Cypress CY7C0430BV Disabling the Jtag Feature, Test Access Port TAP-Test Clock TCK, TAP Registers

Page 26

CY7C0430BV

CY7C0430CV

address the entire memory array (depend on the value of the mask register) and loop back to location 0. The increment operation is second in priority to load operation.

3.Readback: the internal value of either the burst counter or the mask register can be read out on the address lines when CNTRD or MKRD is LOW. Counter readback has higher priority over mask register readback. A no-operation delay cycle is experienced when readback operation is performed. The address will be valid after tCA2 (for counter readback) or tCM2 (for mask readback) from the following port's clock rising edge. Address readback operation is independent of the port's chip enables (CE0 and CE1). If address readback occurs while the port is enabled (chip enables active), the data lines (I/Os) will be three-stated.

4.Hold operation: In order to hold the value of the address counter at certain address, all signals in Table 2 have to be HIGH. This operation has the least priority. This operation is useful in many applications where wait states are needed or when address is available few cycles ahead of data.

The counter and mask register operations are totally independent of port chip enables.

IEEE 1149.1 Serial Boundary Scan (JTAG) and Memory Built-In-Self-Test (MBIST)

The CY7C0430BV and CY7C0430CV incorporate a serial boundary scan test access port (TAP). This port is fully compatible with IEEE Standard 1149.1-2001[52]. The TAP operates using JEDEC standard 3.3V I/O logic levels. It is composed of three input connections and one output connection required by the test logic defined by the standard. Memory BIST circuitry will also be controlled through the TAP interface. All MBIST instructions are compliant to the JTAG standard. An external clock (CLKBIST) is provided to allow the user to run BIST at speeds up to 50 MHz. CLKBIST is multi- plexed internally with the ports clocks during BIST operation.

Disabling the JTAG Feature

It is possible to operate the QuadPort DSE device without using the JTAG feature. To disable the TAP controller, TCK must be tied LOW (VSS) to prevent clocking of the device. TDI and TMS are internally pulled up and may be unconnected. They may alternately be connected to VDD through a pull-up resistor. TDO should be left unconnected. CLKBIST must be tied LOW to disable the MBIST. Upon power-up, the device will come up in a reset state which will not interfere with the operation of the device.

Test Access Port (TAP)–Test Clock (TCK)

The test clock is used only with the TAP controller. All inputs are captured on the rising edge of TCK. All outputs are driven from the falling edge of TCK.

Test Mode Select

The TMS input is used to give commands to the TAP controller and is sampled on the rising edge of TCK. It is allowable to leave this pin unconnected if the TAP is not used. The pin is pulled up internally, resulting in a logic HIGH level.

Note:

52. Master Reset will reset the JTAG controller.

Test Data-In (TDI)

The TDI pin is used to serially input information into the registers and can be connected to the input of any of the registers. The register between TDI and TDO is chosen by the instruction that is loaded into the TAP instruction register. For information on loading the instruction register, see the TAP Controller State Diagram. TDI is internally pulled up and can be unconnected if the TAP is unused in an application. TDI is connected to the most significant bit (MSB) on any register.

Test Data Out (TDO)

The TDO output pin is used to serially clock data-out from the registers. The output is active depending upon the current state of the TAP state machine (see TAP Controller State Diagram (FSM)). The output changes on the falling edge of TCK. TDO is connected to the least significant bit (LSB) of any register.

Performing a TAP Reset

A Reset is performed by forcing TMS HIGH (VDD) for five rising edges of TCK. This RESET does not affect the operation of the QuadPort DSE device and may be performed while the device is operating. At power-up, the TAP is reset internally to ensure that TDO comes up in a High-Z state.

TAP Registers

Registers are connected between the TDI and TDO pins and allow data to be scanned into and out of the QuadPort DSE device test circuitry. Only one register can be selected at a time through the instruction registers. Data is serially loaded into the TDI pin on the rising edge of TCK. Data is output on the TDO pin on the falling edge of TCK.

