Cypress CY7C1470BV33 Maximum Ratings, Electrical Characteristics, Operating Range, Range Ambient

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CY7C1470BV33 CY7C1472BV33, CY7C1474BV33

Maximum Ratings

Exceeding maximum ratings may impair the useful life of the device. These user guidelines are not tested.

Storage Temperature

–65°C to +150°C

Ambient Temperature with

 

 

Power Applied

–55°C to +125°C

Supply Voltage on VDD Relative to GND

–0.5V to +4.6V

Supply Voltage on VDDQ Relative to GND

–0.5V to +VDD

DC to Outputs in Tri-State

–0.5V to VDDQ + 0.5V

Electrical Characteristics

Over the Operating Range[13, 14]

DC Input Voltage

–0.5V to VDD + 0.5V

Current into Outputs (LOW)

 

20 mA

Static Discharge Voltage

 

> 2001V

(MIL-STD-883, Method 3015)

 

 

Latch Up Current

 

> 200 mA

Operating Range

 

 

 

 

 

 

Range

Ambient

VDD

VDDQ

Temperature

Commercial

0°C to +70°C

3.3V

2.5V – 5%

 

 

–5%/+10%

to VDD

Industrial

–40°C to +85°C

Parameter

Description

Test Conditions

Min

Max

Unit

VDD

Power Supply Voltage

 

 

3.135

3.6

V

VDDQ

IO Supply Voltage

For 3.3V IO

 

3.135

VDD

V

 

 

For 2.5V IO

 

2.375

2.625

V

 

 

 

 

 

 

 

VOH

Output HIGH Voltage

For 3.3V IO, IOH = 4.0 mA

 

2.4

 

V

 

 

For 2.5V IO, IOH= 1.0 mA

 

2.0

 

V

VOL

Output LOW Voltage

For 3.3V IO, IOL= 8.0 mA

 

 

0.4

V

 

 

For 2.5V IO, IOL= 1.0 mA

 

 

0.4

V

VIH

Input HIGH Voltage[13]

For 3.3V IO

 

2.0

VDD + 0.3V

V

 

 

For 2.5V IO

 

1.7

VDD + 0.3V

V

VIL

Input LOW Voltage[13]

For 3.3V IO

 

–0.3

0.8

V

 

 

For 2.5V IO

 

–0.3

0.7

V

 

 

 

 

 

 

 

IX

Input Leakage Current

GND VI VDDQ

 

–5

5

μA

 

except ZZ and MODE

 

 

 

 

 

 

Input Current of MODE

Input = VSS

 

–30

 

μA

 

 

Input = VDD

 

 

5

μA

 

Input Current of ZZ

Input = VSS

 

–5

 

μA

 

 

Input = VDD

 

 

30

μA

IOZ

Output Leakage Current

GND VI VDDQ, Output Disabled

–5

5

μA

IDD [15]

VDD Operating Supply

VDD = Max., IOUT = 0 mA,

4.0-ns cycle, 250 MHz

 

500

mA

 

 

f = fMAX = 1/tCYC

 

 

 

 

 

 

5.0-ns cycle, 200 MHz

 

500

mA

 

 

 

6.0-ns cycle, 167 MHz

 

450

mA

 

 

 

 

 

 

 

ISB1

Automatic CE

Max. VDD, Device Deselected,

4.0-ns cycle, 250 MHz

 

245

mA

 

Power Down

VIN VIH or VIN VIL,

 

 

 

 

 

5.0-ns cycle, 200 MHz

 

245

mA

 

Current—TTL Inputs

f = fMAX = 1/tCYC

 

 

 

 

 

6.0-ns cycle, 167 MHz

 

245

mA

 

 

 

 

 

 

 

 

 

 

 

ISB2

Automatic CE

Max. VDD, Device Deselected,

All speed grades

 

120

mA

 

Power Down

VIN 0.3V or VIN > VDDQ 0.3V,

 

 

 

 

 

Current—CMOS Inputs

f = 0

 

 

 

 

Notes

13.Overshoot: VIH(AC) < VDD +1.5V (pulse width less than tCYC/2). Undershoot: VIL(AC)> –2V (pulse width less than tCYC/2).

14.TPower-up: assumes a linear ramp from 0V to VDD (min.) within 200 ms. During this time VIH < VDD and VDDQ < VDD.

15.The operation current is calculated with 50% read cycle and 50% write cycle.

Document #: 001-15031 Rev. *C

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Contents Functional Description Selection GuideDescription 250 MHz 200 MHz 167 MHz Unit Cypress Semiconductor Corporation 198 Champion CourtLogic Block Diagram CY7C1470BV33 2M x Logic Block Diagram CY7C1472BV33 4M xLogic Block Diagram CY7C1474BV33 1M x ADV/LDPin Configurations Pin Tqfp PinoutCEN NC/1G CE2 CLKTDI TDO ModeBall Fbga 14 x 22 x 1.76 mm Pinout CY7C1474BV33 1M × Pin Definitions Pin Name IO Type Pin Description Byte Write Select Inputs, Active LOW. Qualified withFunctional Overview ZZ Mode Electrical Characteristics Parameter Description Test Conditions Min Max UnitTruth Table Operation Address UsedPartial Write Cycle Description Function CY7C1470BV33 BW d BW c BW b BW aFunction CY7C1472BV33 Function CY7C1474BV33TAP Controller State Diagram Ieee 1149.1 Serial Boundary Scan JtagTAP Instruction Set TAP Timing TAP AC Switching Characteristics Parameter Description Min Max Unit ClockOutput Times Hold TimesTAP DC Electrical Characteristics And Operating Conditions 3V TAP AC Test Conditions5V TAP AC Test Conditions GND VIN VddqScan Register Sizes Register Name Bit Size Identification Codes Instruction DescriptionBoundary Scan Exit Order 2M x Bit # Ball ID Boundary Scan Exit Order 4M x Bit # Ball IDBoundary Scan Exit Order 1M x Bit # Ball IDE10 V10Electrical Characteristics Maximum RatingsOperating Range Range AmbientAC Test Loads and Waveforms CapacitanceThermal Resistance Parameter Description 250 200 167 Unit Min Max Switching CharacteristicsSetup Times Switching Waveforms ADV/LD AddressData A3 A4NOP, Stall and Deselect Cycles Ordering Information 250 Package Diagrams Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mmBall Fbga 15 x 17 x 1.4 mm Ball Fbga 14 x 22 x 1.76 mm ECN No Issue Date Orig. Description of Change VKN/KKVTMPVKN/AESA VKN