HP xw2x220c Blade manual Conversion factors and formulas

Page 4

Rack placement and arrangement for proper airflow

27

Rack tie-down option kit

28

Power requirements and considerations

29

Power requirements

29

Electrical factors

29

Power consumption

30

Electrical load requirements (circuit breaker sizing)

31

Power quality

32

Power considerations

32

Distribution hardware

34

Grounding requirements

35

Grounding systems

35

System installation guidelines

38

Power configuration

39

Dynamic Power Capping

39

HP BladeSystem enclosure single-phase power configuration

39

HP BladeSystem c7000 Enclosure three-phase AC configuration

45

HP BladeSystem enclosure DC power configuration

46

Power supply specifications

47

Single-phase HP 2250W Power Supply specification

47

Single-phase HP 2400W High Efficiency Power Supply specification

48

Three-phase HP 2250W Power Supply specification (North America/Japan)

48

Three-phase HP 2400W High Efficiency Power Supply specification (North America/Japan)

49

Three-phase HP 2250W Power Supply specification (International)

49

Three-phase HP 2400W Power Supply specification (International)

50

DC power supply specification

50

Hardware specifications and requirements

51

Enclosure specifications

51

HP BladeSystem c7000 Enclosure specifications

51

HP BladeSystem c3000 Enclosure specifications

51

HP 10000 G2 rack specifications

52

Rack requirements

52

Rack-free environment requirements

53

Configuration scenarios

54

Example configurations

54

Example minimum configuration

54

Example typical configuration

54

Example maximum configuration

55

Estimating power and cooling

56

Estimating total weight

57

Preparing for installation

58

Warning, caution, and important messages

58

Additional rack considerations

60

General component placement guidelines

60

Rack configuration software

61

Sample installation schedule

62

Sample checklists

62

Delivery survey

64

Conversion factors and formulas

66

Conversion factors

66

Contents

4

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Contents HP BladeSystem c-Class Site Planning Guide Intended audience Contents Conversion factors and formulas Technical support About this document IntroductionRelated documentation Ashrae guidelines for site planning General site preparation guidelinesHP site planning assistance Site planning considerations Computer room preparationPage Air conditioning system specifications Basic air distribution systemsCabling requirements Air conditioning ductsRaised floor loading Floor loadingAverage floor loading Computer room safety Installation and maintenance precautionsFire protection Fire suppressionWorking space for component access Lighting requirements for equipment servicingEnvironmental requirements Environmental elementsHumidity level Dust and pollutionMetallic particulate contamination Acoustic noise specification Electrostatic discharge preventionRecommended operating environment AshraeAirflow requirements Space requirementsBlanking panels HP Rack Airflow Optimization KitOperational space requirements Delivery space requirementsEquipment clearance and floor loading Floor plan grid Rack and accessory footprints HP BladeSystem enclosure environmental specificationsFront door clearance Environmental requirements Environmental requirements Best practices for deployment in rows Rack placement and arrangement for proper airflow Third-party racksRack tie-down option kit Power requirements Power requirements and considerationsElectrical factors Power consumption Electrical load requirements circuit breaker sizing Power quality Power considerationsFactors affecting power quality Power system protectionPower options Power redundancyNon-redundant power Wire selectionDistribution hardware Line voltage selectionGrounding requirements Grounding systemsRaceway systems electrical conduits Lahj Building distributionPower distribution safety grounding Lahj Power panel groundComputer safety ground Dual power source groundingCabinet performance grounding high frequency ground Raised floor high-frequency noise groundingWiring connections System installation guidelinesEquipment grounding implementation details Power configuration Dynamic Power CappingHP BladeSystem enclosure single-phase power configuration Data communications cablesPower requirements and considerations Power requirements and considerations Power requirements and considerations PDU installation C7000 PDU exampleC3000 PDU example HP BladeSystem c7000 Enclosure three-phase AC configuration HP BladeSystem enclosure DC power configuration HP BladeSystem c7000 Enclosure DC configurationSingle-phase HP 2250W Power Supply specification Power supply specificationsHP BladeSystem c3000 Enclosure DC configuation Specification Value Specification Value DC power supply specification Hardware specifications and requirements Enclosure specificationsHP BladeSystem c7000 Enclosure specifications HP BladeSystem c3000 Enclosure specificationsHP 10000 G2 rack specifications Rack requirementsRack-free environment requirements Configuration scenarios Example configurationsExample minimum configuration Example typical configurationExample maximum configuration Estimating power and cooling Estimating total weight Preparing for installation Preparing for installation General component placement guidelines Additional rack considerationsRack configuration software Sample installation schedule Sample checklistsIs there a completed floor plan? Delivery survey Page Conversion factors Conversion factors and formulasFormulas Before you contact HP Technical supportHP contact information Acronyms and abbreviations UPS Apparent power GlossaryKVA Index Site planning assistance from HP

xw2x220c Blade specifications

The HP xw2x220c Blade is designed for organizations that require a high-performance, space-efficient computing solution. This blade server epitomizes the commitment to enhancing data center efficiency and maximizing computing power without compromising on reliability.

One of the standout features of the HP xw2x220c Blade is its compact form factor, which enables organizations to fit a substantial amount of computing power in a small footprint. This is particularly beneficial for businesses with limited space, as they can host more servers within the same physical environment. The blade is optimized for virtualization, allowing it to handle multiple workloads simultaneously, which translates to cost savings and better resource utilization.

The server is powered by advanced Intel Xeon processors, ensuring efficient processing capabilities for demanding applications. The HP xw2x220c Blade supports multiple CPU options, allowing organizations to select the configuration that best meets their workload requirements. Leveraging Intel's latest technologies, it offers enhanced performance while maintaining energy efficiency, which is a critical consideration in today’s environmentally conscious technological landscape.

In terms of memory, the xw2x220c Blade supports high-capacity DDR4 RAM, which enhances data access speeds and ensures smooth operation even during heavy loads. The architecture of the blade also includes advanced cooling technology that optimizes airflow to maintain optimal temperatures, thereby prolonging hardware lifespan and reliability.

Network connectivity is a vital feature, and the HP xw2x220c Blade offers multiple Ethernet ports for flexible networking options, as well as support for fibre channel connections. This enables seamless integration into existing network configurations, ensuring high-speed data transfer rates that are crucial for real-time applications.

Security features are also integrated into the HP xw2x220c Blade, including options for secure boot, system integrity verification, and advanced encryption capabilities. These attributes protect sensitive data from unauthorized access and potential breaches, which is essential for organizations dealing with confidential information.

In conclusion, the HP xw2x220c Blade is a formidable choice for businesses seeking a compact, powerful, and efficient computing solution. Its combination of advanced processing capabilities, extensive memory support, flexible networking options, and robust security features makes it well-suited for a variety of applications, making it an essential component for modern data centers.