Xilinx DS610 manual Ieee 1149.1/1553 Jtag Test Access Port Timing, INTEST, EXTEST, Sample

Page 56

DC and Switching Characteristics

R

IEEE 1149.1/1553 JTAG Test Access Port Timing

TCK (Input)

TTMSTCK

TMS (Input)

TTDITCK

TDI (Input)

TDO (Output)

TCCH

TCCL

TTCKTMS

1/FTCK

 

TTCKTDI

 

TTCKTDO

 

 

DS099_06_040703

Figure 15: JTAG Waveforms

Table 55: Timing for the JTAG Test Access Port

 

 

 

All Speed

 

 

 

 

Grades

 

 

 

 

 

 

 

Symbol

 

Description

Min

Max

Units

Clock-to-Output Times

 

 

 

 

 

 

 

 

 

 

TTCKTDO

The time from the falling transition on the TCK pin to data appearing at the TDO pin

1.0

11.0

ns

Setup Times

 

 

 

 

 

 

 

 

 

 

TTDITCK

The time from the setup of data at the

All functions except those shown below

7.0

ns

 

TDI pin to the rising transition at the

 

 

 

 

 

Boundary scan commands

13.0

 

 

 

TCK pin

 

 

 

 

(INTEST, EXTEST, SAMPLE)

 

 

 

TTMSTCK

The time from the setup of a logic level at the TMS pin to the rising transition at the TCK pin

7.0

ns

Hold Times

 

 

 

 

 

 

 

 

 

 

TTCKTDI

The time from the rising transition at

All functions except those shown below

0

ns

 

the TCK pin to the point when data is

 

 

 

 

 

Configuration commands (CFG_IN, ISC_PROGRAM)

3.5

 

 

 

last held at the TDI pin

 

 

 

 

 

 

 

 

TTCKTMS

The time from the rising transition at the TCK pin to the point when a logic level is last held at the

0

ns

 

TMS pin

 

 

 

 

Clock Timing

 

 

 

 

 

 

 

 

 

 

TCCH

The High pulse width at the TCK pin

All functions except ISC_DNA command

5

ns

TCCL

The Low pulse width at the TCK pin

 

5

ns

TCCHDNA

The High pulse width at the TCK pin

During ISC_DNA command

10

10,000

ns

TCCLDNA

The Low pulse width at the TCK pin

 

10

10,000

ns

FTCK

Frequency of the TCK signal

BYPASS or HIGHZ instructions

0

33

MHz

 

 

All operations except for BYPASS or HIGHZ instructions

 

20

 

 

 

 

 

 

 

Notes:

1.The numbers in this table are based on the operating conditions set forth in Table 7.

56

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DS610-3 (v2.0) July 16, 2007

 

 

