HP xw2x220c Blade manual Example maximum configuration

Page 55

HP ProLiant BL465c Server Blades (16)

o 2.8-GHz AMD Opteron™ Model 2220 processor (2 per server blade) o 8GB (4 x 2GB) RAM per server blade

o 72GB 15,000-rpm SAS hard drives (2 per server blade)

o QLogic Dual-Port Fibre Channel Mezzanine (1 per server blade)

Total system leakage current per branch

0 mA

 

 

Total system inrush current per branch (2 mS)

210 A

 

 

Total system weight (includes power and rack)

301 kg (664 lb)

 

 

Power credentials

Idle

 

100% utilization

Circuit sizing

 

 

 

 

 

 

 

Total input power

2957

W

4624

W

6244

W

 

 

 

 

 

 

 

Total input VA

3017

VA

4718

VA

6372

VA

 

 

 

 

BTU

10083 BTU

15767 BTU

21293 BTU

 

 

 

 

Total input current

14.51 A

22.68 A

30.63 A

 

 

 

 

 

 

 

Total airflow (CFM)

262

 

349

 

516

 

 

 

 

 

Total airflow (CMM)

7.408

9.877

14.611

 

 

 

 

 

 

 

Example maximum configuration

This power summary is based on the following configuration:

HP BladeSystem c7000 Enclosure (1)

HP Virtual Connect Ethernet Modules (2)

HP Virtual Connect Fibre Channel Modules (2)

HP 4X DDR InfiniBand Switch Module for HP c-Class BladeSystem (1)

HP ProLiant BL460 Server Blades (16)

o 2.66-Ghz Intel® Xeon™ processor X5355, quad-core (2 per server blade) o 16GB (8 x 2GB) RAM per server blade

o 72GB 15,000-rpm SAS hard drives (2 per server blade) o Emulex Fibre Channel mezzanine (1 per server blade) o HP 4X DDR InfiniBand Mezzanine (1 per server blade)

Total system leakage current per branch

0 mA

 

 

Total system inrush current per branch (2 mS)

210 A

 

 

Total system weight (includes power and rack)

204 kg (450 lb)

 

 

Power credentials

Idle

100% utilization

Circuit sizing

 

 

 

 

 

 

Total input power

4484 W

6801

W

8891

W

 

 

 

 

 

 

Total input VA

4575 VA

6940

VA

9072

VA

 

 

 

 

BTU

15289 BTU

23190 BTU

30318 BTU

 

 

 

 

Total input current

22 A

33.36 A

43.62 A

 

 

 

 

 

 

Total airflow (CFM)

270

360

 

530

 

 

 

 

 

 

 

Configuration scenarios 55

Image 55
Contents HP BladeSystem c-Class Site Planning Guide Intended audience Contents Conversion factors and formulas Technical support About this document IntroductionRelated documentation Ashrae guidelines for site planning General site preparation guidelinesHP site planning assistance Computer room preparation Site planning considerationsPage Basic air distribution systems Air conditioning system specificationsAir conditioning ducts Cabling requirementsRaised floor loading Floor loadingAverage floor loading Fire suppression Computer room safetyInstallation and maintenance precautions Fire protectionLighting requirements for equipment servicing Working space for component accessDust and pollution Environmental requirementsEnvironmental elements Humidity levelMetallic particulate contamination Electrostatic discharge prevention Acoustic noise specificationAshrae Recommended operating environmentHP Rack Airflow Optimization Kit Airflow requirementsSpace requirements Blanking panelsOperational space requirements Delivery space requirementsEquipment clearance and floor loading Floor plan grid HP BladeSystem enclosure environmental specifications Rack and accessory footprintsFront door clearance Environmental requirements Environmental requirements Best practices for deployment in rows Third-party racks Rack placement and arrangement for proper airflowRack tie-down option kit Power requirements Power requirements and considerationsElectrical factors Power consumption Electrical load requirements circuit breaker sizing Power system protection Power qualityPower considerations Factors affecting power qualityPower redundancy Power optionsLine voltage selection Non-redundant powerWire selection Distribution hardwareBuilding distribution Grounding requirementsGrounding systems Raceway systems electrical conduits LahjDual power source grounding Power distribution safety grounding LahjPower panel ground Computer safety groundRaised floor high-frequency noise grounding Cabinet performance grounding high frequency groundWiring connections System installation guidelinesEquipment grounding implementation details Data communications cables Power configurationDynamic Power Capping HP BladeSystem enclosure single-phase power configurationPower requirements and considerations Power requirements and considerations Power requirements and considerations C7000 PDU example PDU installationC3000 PDU example HP BladeSystem c7000 Enclosure three-phase AC configuration HP BladeSystem c7000 Enclosure DC configuration HP BladeSystem enclosure DC power configurationSingle-phase HP 2250W Power Supply specification Power supply specificationsHP BladeSystem c3000 Enclosure DC configuation Specification Value Specification Value DC power supply specification HP BladeSystem c3000 Enclosure specifications Hardware specifications and requirementsEnclosure specifications HP BladeSystem c7000 Enclosure specificationsRack requirements HP 10000 G2 rack specificationsRack-free environment requirements Example typical configuration Configuration scenariosExample configurations Example minimum configurationExample maximum configuration Estimating power and cooling Estimating total weight Preparing for installation Preparing for installation Additional rack considerations General component placement guidelinesRack configuration software Sample checklists Sample installation scheduleIs there a completed floor plan? Delivery survey Page Conversion factors Conversion factors and formulasFormulas Before you contact HP Technical supportHP contact information Acronyms and abbreviations UPS Glossary Apparent powerKVA Index Site planning assistance from HP

xw2x220c Blade specifications

The HP xw2x220c Blade is designed for organizations that require a high-performance, space-efficient computing solution. This blade server epitomizes the commitment to enhancing data center efficiency and maximizing computing power without compromising on reliability.

One of the standout features of the HP xw2x220c Blade is its compact form factor, which enables organizations to fit a substantial amount of computing power in a small footprint. This is particularly beneficial for businesses with limited space, as they can host more servers within the same physical environment. The blade is optimized for virtualization, allowing it to handle multiple workloads simultaneously, which translates to cost savings and better resource utilization.

The server is powered by advanced Intel Xeon processors, ensuring efficient processing capabilities for demanding applications. The HP xw2x220c Blade supports multiple CPU options, allowing organizations to select the configuration that best meets their workload requirements. Leveraging Intel's latest technologies, it offers enhanced performance while maintaining energy efficiency, which is a critical consideration in today’s environmentally conscious technological landscape.

In terms of memory, the xw2x220c Blade supports high-capacity DDR4 RAM, which enhances data access speeds and ensures smooth operation even during heavy loads. The architecture of the blade also includes advanced cooling technology that optimizes airflow to maintain optimal temperatures, thereby prolonging hardware lifespan and reliability.

Network connectivity is a vital feature, and the HP xw2x220c Blade offers multiple Ethernet ports for flexible networking options, as well as support for fibre channel connections. This enables seamless integration into existing network configurations, ensuring high-speed data transfer rates that are crucial for real-time applications.

Security features are also integrated into the HP xw2x220c Blade, including options for secure boot, system integrity verification, and advanced encryption capabilities. These attributes protect sensitive data from unauthorized access and potential breaches, which is essential for organizations dealing with confidential information.

In conclusion, the HP xw2x220c Blade is a formidable choice for businesses seeking a compact, powerful, and efficient computing solution. Its combination of advanced processing capabilities, extensive memory support, flexible networking options, and robust security features makes it well-suited for a variety of applications, making it an essential component for modern data centers.