Instruction Register

Four-bit instructions can be serially loaded into the instruction register. This register is loaded when it is placed between the TDI and TDO pins as shown in the following JTAG/BIST Controller diagram. Upon power-up, the instruction register is loaded with the IDCODE instruction. It is also loaded with the IDCODE instruction if the controller is placed in a reset state as described in the previous section.

When the TAP controller is in the CaptureIR state, the two least significant bits are loaded with a binary “01” pattern to allow for fault isolation of the board level serial test path.

Bypass Register

To save time when serially shifting data through registers, it is sometimes advantageous to skip certain devices. The bypass register is a single-bit register that can be placed between TDI and TDO pins. This allows data to be shifted through the QuadPort DSE device with minimal delay. The bypass register is set LOW (VSS) when the BYPASS instruction is executed.

Boundary Scan Register

The boundary scan register is connected to all the input and output pins on the QuadPort DSE device. The boundary scan register is loaded with the contents of the QuadPort DSE device Input and Output ring when the TAP controller is in the Capture-DR state and is then placed between the TDI and TDO pins when the controller is moved to the Shift-DR state.

Document #: 38-06027 Rev. *B

Page 26 of 37

[+] Feedback

Page 25 Page 27
Image 26
Page 25 Page 27
Contents Cypress Semiconductor Corporation FeaturesQuadPort DSE Family Applications Processor Processed Data Path Functional DescriptionProcessor Pre-processed Data Path Queue #1Top Level Logic Block Diagram Port 1 Operation-control Logic Blocks2Port 1 Operation-Control Logic Block Diagram Address Readback is independent of CEsPin Configuration Ball Grid Array BGA Top ViewCY7C0430CV Unit Selection GuidePin Definitions Port DescriptionMask Register Readback Input . When asserted LOW Counter Interrupt Flag Output . Flag is asserted LOWOperating Range Electrical Characteristics Over the Operating RangeMaximum Ratings CapacitanceNormal Load Three-State DelayAC Test Load TAP LoadOutput Enable to Data Valid Chip Enable Set-up TimeChip Enable Hold Time Maximum FrequencyJtag Timing and Switching Waveforms Switching Waveforms Master Reset10Data OUT CLKAddress LatencyAddress B1 Bank Select Read 17Read-to-Write-to-Read OE = Read No Operation WriteCntld Cntinc Read-to-Write-to-Read OE Controlled19, 20, 21Read with Address Counter Advance23 DataoutWrite External Write with Write with Address Counter Advance 24Address Internal Counter HoldData Data OUT Counter Reset 21, 26Counter Write Read Reset Address Address nLoad Read Data with Counter External Address Internal Load and Read Address Counter28Cntrd Internal Mkrd Mask Internal Value Load and Read Mask RegisterMkld Load Read Mask Register ValuePort 1 Write to Port 2 Read34, 35 Counter Interrupt 37, 38 Mailbox Interrupt Timing40, 41, 42, 43Mode Operation OperationInterrupt Operation Example Master ResetInterrupts Port FunctionCntinc = Cntld = Cntrst = CLK Address Counter Control OperationsCntrd Mkrd Counter-Mask Register Test Mode Select Disabling the Jtag FeatureTest Access Port TAP-Test Clock TCK Performing a TAP ResetTAP Instruction Set Non-Debug Mode Go-NoGoIdentification ID Register Boundary Scan Cells BSC Debug ModeMbist Control States P4IO17-9TAP Controller State Diagram FSM53 EXIT2-IR UPDATE-DR UPDATE-IRMbist Debug Register MDR 391 JTAG/BIST TAP Controller Block DiagramMUX Bist TAP ControllerPlaces the bypass register BYR between TDI and TDO Scan Registers Sizes Register Name Bit SizeInstruction Identification Codes Description Between TDI and TDOMbist Control Register MCR MCR10 Mode CLKP4 Boundary Scan Order Cell # Signal Name Bump Ball IDCE0 CLKP3CLKP2 Ordering Information Package Diagram Lead Pbga 27 x 27 x 2.33 mm BG272SZV Issue Orig. Description of Change DateDocument History FSG
Top Page Image Contents