Product Specification

Image 56
Contents Product Specification DS610-1 v2.0 July 16DS610-2 v2.0 July 16 DS610-3 v2.0 July 16Data Sheet Spartan-3A and Spartan-3A DSP Fpga Differences FeaturesIntroduction Configuration Architectural OverviewCapabilities Introduction and Ordering InformationDCM CS484 FG676 Device CSG484 FGG676 User Diff XC3SD1800A519 227 XC3SD3400APackage Marking Ordering InformationStandard Packaging Pb-Free PackagingRevision History Date Version RevisionIntroduction and Ordering Information Added Low-power options no changes to this module DS610-2 v2.0 July 16Functional Description DC Electrical Characteristics Symbol Description Conditions Min Max UnitsAbsolute Maximum Ratings Absolute Maximum RatingsPower Supply Specifications DC and Switching CharacteristicsSupply Voltage Thresholds for Power-On Reset Symbol Description Min Max Units= GND General DC Characteristics for I/O PinsSymbol Description Test Conditions Min Typ Max Units Quiescent Supply Current Characteristics Typical2 Commercial Industrial Symbol Description DeviceQuiescent Current Requirements Maximum2Attribute Min Nom Max Single-Ended I/O StandardsCCO for Drivers Test Logic Level Conditions Characteristics AttributeTest Logic Level Conditions Attribute Max MinMin Nom Max Min mV Nom mV Max mV Differential I/O StandardsIostandard Attribute CCO for Drivers Iostandard Attribute Min mV Typ mV Max mV Device DNA Identifier Memory Characteristics Symbol Description Minimum UnitsDevice DNA Data Retention, Read Endurance External Termination Requirements for Differential I/OSwitching Characteristics Software Version RequirementsSpartan-3A DSP v1.29 Speed Grade Designations Sign Up for Alerts on Xilinx MySupportSpartan-3A DSP Speed File Version History Timing Pin-to-Pin Clock-to-Output Times for the IOB Output PathRate, without DCM At the Output pin. The DCM is not UseIfddelayvalue = Hold TimesSymbol Description Conditions Device Min Units Setup TimesSet/Reset Pulse Width Speed GradeIoplid Single-Ended Standards Lvttl LVCMOS33 LVCMOS25 LVCMOS18 LVCMOS15 LVCMOS12PCI333 PCI663 Differential StandardsTiming for the IOB Three-State Path Set/Reset TimesAsynchronous Output Enable/Disable Times QuietIO 27.67 QuietIOQuietIO 25.92 QuietIO 24.97LVDS25 LVDS33 BLVDS25 MINILVDS25 MINILVDS33 LVPECL25 Inputs OnlySignal Standard Inputs Outputs Timing Measurement MethodologyTest Methods for Timing Measurement at I/Os InputsVicm + RT ΩDifferential Device CS484 FG676 XC3SD1800A XC3SD3400A Simultaneously Switching Output GuidelinesEquivalent VCCO/GND Pairs per Bank CS484, FG676 Signal Standard Top, Bottom Left, RightPackage Type QuietIO PCI333 PCI663 Differential Standards Number of I/O Pairs or ChannelsClock Timing Configurable Logic Block CLB TimingCLB Slicem Timing Clock Distribution Switching Characteristics Clock Buffer/Multiplexer Switching CharacteristicsCLB Shift Register Switching Characteristics Clock Frequency Block RAM TimingBlock RAM Timing Setup Times for the DSP48A Speed Grade Symbol DescriptionSetup Times of Data Pins to the Pipeline Register Clock DSP48A TimingClock to Out from Pipeline Register Clock to Output Pins Clock to Out from Input Register Clock to Output PinsCombinatorial Delays from Input Pins to Output Pins Maximum FrequencyDelay-Locked Loop DLL Input Clock Jitter Tolerance Delay Path Variation4Digital Clock Manager DCM Timing Recommended Operating Conditions for the DLLSpeed Grade Symbol Description Switching Characteristics for the DFS Speed Grade Symbol Description Units Min MaxDigital Frequency Synthesizer DFS Recommended Operating Conditions for the DFSPhase Shifter PS Switching Characteristics for the PS in Variable Phase ModePhase Shifting Range Miscellaneous DCM TimingDNA Port Timing Dnaport Interface TimingSuspend Mode Timing Entering Suspend Mode Exiting Suspend ModeEntering Suspend Mode Symbol Description