HP xw2x220c Blade manual Estimating power and cooling

Page 56

Power credentials

Idle

100% utilization

Circuit sizing

 

 

 

 

Total airflow (CMM)

7.652

10.203

15.019

 

 

 

 

Estimating power and cooling

Power consumed by a c-Class BladeSystem solution is converted to heat, which is expressed in British thermal units per hour (BTU/h). You can calculate the heat load for a system by using the following equation: Heat Load = Power (Watts) x 3.413 BTU/h.

In the preceding equation, 1 W equals 3.413 BTU/h. A c7000 enclosure fully loaded with dual-socket server blades, with dual-core processors might use 5 kW of power, thereby generating almost 17,000 BTU/h. The installation of a c-Class BladeSystem solution into a computer room containing existing systems might have a significant impact on cooling requirements. HP Data Center Services provides consultation to assist you in developing an efficient high-density cooling strategy by using dynamic modeling.

For more information, contact your HP sales representative.

A complete discussion of cooling requirements is beyond the scope of this guide. For more information, see the following sources:

•Technology Brief TC050901TB Optimizing data centers for high-density computing, 2nd edition available on the HP website (http://h20000.www2.hp.com/bc/docs/support/SupportManual/c00064724/c00064724.pdf).

•Best practices for HP 10000 Series and HP 10000 G2 Series Racks, available on the HP website

(http://h20000.www2.hp.com/bc/docs/support/SupportManual/c00883424/c00883424.pdf).

Modern blade systems should budget at least 4 kW of actual power use per enclosure at maximum configuration. Using modern day kW/cabinet to W/sf conversion ratios this equates to ~ 90 W/sf for each single blade server chassis.

Placing just three server blade chassis systems into a rack equates to a power density of at least 250 W/sf. When planning upgrades to older data centers to add server blades, plan to upgrade the electrical and mechanical infrastructure to properly support the added electrical and cooling requirements. New datacenter planning for bladesystems must specify a minimum of 250 W/sf or 12 kW/cabinet power densities.

To estimate computer-room cooling requirements, first calculate the amount of energy used by the solution. HP provides online power-consumption calculators that enable you to configure a virtual rack and determine its power consumption. See the HP website (http://www.hp.com/go/bladesystem/powercalculator).

For other models, obtain the power consumption data from a component's specifications.

The QuickSpecs contains the specifications for all HP products. Photocopy the following worksheet and use it to calculate power consumption and heat load.

Configuration scenarios 56

Page 55 Page 57
Image 56
Page 55 Page 57
Contents HP BladeSystem c-Class Site Planning Guide Intended audience Contents Conversion factors and formulas Technical support Related documentation IntroductionAbout this document HP site planning assistance General site preparation guidelinesAshrae guidelines for site planning Site planning considerations Computer room preparationPage Air conditioning system specifications Basic air distribution systemsCabling requirements Air conditioning ductsAverage floor loading Floor loadingRaised floor loading Computer room safety Installation and maintenance precautionsFire protection Fire suppressionWorking space for component access Lighting requirements for equipment servicingEnvironmental requirements Environmental elementsHumidity level Dust and pollutionMetallic particulate contamination Acoustic noise specification Electrostatic discharge preventionRecommended operating environment AshraeAirflow requirements Space requirementsBlanking panels HP Rack Airflow Optimization KitEquipment clearance and floor loading Delivery space requirementsOperational space requirements Floor plan grid Rack and accessory footprints HP BladeSystem enclosure environmental specificationsFront door clearance Environmental requirements Environmental requirements Best practices for deployment in rows Rack placement and arrangement for proper airflow Third-party racksRack tie-down option kit Electrical factors Power requirements and considerationsPower requirements Power consumption Electrical load requirements circuit breaker sizing Power quality Power considerationsFactors affecting power quality Power system protectionPower options Power redundancyNon-redundant power Wire selectionDistribution hardware Line voltage selectionGrounding requirements Grounding systemsRaceway systems electrical conduits Lahj Building distributionPower distribution safety grounding Lahj Power panel groundComputer safety ground Dual power source groundingCabinet performance grounding high frequency ground Raised floor high-frequency noise groundingEquipment grounding implementation details System installation guidelinesWiring connections Power configuration Dynamic Power CappingHP BladeSystem enclosure single-phase power configuration Data communications cablesPower requirements and considerations Power requirements and considerations Power requirements and considerations PDU installation C7000 PDU exampleC3000 PDU example HP BladeSystem c7000 Enclosure three-phase AC configuration HP BladeSystem enclosure DC power configuration HP BladeSystem c7000 Enclosure DC configurationHP BladeSystem c3000 Enclosure DC configuation Power supply specificationsSingle-phase HP 2250W Power Supply specification Specification Value Specification Value DC power supply specification Hardware specifications and requirements Enclosure specificationsHP BladeSystem c7000 Enclosure specifications HP BladeSystem c3000 Enclosure specificationsHP 10000 G2 rack specifications Rack requirementsRack-free environment requirements Configuration scenarios Example configurationsExample minimum configuration Example typical configurationExample maximum configuration Estimating power and cooling Estimating total weight Preparing for installation Preparing for installation General component placement guidelines Additional rack considerationsRack configuration software Sample installation schedule Sample checklistsIs there a completed floor plan? Delivery survey Page Formulas Conversion factors and formulasConversion factors HP contact information Technical supportBefore you contact HP Acronyms and abbreviations UPS Apparent power GlossaryKVA Index Site planning assistance from HP

xw2x220c Blade specifications

The HP xw2x220c Blade is designed for organizations that require a high-performance, space-efficient computing solution. This blade server epitomizes the commitment to enhancing data center efficiency and maximizing computing power without compromising on reliability.

One of the standout features of the HP xw2x220c Blade is its compact form factor, which enables organizations to fit a substantial amount of computing power in a small footprint. This is particularly beneficial for businesses with limited space, as they can host more servers within the same physical environment. The blade is optimized for virtualization, allowing it to handle multiple workloads simultaneously, which translates to cost savings and better resource utilization.

The server is powered by advanced Intel Xeon processors, ensuring efficient processing capabilities for demanding applications. The HP xw2x220c Blade supports multiple CPU options, allowing organizations to select the configuration that best meets their workload requirements. Leveraging Intel's latest technologies, it offers enhanced performance while maintaining energy efficiency, which is a critical consideration in today’s environmentally conscious technological landscape.

In terms of memory, the xw2x220c Blade supports high-capacity DDR4 RAM, which enhances data access speeds and ensures smooth operation even during heavy loads. The architecture of the blade also includes advanced cooling technology that optimizes airflow to maintain optimal temperatures, thereby prolonging hardware lifespan and reliability.

Network connectivity is a vital feature, and the HP xw2x220c Blade offers multiple Ethernet ports for flexible networking options, as well as support for fibre channel connections. This enables seamless integration into existing network configurations, ensuring high-speed data transfer rates that are crucial for real-time applications.

Security features are also integrated into the HP xw2x220c Blade, including options for secure boot, system integrity verification, and advanced encryption capabilities. These attributes protect sensitive data from unauthorized access and potential breaches, which is essential for organizations dealing with confidential information.

In conclusion, the HP xw2x220c Blade is a formidable choice for businesses seeking a compact, powerful, and efficient computing solution. Its combination of advanced processing capabilities, extensive memory support, flexible networking options, and robust security features makes it well-suited for a variety of applications, making it an essential component for modern data centers.
Top Page Image Contents