HP xw2x220c Blade manual Environmental requirements, Environmental elements, Humidity level

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Environmental requirements

Environmental elements

The following environmental elements can affect HP BladeSystem c-Class product installation.

Humidity level

Maintaining proper humidity levels in the computer room is essential for reliable equipment performance. Humidity levels outside the recommended range of 25 to 45 percent, especially if these levels are sustained, lead to equipment damage and result in equipment malfunction through several mechanisms.

High humidity levels enable galvanic activity to occur between dissimilar metals. Galvanic activity can cause high resistance to develop between connections and lead to equipment malfunctions and failures. Extended periods of humidity levels greater than 60% have also been shown to adversely affect modern printed circuit board reliability. High humidity can also adversely affect some magnetic tapes and paper media.

High humidity levels are often the result of malfunctioning facility air conditioning systems. High humidity can also be the result of facility expansion in excess of air conditioning system capacity.

Humidity levels below the minimum recommended value can also have undesirable effects. Low humidity contributes to high ESD voltage potentials. ESD events can cause component damage during service operations and equipment malfunction or damage during normal operation. Low humidity levels can reduce the effectiveness of static dissipating materials and have also been shown to cause high speed printer paper feed problems.

Low humidity levels are often the result of the facility heating system and occur during the cold season. Most heating systems cause air to have a low humidity level, unless the system has a built-in humidifier.

ASHRAE and representatives of IT equipment manufacturers recommend a range of 18°C dry bulb with a 5.5°C dew point temperature to 27°C dry bulb with a 5.5°C dew point temperature. Over this range of dry bulb temperature with a 5.5°C dew point, the relative humidity varies from approximately 25% to 45%.

For more information on humidity levels, see the ASHRAE website (http://www.ashrae.org/).

Dust and pollution

Dust and microscopic particles in the site environment adversely affect computer equipment. Airborne abrasive particles can cause bearing failures in disk drives, tape drives, and other mechanical devices. Dust may also blanket electronic components and printed circuit boards, causing premature failure because of excess heat, humidity buildup, or both.

Conductive metallic particles can cause power supply and other electronic component failures. A build-up of these metallic particles over time can cause short circuits on the densely packed circuit boards common in modern electronics. Use every effort to ensure that the environment is as dust- and particulate-free as possible. See "Metallic particulate contamination (on page 16)."

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Contents HP BladeSystem c-Class Site Planning Guide Intended audience Contents Conversion factors and formulas Technical support Introduction About this documentRelated documentation General site preparation guidelines Ashrae guidelines for site planningHP site planning assistance Computer room preparation Site planning considerationsPage Basic air distribution systems Air conditioning system specificationsAir conditioning ducts Cabling requirementsFloor loading Raised floor loadingAverage floor loading Fire suppression Computer room safetyInstallation and maintenance precautions Fire protectionLighting requirements for equipment servicing Working space for component accessDust and pollution Environmental requirementsEnvironmental elements Humidity levelMetallic particulate contamination Electrostatic discharge prevention Acoustic noise specificationAshrae Recommended operating environmentHP Rack Airflow Optimization Kit Airflow requirementsSpace requirements Blanking panelsDelivery space requirements Operational space requirementsEquipment clearance and floor loading Floor plan grid HP BladeSystem enclosure environmental specifications Rack and accessory footprintsFront door clearance Environmental requirements Environmental requirements Best practices for deployment in rows Third-party racks Rack placement and arrangement for proper airflowRack tie-down option kit Power requirements and considerations Power requirementsElectrical factors Power consumption Electrical load requirements circuit breaker sizing Power system protection Power qualityPower considerations Factors affecting power qualityPower redundancy Power optionsLine voltage selection Non-redundant powerWire selection Distribution hardwareBuilding distribution Grounding requirementsGrounding systems Raceway systems electrical conduits LahjDual power source grounding Power distribution safety grounding LahjPower panel ground Computer safety groundRaised floor high-frequency noise grounding Cabinet performance grounding high frequency groundSystem installation guidelines Wiring connectionsEquipment grounding implementation details Data communications cables Power configurationDynamic Power Capping HP BladeSystem enclosure single-phase power configurationPower requirements and considerations Power requirements and considerations Power requirements and considerations C7000 PDU example PDU installationC3000 PDU example HP BladeSystem c7000 Enclosure three-phase AC configuration HP BladeSystem c7000 Enclosure DC configuration HP BladeSystem enclosure DC power configurationPower supply specifications Single-phase HP 2250W Power Supply specificationHP BladeSystem c3000 Enclosure DC configuation Specification Value Specification Value DC power supply specification HP BladeSystem c3000 Enclosure specifications Hardware specifications and requirementsEnclosure specifications HP BladeSystem c7000 Enclosure specificationsRack requirements HP 10000 G2 rack specificationsRack-free environment requirements Example typical configuration Configuration scenariosExample configurations Example minimum configurationExample maximum configuration Estimating power and cooling Estimating total weight Preparing for installation Preparing for installation Additional rack considerations General component placement guidelinesRack configuration software Sample checklists Sample installation scheduleIs there a completed floor plan? Delivery survey Page Conversion factors and formulas Conversion factorsFormulas Technical support Before you contact HPHP contact information Acronyms and abbreviations UPS Glossary Apparent powerKVA Index Site planning assistance from HP

xw2x220c Blade specifications

The HP xw2x220c Blade is designed for organizations that require a high-performance, space-efficient computing solution. This blade server epitomizes the commitment to enhancing data center efficiency and maximizing computing power without compromising on reliability.

One of the standout features of the HP xw2x220c Blade is its compact form factor, which enables organizations to fit a substantial amount of computing power in a small footprint. This is particularly beneficial for businesses with limited space, as they can host more servers within the same physical environment. The blade is optimized for virtualization, allowing it to handle multiple workloads simultaneously, which translates to cost savings and better resource utilization.

The server is powered by advanced Intel Xeon processors, ensuring efficient processing capabilities for demanding applications. The HP xw2x220c Blade supports multiple CPU options, allowing organizations to select the configuration that best meets their workload requirements. Leveraging Intel's latest technologies, it offers enhanced performance while maintaining energy efficiency, which is a critical consideration in today’s environmentally conscious technological landscape.

In terms of memory, the xw2x220c Blade supports high-capacity DDR4 RAM, which enhances data access speeds and ensures smooth operation even during heavy loads. The architecture of the blade also includes advanced cooling technology that optimizes airflow to maintain optimal temperatures, thereby prolonging hardware lifespan and reliability.

Network connectivity is a vital feature, and the HP xw2x220c Blade offers multiple Ethernet ports for flexible networking options, as well as support for fibre channel connections. This enables seamless integration into existing network configurations, ensuring high-speed data transfer rates that are crucial for real-time applications.

Security features are also integrated into the HP xw2x220c Blade, including options for secure boot, system integrity verification, and advanced encryption capabilities. These attributes protect sensitive data from unauthorized access and potential breaches, which is essential for organizations dealing with confidential information.

In conclusion, the HP xw2x220c Blade is a formidable choice for businesses seeking a compact, powerful, and efficient computing solution. Its combination of advanced processing capabilities, extensive memory support, flexible networking options, and robust security features makes it well-suited for a variety of applications, making it an essential component for modern data centers.
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