HP xw2x220c Blade manual Rack and accessory footprints

Page 22

HP BladeSystem enclosure environmental specifications

Specification

Value

 

 

Temperature range*

 

 

 

Operating

10°C to 35°C (50°F to 95°F)

 

 

Non-operating

-30°C to 60°C (-22°F to 140°F)

 

 

Wet bulb temperature

 

 

 

Operating

28ºC (82.4ºF)

 

 

Non-operating

38.7ºC (101.7ºF)

 

 

Relative humidity

 

(noncondensing)**

 

 

 

Operating

20% to 80%

 

 

Non-operating

5% to 95%

 

 

*All temperature ratings shown are for sea level. An altitude derating of 1°C per 304.8 m (1.8°F per 1000 ft) to 3048 m (10,000 ft) is applicable. No direct sunlight allowed. Upper operating limit is 3,048 m (10,000 ft) or 70 kPa/10.1 psia. Upper non-operating limit is 9,144 m (30,000 ft) or 30.3 kPa (4.4 psia).

**Storage maximum humidity of 95% is based on a maximum temperature of 45°C (113°F). Altitude maximum for storage corresponds to a pressure minimum of 70 kPa (10.1 psia).

Rack and accessory footprints

When accessories such as extensions and stabilizing kits are added to a particular rack, the footprint of the rack extends into the rack rear row and infringes upon necessary clearances.

Footprint for a 600 mm rack configuration with an extension kit installed (598 mm wide x 1184.9 mm deep):

Environmental requirements 22

Page 21 Page 23
Image 22
Page 21 Page 23
Contents HP BladeSystem c-Class Site Planning Guide Intended audience Contents Conversion factors and formulas Technical support About this document IntroductionRelated documentation Ashrae guidelines for site planning General site preparation guidelinesHP site planning assistance Site planning considerations Computer room preparationPage Air conditioning system specifications Basic air distribution systemsCabling requirements Air conditioning ductsRaised floor loading Floor loadingAverage floor loading Fire protection Computer room safetyInstallation and maintenance precautions Fire suppressionWorking space for component access Lighting requirements for equipment servicingHumidity level Environmental requirementsEnvironmental elements Dust and pollutionMetallic particulate contamination Acoustic noise specification Electrostatic discharge preventionRecommended operating environment AshraeBlanking panels Airflow requirementsSpace requirements HP Rack Airflow Optimization KitOperational space requirements Delivery space requirementsEquipment clearance and floor loading Floor plan grid Rack and accessory footprints HP BladeSystem enclosure environmental specificationsFront door clearance Environmental requirements Environmental requirements Best practices for deployment in rows Rack placement and arrangement for proper airflow Third-party racksRack tie-down option kit Power requirements Power requirements and considerationsElectrical factors Power consumption Electrical load requirements circuit breaker sizing Factors affecting power quality Power qualityPower considerations Power system protectionPower options Power redundancyDistribution hardware Non-redundant powerWire selection Line voltage selectionRaceway systems electrical conduits Lahj Grounding requirementsGrounding systems Building distributionComputer safety ground Power distribution safety grounding LahjPower panel ground Dual power source groundingCabinet performance grounding high frequency ground Raised floor high-frequency noise groundingWiring connections System installation guidelinesEquipment grounding implementation details HP BladeSystem enclosure single-phase power configuration Power configurationDynamic Power Capping Data communications cablesPower requirements and considerations Power requirements and considerations Power requirements and considerations PDU installation C7000 PDU exampleC3000 PDU example HP BladeSystem c7000 Enclosure three-phase AC configuration HP BladeSystem enclosure DC power configuration HP BladeSystem c7000 Enclosure DC configurationSingle-phase HP 2250W Power Supply specification Power supply specificationsHP BladeSystem c3000 Enclosure DC configuation Specification Value Specification Value DC power supply specification HP BladeSystem c7000 Enclosure specifications Hardware specifications and requirementsEnclosure specifications HP BladeSystem c3000 Enclosure specificationsHP 10000 G2 rack specifications Rack requirementsRack-free environment requirements Example minimum configuration Configuration scenariosExample configurations Example typical configurationExample maximum configuration Estimating power and cooling Estimating total weight Preparing for installation Preparing for installation General component placement guidelines Additional rack considerationsRack configuration software Sample installation schedule Sample checklistsIs there a completed floor plan? Delivery survey Page Conversion factors Conversion factors and formulasFormulas Before you contact HP Technical supportHP contact information Acronyms and abbreviations UPS Apparent power GlossaryKVA Index Site planning assistance from HP

xw2x220c Blade specifications

The HP xw2x220c Blade is designed for organizations that require a high-performance, space-efficient computing solution. This blade server epitomizes the commitment to enhancing data center efficiency and maximizing computing power without compromising on reliability.

One of the standout features of the HP xw2x220c Blade is its compact form factor, which enables organizations to fit a substantial amount of computing power in a small footprint. This is particularly beneficial for businesses with limited space, as they can host more servers within the same physical environment. The blade is optimized for virtualization, allowing it to handle multiple workloads simultaneously, which translates to cost savings and better resource utilization.

The server is powered by advanced Intel Xeon processors, ensuring efficient processing capabilities for demanding applications. The HP xw2x220c Blade supports multiple CPU options, allowing organizations to select the configuration that best meets their workload requirements. Leveraging Intel's latest technologies, it offers enhanced performance while maintaining energy efficiency, which is a critical consideration in today’s environmentally conscious technological landscape.

In terms of memory, the xw2x220c Blade supports high-capacity DDR4 RAM, which enhances data access speeds and ensures smooth operation even during heavy loads. The architecture of the blade also includes advanced cooling technology that optimizes airflow to maintain optimal temperatures, thereby prolonging hardware lifespan and reliability.

Network connectivity is a vital feature, and the HP xw2x220c Blade offers multiple Ethernet ports for flexible networking options, as well as support for fibre channel connections. This enables seamless integration into existing network configurations, ensuring high-speed data transfer rates that are crucial for real-time applications.

Security features are also integrated into the HP xw2x220c Blade, including options for secure boot, system integrity verification, and advanced encryption capabilities. These attributes protect sensitive data from unauthorized access and potential breaches, which is essential for organizations dealing with confidential information.

In conclusion, the HP xw2x220c Blade is a formidable choice for businesses seeking a compact, powerful, and efficient computing solution. Its combination of advanced processing capabilities, extensive memory support, flexible networking options, and robust security features makes it well-suited for a variety of applications, making it an essential component for modern data centers.
Top Page Image Contents