HP xw2x220c Blade manual Electrostatic discharge prevention, Acoustic noise specification

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Electrostatic discharge prevention

Static charges (voltage levels) occur when objects are separated or rubbed together. The voltage level of a static charge is determined by the following factors:

Types of materials

Relative humidity

Rate of change or separation

Follow these precautions to minimize possible ESD-induced failures in the computer room:

Maintain recommended humidity level and airflow rates in the computer room.

Install conductive flooring (conductive adhesive must be used when laying tiles).

Use conductive wax if waxed floors are necessary.

Ensure that all equipment and flooring are properly grounded and are at the same ground potential.

Use conductive tables and chairs.

Use a grounded wrist strap (or other grounding method) when handling circuit boards.

Store spare electronic modules in antistatic containers.

Acoustic noise specification

Declared noise emission values for the c7000 enclosure in accordance with ISO 9296:

Specification

Value

 

 

Declared sound power level, LWAd Bels

 

 

 

Idle

7.5

 

 

Operating

7.5

 

 

Declared sound pressure level, LpAm dBA

 

 

 

Idle

57

 

 

Operating

57

 

 

Detailed information on conformance to country Technical Regulations and certificates of conformance can be found on the HP website (http://www.hp.com/go/certificates).

These levels are appropriate for dedicated computer room environments, not office environments.

You must understand the acoustic noise specifications relative to operator positions within the computer room when adding additional systems to computer rooms with existing noise sources.

Ambient noise level in a computer room can be reduced as follows:

Dropped ceiling—Cover with a commercial grade of fire-resistant, acoustic rated, fiberglass ceiling tile.

Sound deadening—Cover the walls with curtains or other sound deadening material.

Removable partitions—Use foam rubber models for most effectiveness.

Environmental requirements 17

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Contents HP BladeSystem c-Class Site Planning Guide Intended audience Contents Conversion factors and formulas Technical support Related documentation IntroductionAbout this document HP site planning assistance General site preparation guidelinesAshrae guidelines for site planning Computer room preparation Site planning considerationsPage Basic air distribution systems Air conditioning system specificationsAir conditioning ducts Cabling requirementsAverage floor loading Floor loadingRaised floor loading Installation and maintenance precautions Computer room safetyFire protection Fire suppressionLighting requirements for equipment servicing Working space for component accessEnvironmental elements Environmental requirementsHumidity level Dust and pollutionMetallic particulate contamination Electrostatic discharge prevention Acoustic noise specificationAshrae Recommended operating environmentSpace requirements Airflow requirementsBlanking panels HP Rack Airflow Optimization KitEquipment clearance and floor loading Delivery space requirementsOperational space requirements Floor plan grid HP BladeSystem enclosure environmental specifications Rack and accessory footprintsFront door clearance Environmental requirements Environmental requirements Best practices for deployment in rows Third-party racks Rack placement and arrangement for proper airflowRack tie-down option kit Electrical factors Power requirements and considerationsPower requirements Power consumption Electrical load requirements circuit breaker sizing Power considerations Power qualityFactors affecting power quality Power system protectionPower redundancy Power optionsWire selection Non-redundant powerDistribution hardware Line voltage selectionGrounding systems Grounding requirementsRaceway systems electrical conduits Lahj Building distributionPower panel ground Power distribution safety grounding LahjComputer safety ground Dual power source groundingRaised floor high-frequency noise grounding Cabinet performance grounding high frequency groundEquipment grounding implementation details System installation guidelinesWiring connections Dynamic Power Capping Power configurationHP BladeSystem enclosure single-phase power configuration Data communications cablesPower requirements and considerations Power requirements and considerations Power requirements and considerations C7000 PDU example PDU installationC3000 PDU example HP BladeSystem c7000 Enclosure three-phase AC configuration HP BladeSystem c7000 Enclosure DC configuration HP BladeSystem enclosure DC power configurationHP BladeSystem c3000 Enclosure DC configuation Power supply specificationsSingle-phase HP 2250W Power Supply specification Specification Value Specification Value DC power supply specification Enclosure specifications Hardware specifications and requirementsHP BladeSystem c7000 Enclosure specifications HP BladeSystem c3000 Enclosure specificationsRack requirements HP 10000 G2 rack specificationsRack-free environment requirements Example configurations Configuration scenariosExample minimum configuration Example typical configurationExample maximum configuration Estimating power and cooling Estimating total weight Preparing for installation Preparing for installation Additional rack considerations General component placement guidelinesRack configuration software Sample checklists Sample installation scheduleIs there a completed floor plan? Delivery survey Page Formulas Conversion factors and formulasConversion factors HP contact information Technical supportBefore you contact HP Acronyms and abbreviations UPS Glossary Apparent powerKVA Index Site planning assistance from HP

xw2x220c Blade specifications

The HP xw2x220c Blade is designed for organizations that require a high-performance, space-efficient computing solution. This blade server epitomizes the commitment to enhancing data center efficiency and maximizing computing power without compromising on reliability.

One of the standout features of the HP xw2x220c Blade is its compact form factor, which enables organizations to fit a substantial amount of computing power in a small footprint. This is particularly beneficial for businesses with limited space, as they can host more servers within the same physical environment. The blade is optimized for virtualization, allowing it to handle multiple workloads simultaneously, which translates to cost savings and better resource utilization.

The server is powered by advanced Intel Xeon processors, ensuring efficient processing capabilities for demanding applications. The HP xw2x220c Blade supports multiple CPU options, allowing organizations to select the configuration that best meets their workload requirements. Leveraging Intel's latest technologies, it offers enhanced performance while maintaining energy efficiency, which is a critical consideration in today’s environmentally conscious technological landscape.

In terms of memory, the xw2x220c Blade supports high-capacity DDR4 RAM, which enhances data access speeds and ensures smooth operation even during heavy loads. The architecture of the blade also includes advanced cooling technology that optimizes airflow to maintain optimal temperatures, thereby prolonging hardware lifespan and reliability.

Network connectivity is a vital feature, and the HP xw2x220c Blade offers multiple Ethernet ports for flexible networking options, as well as support for fibre channel connections. This enables seamless integration into existing network configurations, ensuring high-speed data transfer rates that are crucial for real-time applications.

Security features are also integrated into the HP xw2x220c Blade, including options for secure boot, system integrity verification, and advanced encryption capabilities. These attributes protect sensitive data from unauthorized access and potential breaches, which is essential for organizations dealing with confidential information.

In conclusion, the HP xw2x220c Blade is a formidable choice for businesses seeking a compact, powerful, and efficient computing solution. Its combination of advanced processing capabilities, extensive memory support, flexible networking options, and robust security features makes it well-suited for a variety of applications, making it an essential component for modern data centers.