Min Typ Max UnitsAll Speed Grades Symbol Description Device Min Max Units Configuration and Jtag TimingGeneral Configuration Power-On/Reconfigure Timing Configuration Clock Cclk Characteristics Master Mode Cclk Output Period by ConfigRate Option SettingCclk clock period by 11.2Master Mode Cclk Output Minimum Low and High Time Slave Mode Cclk Input Low and High TimeEquivalent Cclk clock frequency Cclk Low and High timeMin Max Units Clock-to-Output Times Master Serial and Slave Serial Mode TimingSlave All Speed Grades Symbol Description Slave Parallel Mode Timing Serial Peripheral Interface SPI Configuration Timing Symbol Description Minimum Symbol Description Requirement Units Byte Peripheral Interface BPI Configuration Timing Symbol Description Minimum Maximum UnitsSetup time on M20 mode pins before the rising edge of Initb Hold time on M20 mode pins after the rising edge of InitbSymbol Description Requirement Units Parallel NOR Flash Prom output-enable timeParallel NOR Flash Prom read access time Parallel NOR Flash Prom chip-select timeIeee 1149.1/1553 Jtag Test Access Port Timing INTEST, EXTEST, SampleDiffhstli and Diffhstliii to , , and . Updated Tmds DC DSP48A timing in and TableDC and Switching Characteristics Type/Color Description Pin Names in Type Code Types of Pins on Spartan-3A DSP FPGAsPin Types Package Pins by Type Pinout Descriptions Types of Pins on Spartan-3A DSP FPGAsPower and Ground Supply Pins by Package Maximum User I/O by PackagePinout Descriptions Package Thermal CharacteristicsSpartan-3A DSP Package Thermal Characteristics CS484 484-Ball Chip-Scale Ball Grid Array Pinout TableSpartan-3A DSP CS484 Pinout Bank Pin Name CS484 Type BallPinout Descriptions Spartan-3A DSP CS484 Pinout VCCO1 AA3 DualAA4 AA6 InputVCCO2 AA5 Vcco AA9 VCCO2VCCO2 Vcco AA1 VrefGND AB1 VCCO3 VccoGND AA7 Vccaux Progb Config Done Vccaux TCKJtag Vccaux TMS Jtag TDOUser I/Os by Bank Footprint Migration DifferencesUser I/Os Per Bank for the XC3SD1800A in the CS484 Package User I/Os Per Bank for the XC3SD3400A in the CS484 PackageCS484 Footprint Left Half of Package top viewRight Half of CS484 Package top view FG676 676-Ball Fine-Pitch Ball Grid Array Pinout TableSpartan-3A DSP FG676 Pinout for Spartan-3A DSP FG676 Pinout for XC3SD1800A FpgaIOL26P0/GCLK6 IOL26N0/GCLK7IOL30N1/RHCLK1 IOL30P1/RHCLK0IOL33P1/RHCLK4 IOL31P1/RHCLK2IOL17P2/RDWRB IOL27P2/GCLK0AF3 AF4AF5 AF7 InputIP2/VREF2 AB6 Vref AB9IOL30N2/MOSI/CSIB IOL02N2/CSOB AA7 Dual IP2/VREF2 AA9 VrefIOL33P3/LHCLK2 IOL34N3/LHCLK5IOL34P3/LHCLK4 IOL35N3/LHCLK7AE1 Input AE2 VrefAD1 AD2Vccaux Progb Config TDI Jtag TDO GND AF1 AF6GND AD3 AD8 GND AA1 AA6User I/Os by Bank User I/Os Per Bank for the XC3SD1800A in the FG676 PackageTop 128 Right 519 314FG676 Footprint FG676 Package Footprint for XC3SD1800A Fpga top viewTDO Spartan-3A DSP FG676 Pinout for XC3SD3400A Fpga Bank XC3SD3400A Pin Name FG676 Type BallIOL16P0 G15 IOL08N0 G17 IOL02P0/VREF0 IOL01P0 G20VCCO0 Vcco IOL01P1/HDC IP1/VREF1IOL34P1/IRDY1/RHCLK6 IOL58N1 G22 IOL51P1 G23 IOL51N1 G24 DS610-4 v2.0 July 16IOL12P2 Y10 IOL05N1 AC25 IOL06P1T25 IOL23N2 AC11 IOL21N2 AC12 IP2 AC13 IOL29N2 AC14 IOL30P2 AC15 IOL38P2 AC16 IP2 AC17IOL40N2 AC19 IOL41N2 AC20 IOL45N2 AC21 IO2 AC22 VCCO2 AF7 Vcco AE5IOL32P3/LHCLK0 Lhclk IOL32N3/LHCLK1 IOL35P3/TRDY2/LHCLK6 IOL53P3 IOL53N3 IP3IOL36N3 IOL37P3 AA3 IP3/VREF3 AA5 Vref VCCO3 Vcco AB2 GND IP3/VREF3 VrefIOL10N3 IOL03N3 IP3 GND AD3 AD5 AD8 GND AC5 AC7GND AB3 GND AA1 AA4 AA6Vccaux AF2 AB4 AB5 Vccint AA8Vref are on Input pins User I/Os Per Bank for the XC3SD3400A in the FG676 PackageTop 111 Right Bottom 112 LeftFG676 Package Footprint for XC3SD3400A Fpga top view Pinout DescriptionsVCCO0 VREF1 FG676 Footprint Migration Differences VREF1Migration Recommendations Pinout Descriptions FG676 Footprint Migration DifferencesSPARTAN-3A DSP Fpga and XC3SD3400A Fpga . Minor editsPinout Descriptions