HP xw2x220c Blade manual Rack-free environment requirements

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•Front door: The clearance from face of rack to inside of the front door must be a minimum of 77 mm (3 in).

•Rear door: The clearance between the rear of the enclosure and the rear rack door must be a minimum of 175 mm (6.9 in) to accommodate system cabling.

•Side: The clearance between the installed rack component and the side panels of the rack must be a minimum of 70 mm (2.75 in).

•Width: 483 mm (19 in)

•Depth: Maximum clearance between front and rear RETMA rails is 864 mm (34 in). Minimum clearance for round-hole racks is 627 mm (24.7 in). Minimum clearance for square-hole racks is 635 mm (25 in).

•The rack must be able to accept the adjustable rack rails that are shipped with each enclosure: o Minimum rail length: 635 mm (25 in)

o Maximum rail length: 864 mm (34 in)

Rack-free environment requirements

The HP BladeSystem c7000 Enclosure (referred to as the enclosure) can be used in a rack-free environment. The following conditions must be met when performing a rack-free installation:

•A fully-populated enclosure can weigh up to 217.7 kg (480 lb). The object supporting the enclosure must be able to withstand this weight.

•The enclosure should be supported by a sturdy, flat surface.

WARNING: To reduce the risk of personal injury or damage to the equipment in a rack-free environment:

•Never stack an enclosure on top of another enclosure.

•Never place equipment on top of an enclosure.

•Never place an enclosure on a surface that cannot support up to 217.7 kg (480 lb).

Hardware specifications and requirements 53

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Contents HP BladeSystem c-Class Site Planning Guide Intended audience Contents Conversion factors and formulas Technical support Related documentation IntroductionAbout this document HP site planning assistance General site preparation guidelinesAshrae guidelines for site planning Computer room preparation Site planning considerationsPage Basic air distribution systems Air conditioning system specificationsAir conditioning ducts Cabling requirementsAverage floor loading Floor loadingRaised floor loading Installation and maintenance precautions Computer room safetyFire protection Fire suppressionLighting requirements for equipment servicing Working space for component accessEnvironmental elements Environmental requirementsHumidity level Dust and pollutionMetallic particulate contamination Electrostatic discharge prevention Acoustic noise specificationAshrae Recommended operating environmentSpace requirements Airflow requirementsBlanking panels HP Rack Airflow Optimization KitEquipment clearance and floor loading Delivery space requirementsOperational space requirements Floor plan grid HP BladeSystem enclosure environmental specifications Rack and accessory footprintsFront door clearance Environmental requirements Environmental requirements Best practices for deployment in rows Third-party racks Rack placement and arrangement for proper airflowRack tie-down option kit Electrical factors Power requirements and considerationsPower requirements Power consumption Electrical load requirements circuit breaker sizing Power considerations Power qualityFactors affecting power quality Power system protectionPower redundancy Power optionsWire selection Non-redundant powerDistribution hardware Line voltage selectionGrounding systems Grounding requirementsRaceway systems electrical conduits Lahj Building distributionPower panel ground Power distribution safety grounding LahjComputer safety ground Dual power source groundingRaised floor high-frequency noise grounding Cabinet performance grounding high frequency groundEquipment grounding implementation details System installation guidelinesWiring connections Dynamic Power Capping Power configurationHP BladeSystem enclosure single-phase power configuration Data communications cablesPower requirements and considerations Power requirements and considerations Power requirements and considerations C7000 PDU example PDU installationC3000 PDU example HP BladeSystem c7000 Enclosure three-phase AC configuration HP BladeSystem c7000 Enclosure DC configuration HP BladeSystem enclosure DC power configurationHP BladeSystem c3000 Enclosure DC configuation Power supply specificationsSingle-phase HP 2250W Power Supply specification Specification Value Specification Value DC power supply specification Enclosure specifications Hardware specifications and requirementsHP BladeSystem c7000 Enclosure specifications HP BladeSystem c3000 Enclosure specificationsRack requirements HP 10000 G2 rack specificationsRack-free environment requirements Example configurations Configuration scenariosExample minimum configuration Example typical configurationExample maximum configuration Estimating power and cooling Estimating total weight Preparing for installation Preparing for installation Additional rack considerations General component placement guidelinesRack configuration software Sample checklists Sample installation scheduleIs there a completed floor plan? Delivery survey Page Formulas Conversion factors and formulasConversion factors HP contact information Technical supportBefore you contact HP Acronyms and abbreviations UPS Glossary Apparent powerKVA Index Site planning assistance from HP

xw2x220c Blade specifications

The HP xw2x220c Blade is designed for organizations that require a high-performance, space-efficient computing solution. This blade server epitomizes the commitment to enhancing data center efficiency and maximizing computing power without compromising on reliability.

One of the standout features of the HP xw2x220c Blade is its compact form factor, which enables organizations to fit a substantial amount of computing power in a small footprint. This is particularly beneficial for businesses with limited space, as they can host more servers within the same physical environment. The blade is optimized for virtualization, allowing it to handle multiple workloads simultaneously, which translates to cost savings and better resource utilization.

The server is powered by advanced Intel Xeon processors, ensuring efficient processing capabilities for demanding applications. The HP xw2x220c Blade supports multiple CPU options, allowing organizations to select the configuration that best meets their workload requirements. Leveraging Intel's latest technologies, it offers enhanced performance while maintaining energy efficiency, which is a critical consideration in today’s environmentally conscious technological landscape.

In terms of memory, the xw2x220c Blade supports high-capacity DDR4 RAM, which enhances data access speeds and ensures smooth operation even during heavy loads. The architecture of the blade also includes advanced cooling technology that optimizes airflow to maintain optimal temperatures, thereby prolonging hardware lifespan and reliability.

Network connectivity is a vital feature, and the HP xw2x220c Blade offers multiple Ethernet ports for flexible networking options, as well as support for fibre channel connections. This enables seamless integration into existing network configurations, ensuring high-speed data transfer rates that are crucial for real-time applications.

Security features are also integrated into the HP xw2x220c Blade, including options for secure boot, system integrity verification, and advanced encryption capabilities. These attributes protect sensitive data from unauthorized access and potential breaches, which is essential for organizations dealing with confidential information.

In conclusion, the HP xw2x220c Blade is a formidable choice for businesses seeking a compact, powerful, and efficient computing solution. Its combination of advanced processing capabilities, extensive memory support, flexible networking options, and robust security features makes it well-suited for a variety of applications, making it an essential component for modern data centers.
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