HP xw2x220c Blade manual Site planning considerations, Computer room preparation

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data center. HP Services professionals recommend changes to optimize climatic conditions and reclaim capacity, postponing or even eliminating the need for costly mechanical upgrades. Choose from three service levels to meet your specific requirements.

HP Datacenter Site Planning Service—Obtain a comprehensive site-preparation audit to help you successfully integrate new equipment into your facility. Service deliverables include verification of installation and service space, examination of the capacity and availability of your power distribution system, analysis of cooling system capacity and airflow distribution, and a review of installation readiness prerequisites. An in-depth report identifies any deficiencies and provides floor- plan drawings locating equipment, receptacles, airflow panels, and cable cut-outs.

For more information, see the HP website (http://h20219.www2.hp.com/services/cache/114078-0-0-225-121.aspx).

Site planning considerations

Customer facility managers and system administrators must discuss site planning, preparation, and system installation before system delivery. A common understanding of environmental requirements and how the systems will be delivered, configured, installed, and maintained helps to create a suitable data center and aids the successful installation of the servers and related equipment.

It is important to plan the facility as a whole, not design based on calculations of individual system or rack level requirements. Too many interdependencies in a modern data center make such simple calculations unreliable. Designs and plans must be made for the data center as a whole, including all of its equipment, with the realization that making one change in the data center environment can affect many other physical, mechanical, and environmental aspects of the facility.

Take into account the requirements of third-party equipment and support equipment in the room. Dense computing locations might have high power and cooling demands that could affect power and environmental constraints. Be aware of rack positioning and airflow patterns. Ensure that the raised floor space, cooling equipment, power supply equipment and generators, and other support equipment meet the demands of all the servers and other mission-critical equipment.

Computer room preparation

Observe the following guidelines when preparing a computer room for product installation:

Locate the computer room away from the exterior walls of the building to avoid the heat gain from windows and exterior wall surfaces.

When exterior windows are unavoidable, use windows that are double- or triple-glazed and shaded to prevent direct sunlight from entering the computer room.

Maintain the computer room at a positive pressure relative to surrounding spaces.

Use a vapor barrier installed around the entire computer room envelope to restrain moisture migration.

Caulk and vapor seal all pipe, conduit, and cable computer room entry and exit points.

In underfloor distribution installations, install at least a 610 mm (24 in) raised floor system for optimum room air distribution.

Ensure a minimum clearance of 457 mm (18 in) between the top of the rack and the ceiling to allow for return airflow.

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Contents HP BladeSystem c-Class Site Planning Guide Intended audience Contents Conversion factors and formulas Technical support Related documentation IntroductionAbout this document HP site planning assistance General site preparation guidelinesAshrae guidelines for site planning Site planning considerations Computer room preparationPage Air conditioning system specifications Basic air distribution systemsCabling requirements Air conditioning ductsAverage floor loading Floor loadingRaised floor loading Computer room safety Installation and maintenance precautionsFire protection Fire suppressionWorking space for component access Lighting requirements for equipment servicingEnvironmental requirements Environmental elementsHumidity level Dust and pollutionMetallic particulate contamination Acoustic noise specification Electrostatic discharge preventionRecommended operating environment AshraeAirflow requirements Space requirementsBlanking panels HP Rack Airflow Optimization KitEquipment clearance and floor loading Delivery space requirementsOperational space requirements Floor plan grid Rack and accessory footprints HP BladeSystem enclosure environmental specificationsFront door clearance Environmental requirements Environmental requirements Best practices for deployment in rows Rack placement and arrangement for proper airflow Third-party racksRack tie-down option kit Electrical factors Power requirements and considerationsPower requirements Power consumption Electrical load requirements circuit breaker sizing Power quality Power considerationsFactors affecting power quality Power system protectionPower options Power redundancyNon-redundant power Wire selectionDistribution hardware Line voltage selectionGrounding requirements Grounding systemsRaceway systems electrical conduits Lahj Building distributionPower distribution safety grounding Lahj Power panel groundComputer safety ground Dual power source groundingCabinet performance grounding high frequency ground Raised floor high-frequency noise groundingEquipment grounding implementation details System installation guidelinesWiring connections Power configuration Dynamic Power CappingHP BladeSystem enclosure single-phase power configuration Data communications cablesPower requirements and considerations Power requirements and considerations Power requirements and considerations PDU installation C7000 PDU exampleC3000 PDU example HP BladeSystem c7000 Enclosure three-phase AC configuration HP BladeSystem enclosure DC power configuration HP BladeSystem c7000 Enclosure DC configurationHP BladeSystem c3000 Enclosure DC configuation Power supply specificationsSingle-phase HP 2250W Power Supply specification Specification Value Specification Value DC power supply specification Hardware specifications and requirements Enclosure specificationsHP BladeSystem c7000 Enclosure specifications HP BladeSystem c3000 Enclosure specificationsHP 10000 G2 rack specifications Rack requirementsRack-free environment requirements Configuration scenarios Example configurationsExample minimum configuration Example typical configurationExample maximum configuration Estimating power and cooling Estimating total weight Preparing for installation Preparing for installation General component placement guidelines Additional rack considerationsRack configuration software Sample installation schedule Sample checklistsIs there a completed floor plan? Delivery survey Page Formulas Conversion factors and formulasConversion factors HP contact information Technical supportBefore you contact HP Acronyms and abbreviations UPS Apparent power GlossaryKVA Index Site planning assistance from HP

xw2x220c Blade specifications

The HP xw2x220c Blade is designed for organizations that require a high-performance, space-efficient computing solution. This blade server epitomizes the commitment to enhancing data center efficiency and maximizing computing power without compromising on reliability.

One of the standout features of the HP xw2x220c Blade is its compact form factor, which enables organizations to fit a substantial amount of computing power in a small footprint. This is particularly beneficial for businesses with limited space, as they can host more servers within the same physical environment. The blade is optimized for virtualization, allowing it to handle multiple workloads simultaneously, which translates to cost savings and better resource utilization.

The server is powered by advanced Intel Xeon processors, ensuring efficient processing capabilities for demanding applications. The HP xw2x220c Blade supports multiple CPU options, allowing organizations to select the configuration that best meets their workload requirements. Leveraging Intel's latest technologies, it offers enhanced performance while maintaining energy efficiency, which is a critical consideration in today’s environmentally conscious technological landscape.

In terms of memory, the xw2x220c Blade supports high-capacity DDR4 RAM, which enhances data access speeds and ensures smooth operation even during heavy loads. The architecture of the blade also includes advanced cooling technology that optimizes airflow to maintain optimal temperatures, thereby prolonging hardware lifespan and reliability.

Network connectivity is a vital feature, and the HP xw2x220c Blade offers multiple Ethernet ports for flexible networking options, as well as support for fibre channel connections. This enables seamless integration into existing network configurations, ensuring high-speed data transfer rates that are crucial for real-time applications.

Security features are also integrated into the HP xw2x220c Blade, including options for secure boot, system integrity verification, and advanced encryption capabilities. These attributes protect sensitive data from unauthorized access and potential breaches, which is essential for organizations dealing with confidential information.

In conclusion, the HP xw2x220c Blade is a formidable choice for businesses seeking a compact, powerful, and efficient computing solution. Its combination of advanced processing capabilities, extensive memory support, flexible networking options, and robust security features makes it well-suited for a variety of applications, making it an essential component for modern data centers.