on page 21. Transition is measured ±200 mV from steady-state voltage.

18.At any voltage and temperature, tEOHZ is less than tEOLZ and tCHZ is less than tCLZ to eliminate bus contention between SRAMs when sharing the same data bus. These specifications do not imply a bus contention condition, but reflect parameters guaranteed over worst case user conditions. Device is designed to achieve High-Z before Low-Z under the same system conditions.

19.This parameter is sampled and not 100% tested.

Document #: 001-15031 Rev. *C

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Contents Description 250 MHz 200 MHz 167 MHz Unit Functional DescriptionSelection Guide Cypress Semiconductor Corporation 198 Champion CourtLogic Block Diagram CY7C1470BV33 2M x Logic Block Diagram CY7C1472BV33 4M xLogic Block Diagram CY7C1474BV33 1M x ADV/LDPin Configurations Pin Tqfp PinoutTDI TDO CENNC/1G CE2 CLK ModeBall Fbga 14 x 22 x 1.76 mm Pinout CY7C1474BV33 1M × Pin Definitions Pin Name IO Type Pin Description Byte Write Select Inputs, Active LOW. Qualified withFunctional Overview ZZ Mode Electrical Characteristics Parameter Description Test Conditions Min Max UnitTruth Table Operation Address UsedFunction CY7C1472BV33 Partial Write Cycle DescriptionFunction CY7C1470BV33 BW d BW c BW b BW a Function CY7C1474BV33TAP Controller State Diagram Ieee 1149.1 Serial Boundary Scan JtagTAP Instruction Set TAP Timing Output Times TAP AC Switching CharacteristicsParameter Description Min Max Unit Clock Hold Times5V TAP AC Test Conditions TAP DC Electrical Characteristics And Operating Conditions3V TAP AC Test Conditions GND VIN VddqScan Register Sizes Register Name Bit Size Identification Codes Instruction DescriptionBoundary Scan Exit Order 2M x Bit # Ball ID Boundary Scan Exit Order 4M x Bit # Ball IDE10 Boundary Scan Exit Order 1M xBit # Ball ID V10Operating Range Electrical CharacteristicsMaximum Ratings Range AmbientThermal Resistance CapacitanceAC Test Loads and Waveforms Setup Times Switching CharacteristicsParameter Description 250 200 167 Unit Min Max Data Switching WaveformsADV/LD Address A3 A4NOP, Stall and Deselect Cycles Ordering Information 250 Package Diagrams Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mmBall Fbga 15 x 17 x 1.4 mm Ball Fbga 14 x 22 x 1.76 mm VKN/AESA ECN No Issue Date Orig. Description of ChangeVKN/KKVTMP VKN