Cypress CY7C1474BV33, CY7C1472BV33 Capacitance, Thermal Resistance, AC Test Loads and Waveforms

CY7C1470BV33

CY7C1472BV33, CY7C1474BV33

Electrical Characteristics

Over the Operating Range[13, 14] (continued)

Parameter	Description	Test Conditions		Min	Max	Unit
ISB3	Automatic CE	Max. VDD, Device Deselected,	4.0-ns cycle, 250 MHz		245	mA
	Power Down	VIN ≤ 0.3V or VIN > VDDQ − 0.3V,
			5.0-ns cycle, 200 MHz		245	mA
	Current—CMOS Inputs	f = fMAX = 1/tCYC
			6.0-ns cycle, 167 MHz		245	mA
ISB4	Automatic CE	Max. VDD, Device Deselected,	All speed grades		135	mA
	Power Down	VIN ≥ VIH or VIN ≤ VIL, f = 0
	Current—TTL Inputs

Capacitance

Tested initially and after any design or process changes that may affect these parameters.

Parameter	Description	Test Conditions	100 TQFP	165 FBGA	209 FBGA	Unit
			Max	Max	Max
CADDRESS	Address Input Capacitance	TA = 25°C, f = 1 MHz,	6	6	6	pF
		VDD = 3.3V
CDATA	Data Input Capacitance		5	5	5	pF
		VDDQ = 2.5V
CCTRL	Control Input Capacitance		8	8	8	pF
CCLK	Clock Input Capacitance		6	6	6	pF
CIO	Input/Output Capacitance		5	5	5	pF

Thermal Resistance

Tested initially and after any design or process changes that may affect these parameters.

Parameters	Description	Test Conditions	100 TQFP	165 FBGA	209 FBGA	Unit
			Package	Package	Package
ΘJA	Thermal Resistance	Test conditions follow standard	24.63	16.3	15.2	°C/W
	(Junction to Ambient)	test methods and procedures for
		measuring thermal impedance,
ΘJC	Thermal Resistance		2.28	2.1	1.7	°C/W
		per EIA/JESD51.
	(Junction to Case)

AC Test Loads and Waveforms

3.3V IO Test Load

OUTPUT

3.3V

R = 317Ω

ALL INPUT PULSES

VDDQ

Z0

= 50Ω

OUTPUT

RL

= 50Ω

10%

90%

5 pF

R = 351Ω

GND

≤ 1 ns

VL = 1.5V

INCLUDING

(c)

(a)

JIG AND

(b)

SCOPE

2.5V IO Test Load

R = 1667Ω

OUTPUT

2.5V

ALL INPUT PULSES

VDDQ

Z0

= 50Ω

OUTPUT

RL

= 50Ω

10%

90%

5 pF

R = 1538Ω

GND

≤ 1 ns

VL = 1.25V

INCLUDING

(c)

(a)

JIG AND

(b)

SCOPE

90%

10%

≤ 1 ns

90%

10%

≤ 1 ns

Document #: 001-15031 Rev. *C Page 21 of 30

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